JPH02138087U - - Google Patents
Info
- Publication number
- JPH02138087U JPH02138087U JP1989047102U JP4710289U JPH02138087U JP H02138087 U JPH02138087 U JP H02138087U JP 1989047102 U JP1989047102 U JP 1989047102U JP 4710289 U JP4710289 U JP 4710289U JP H02138087 U JPH02138087 U JP H02138087U
- Authority
- JP
- Japan
- Prior art keywords
- galvanometer
- condensing lens
- sealed structure
- beam expander
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 1
Description
第１図ａ，ｂは、それぞれ本考案の第１の実施
例の光学系概略図と制御系ブロツク図、第２図は
本考案の第２の実施例の光学系概略図である。
１……加工用レーザ装置、３……ビームエキス
パンダ、４ａ，４ｂ……ガルバノメータ、５……
集光レンズ、６……ダイクロイツクミラー、８…
…温度センサ、９……ヒータ、１０……マウント
、１１……駆動部、１５……温度制御器、１６…
…冷熱素子。
1A and 1B are a schematic diagram of an optical system and a control system block diagram of a first embodiment of the present invention, respectively, and FIG. 2 is a schematic diagram of an optical system of a second embodiment of the present invention. 1... Laser device for processing, 3... Beam expander, 4a, 4b... Galvanometer, 5...
Condensing lens, 6... Dichroic mirror, 8...
...Temperature sensor, 9...Heater, 10...Mount, 11...Driver, 15...Temperature controller, 16...
...cooling element.
Claims (1)
ガルバノメータを使用した２次元走査型ビームポ
ジシヨナと、集光レンズと、光軸を変換するダイ
クロイツクミラーとを有するレーザ加工装置にお
いて、前記ビームエキスパンダと、ガルバノメー
タと、集光レンズを含む密閉構造と、この密閉構
造の内部に取り付けて用いる感温素子および温度
駆動素子と、温度制御器とを具備することを特徴
とするレーザ加工装置。 A processing laser device, a beam expander,
A laser processing apparatus having a two-dimensional scanning beam positioner using a galvanometer, a condensing lens, and a dichroic mirror for converting an optical axis, including a sealed structure including the beam expander, the galvanometer, and the condensing lens; A laser processing device characterized by comprising a temperature sensing element and a temperature driving element used by being attached inside the sealed structure, and a temperature controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989047102U JPH02138087U (en) | 1989-04-20 | 1989-04-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989047102U JPH02138087U (en) | 1989-04-20 | 1989-04-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02138087U true JPH02138087U (en) | 1990-11-19 |
Family
ID=31562743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989047102U Pending JPH02138087U (en) | 1989-04-20 | 1989-04-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02138087U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002316277A (en) * | 2001-04-20 | 2002-10-29 | Sunx Ltd | Laser marking apparatus |
| JP2014054671A (en) * | 2007-06-25 | 2014-03-27 | Electro Scientific Industries Inc | System and method for adapting parameter so as to enhance throughput during wafer processing of laser base |
| JP2017196639A (en) * | 2016-04-27 | 2017-11-02 | ビアメカニクス株式会社 | Laser processing apparatus and laser processing method |
-
1989
- 1989-04-20 JP JP1989047102U patent/JPH02138087U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002316277A (en) * | 2001-04-20 | 2002-10-29 | Sunx Ltd | Laser marking apparatus |
| JP2014054671A (en) * | 2007-06-25 | 2014-03-27 | Electro Scientific Industries Inc | System and method for adapting parameter so as to enhance throughput during wafer processing of laser base |
| JP2017196639A (en) * | 2016-04-27 | 2017-11-02 | ビアメカニクス株式会社 | Laser processing apparatus and laser processing method |