JPH02136338U - - Google Patents
Info
- Publication number
- JPH02136338U JPH02136338U JP1989044756U JP4475689U JPH02136338U JP H02136338 U JPH02136338 U JP H02136338U JP 1989044756 U JP1989044756 U JP 1989044756U JP 4475689 U JP4475689 U JP 4475689U JP H02136338 U JPH02136338 U JP H02136338U
- Authority
- JP
- Japan
- Prior art keywords
- external connection
- connection leads
- package
- semiconductor device
- protruding portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図と第２図ａ，ｂは夫々本考案を説明する
為の断面図、裏面図及び側面図、第３図は他の実
施例を示す断面図、第４図は従来例を説明する為
の断面図である。
為の断面図、裏面図及び側面図、第３図は他の実
施例を示す断面図、第４図は従来例を説明する為
の断面図である。
Claims (1)
- 【実用新案登録請求の範囲】 (1) 基板実装面側となるパツケージ下面に突出
部を設け、外部接続リードを前記パツケージ下面
から導出すると共に、前記突出部の形状に合致す
るように前記外部接続リードを外側へ折り曲げた
ことを特徴とする表面実装型半導体装置。 (2) 前記突出部は、前記外部接続リードに対し
て夫々に設けられたことを特徴とする請求項第１
項に記載の表面実装型半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989044756U JPH02136338U (ja) | 1989-04-17 | 1989-04-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989044756U JPH02136338U (ja) | 1989-04-17 | 1989-04-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02136338U true JPH02136338U (ja) | 1990-11-14 |
Family
ID=31558335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989044756U Pending JPH02136338U (ja) | 1989-04-17 | 1989-04-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02136338U (ja) |
-
1989
- 1989-04-17 JP JP1989044756U patent/JPH02136338U/ja active Pending