JPH0213748U - - Google Patents
Info
- Publication number
- JPH0213748U JPH0213748U JP9219688U JP9219688U JPH0213748U JP H0213748 U JPH0213748 U JP H0213748U JP 9219688 U JP9219688 U JP 9219688U JP 9219688 U JP9219688 U JP 9219688U JP H0213748 U JPH0213748 U JP H0213748U
- Authority
- JP
- Japan
- Prior art keywords
- terminals
- hic
- row
- shall
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Multi-Conductor Connections (AREA)
Description
第１図は本考案の一実施例のＨＩＣの斜視図、
第２図はＨＩＣとの間隙を小さくする場合に使用
する印刷配線板にＨＩＣを接続した状態を示す側
面図、第３図はＨＩＣとの間隙を大きくする場合
に使用する印刷配線板にＨＩＣを接続した状態を
示す側面図、第４図は従来のＨＩＣの斜視図、第
５図は従来のＨＩＣを印刷配線板に接続した状態
を示す側面図である。
１，１１：端子、２，１２：ＨＩＣ本体、３，
３１：スルーホール、４，１４，２４：印刷配線
板。
FIG. 1 is a perspective view of an HIC according to an embodiment of the present invention;
Figure 2 is a side view showing the HIC connected to a printed wiring board used to reduce the gap with the HIC, and Figure 3 is a side view showing the HIC connected to the printed wiring board used to increase the gap with the HIC. FIG. 4 is a perspective view of a conventional HIC, and FIG. 5 is a side view showing a conventional HIC connected to a printed wiring board. 1, 11: Terminal, 2, 12: HIC body, 3,
31: Through hole, 4, 14, 24: Printed wiring board.
Claims (1)
に配し、該端子を印刷配線板の取付座に形成され
たスルーホールに挿通して実装するＨＩＣにおい
て、 上記各端子の列のうち、両端近傍の少なくとも
２本の端子の径を先端側より段階的に太く形成し
、 他の端子は、上記両端近傍の端子の先端部と同
等の太さに形成したことを特徴とするＨＩＣの端
子構造。[Claims for Utility Model Registration] In an HIC that is mounted by arranging a plurality of terminals in a row on each side of the HIC main body and inserting the terminals into through holes formed in the mounting seat of the printed wiring board, the above-mentioned In each row of terminals, the diameter of at least two terminals near both ends shall be made gradually thicker from the tip side, and the other terminals shall be formed to have the same thickness as the tips of the terminals near both ends. The terminal structure of HIC is characterized by
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9219688U JPH0213748U (en) | 1988-07-12 | 1988-07-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9219688U JPH0213748U (en) | 1988-07-12 | 1988-07-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0213748U true JPH0213748U (en) | 1990-01-29 |
Family
ID=31316650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9219688U Pending JPH0213748U (en) | 1988-07-12 | 1988-07-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0213748U (en) |
-
1988
- 1988-07-12 JP JP9219688U patent/JPH0213748U/ja active Pending