JPH02129728U - - Google Patents
Info
- Publication number
- JPH02129728U JPH02129728U JP3890889U JP3890889U JPH02129728U JP H02129728 U JPH02129728 U JP H02129728U JP 3890889 U JP3890889 U JP 3890889U JP 3890889 U JP3890889 U JP 3890889U JP H02129728 U JPH02129728 U JP H02129728U
- Authority
- JP
- Japan
- Prior art keywords
- polishing machine
- polishing
- speed
- automatic
- automatic polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 9
- 239000003082 abrasive agent Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 1
Description
第１図はこの考案に関する自動研磨機の側面図
である。第２図、第３図は第１図の研磨機におけ
る異なる実施例の時間対回転数の関係図である。
第４図は従来の自動研磨機の側面図である。第５
図は第４図の研磨機の時間対回転数の関係図であ
る。
２……研磨板、３……モーター、５……サンプ
ル貼り付け台、６……測定用サンプル、１０……
速度可変手段。
FIG. 1 is a side view of an automatic polishing machine related to this invention. FIGS. 2 and 3 are diagrams showing the relationship between time and rotation speed for different embodiments of the polishing machine shown in FIG. 1.
FIG. 4 is a side view of a conventional automatic polishing machine. Fifth
The figure is a diagram showing the relationship between time and rotational speed of the polishing machine shown in FIG. 4. 2... Polishing plate, 3... Motor, 5... Sample pasting stand, 6... Sample for measurement, 10...
Speed variable means.
Claims (1)
ハ表面の研磨を行う自動研磨機において、 回転速度を自動的に調節する速度可変手段を有
することを特徴とする回転速度可変装置付き自動
研磨機。[Claims for Utility Model Registration] An automatic polishing machine for polishing the surface of a wafer by rotating a polishing plate coated with an abrasive material, characterized in that it has a speed variable means for automatically adjusting the rotation speed. Automatic polishing machine with variable device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3890889U JPH02129728U (en) | 1989-03-31 | 1989-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3890889U JPH02129728U (en) | 1989-03-31 | 1989-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02129728U true JPH02129728U (en) | 1990-10-25 |
Family
ID=31547336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3890889U Pending JPH02129728U (en) | 1989-03-31 | 1989-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02129728U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03261843A (en) * | 1990-03-12 | 1991-11-21 | Shimadzu Corp | Method for polishing specimen to be analyzed |
| JPH04348028A (en) * | 1991-05-24 | 1992-12-03 | Kyushu Electron Metal Co Ltd | Inclined polishing method for semiconductor samples |
| JPH05160088A (en) * | 1991-12-05 | 1993-06-25 | Fujitsu Ltd | Semiconductor substrate manufacturing method and device |
-
1989
- 1989-03-31 JP JP3890889U patent/JPH02129728U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03261843A (en) * | 1990-03-12 | 1991-11-21 | Shimadzu Corp | Method for polishing specimen to be analyzed |
| JPH04348028A (en) * | 1991-05-24 | 1992-12-03 | Kyushu Electron Metal Co Ltd | Inclined polishing method for semiconductor samples |
| JPH05160088A (en) * | 1991-12-05 | 1993-06-25 | Fujitsu Ltd | Semiconductor substrate manufacturing method and device |