JPH02138430U - - Google Patents

Info

Publication number
JPH02138430U
JPH02138430U JP1989046947U JP4694789U JPH02138430U JP H02138430 U JPH02138430 U JP H02138430U JP 1989046947 U JP1989046947 U JP 1989046947U JP 4694789 U JP4694789 U JP 4694789U JP H02138430 U JPH02138430 U JP H02138430U
Authority
JP
Japan
Prior art keywords
holder
transfer element
transfer
vertical shaft
pivoted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989046947U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989046947U priority Critical patent/JPH02138430U/ja
Publication of JPH02138430U publication Critical patent/JPH02138430U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

図は本考案の実施例を示すももであつて、第１
図は転写ピンの斜視図、第２図はボンド塗布中の
正面図、第３図はボンド塗布中の側面図、第４図
ａ，ｂ，ｃは従来の転写ピンの斜視図、及び転写
中と転写後の基板の正面図である。 １……転写ピン、２……垂直軸部、３……保持
体、４……転写子、５……凹入部、６……ヒンジ
部。 The figure shows an embodiment of the present invention.
The figure is a perspective view of the transfer pin, Figure 2 is a front view during bond application, Figure 3 is a side view during bond application, and Figures 4a, b, and c are perspective views of a conventional transfer pin and during transfer. FIG. 3 is a front view of the substrate after the transfer. DESCRIPTION OF SYMBOLS 1... Transfer pin, 2... Vertical shaft part, 3... Holding body, 4... Transfer element, 5... Recessed part, 6... Hinge part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 垂直軸部の下端部に保持体を設け、この保持体
の下部に形成された凹入部に長形の転写子を装入
し、この転写子をこの保持体に設けられたヒンジ
部に回転自在に軸着したことを特徴とするボンド
塗布用転写ピン。 A holder is provided at the lower end of the vertical shaft, a long transfer element is inserted into a recess formed in the lower part of the holder, and the transfer element is rotatably attached to a hinge provided on the holder. A transfer pin for bond application, which is characterized by being pivoted on.
JP1989046947U 1989-04-20 1989-04-20 Pending JPH02138430U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989046947U JPH02138430U (en) 1989-04-20 1989-04-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989046947U JPH02138430U (en) 1989-04-20 1989-04-20

Publications (1)

Publication Number Publication Date
JPH02138430U true JPH02138430U (en) 1990-11-19

Family

ID=31562457

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989046947U Pending JPH02138430U (en) 1989-04-20 1989-04-20

Country Status (1)

Country Link
JP (1) JPH02138430U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04105537U (en) * 1991-02-19 1992-09-10 三菱電機株式会社 die bonding equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04105537U (en) * 1991-02-19 1992-09-10 三菱電機株式会社 die bonding equipment

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