JPH02132945U - - Google Patents
Info
- Publication number
- JPH02132945U JPH02132945U JP4270189U JP4270189U JPH02132945U JP H02132945 U JPH02132945 U JP H02132945U JP 4270189 U JP4270189 U JP 4270189U JP 4270189 U JP4270189 U JP 4270189U JP H02132945 U JPH02132945 U JP H02132945U
- Authority
- JP
- Japan
- Prior art keywords
- block
- semiconductor device
- insertion hole
- spacer block
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 125000006850 spacer group Chemical group 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案に係る半導体装置の樹脂封止装
置における下側の型板を示す断面図、第２図は他
の実施例を示す断面図、第３図は従来の半導体装
置の樹脂封止装置における下側の型板を示す断面
図である。
１……ヒータブロツクブ、３……ベース、４…
…サポートピン、５……挿通孔、６……チエイス
ブロツク、１１……スペーサブロツク、１２……
段付ボルト、１６……ボルト、ｇ……間隙、なお
、各図中同一符号は同一又は相当部分を示す。
FIG. 1 is a sectional view showing a lower template in a resin sealing device for a semiconductor device according to the present invention, FIG. 2 is a sectional view showing another embodiment, and FIG. 3 is a conventional resin sealing device for a semiconductor device. FIG. 3 is a sectional view showing a lower template in the locking device. 1... Heater block, 3... Base, 4...
...Support pin, 5...Insertion hole, 6...Chase block, 11...Spacer block, 12...
Step bolt, 16...bolt, g...gap, and the same reference numerals in each figure indicate the same or equivalent parts.
Claims (1)
れ加圧方向に開口する挿通孔を有するチエイスブ
ロツク保持用のヒータブロツクと、このヒータブ
ロツクと前記ベースとの間に設けられ前記サポー
トピンの外側に位置するスペーサブロツクと、こ
のスペーサブロツクに螺着され前記挿通孔を挿通
する位置決め用のボルトとを備え、前記ヒータブ
ロツクと前記スペーサブロツクとの間に間隙を設
けた金型において、ベースとサポートピンをボル
トで固定したことを特徴とする半導体装置の樹脂
封止装置。 A heater block for holding a chase block, which is provided on a base via a number of support pins and has an insertion hole that opens in the pressurizing direction; In the mold, the mold includes a spacer block and a positioning bolt screwed onto the spacer block and inserted through the insertion hole, and a gap is provided between the heater block and the spacer block. A resin sealing device for a semiconductor device, characterized in that a semiconductor device is fixed with a bolt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4270189U JPH02132945U (en) | 1989-04-11 | 1989-04-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4270189U JPH02132945U (en) | 1989-04-11 | 1989-04-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02132945U true JPH02132945U (en) | 1990-11-05 |
Family
ID=31554474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4270189U Pending JPH02132945U (en) | 1989-04-11 | 1989-04-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02132945U (en) |
-
1989
- 1989-04-11 JP JP4270189U patent/JPH02132945U/ja active Pending
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