JPH02142013U - - Google Patents
Info
- Publication number
- JPH02142013U JPH02142013U JP5118689U JP5118689U JPH02142013U JP H02142013 U JPH02142013 U JP H02142013U JP 5118689 U JP5118689 U JP 5118689U JP 5118689 U JP5118689 U JP 5118689U JP H02142013 U JPH02142013 U JP H02142013U
- Authority
- JP
- Japan
- Prior art keywords
- plate
- mounting plate
- mounting
- die
- template
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 238000001746 injection moulding Methods 0.000 claims description 4
- 230000005291 magnetic effect Effects 0.000 claims description 2
- 239000003302 ferromagnetic material Substances 0.000 claims 2
- 239000002889 diamagnetic material Substances 0.000 claims 1
- 239000000696 magnetic material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000001179 sorption measurement Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
第１図はこの考案の射出成形用金型の取付け構
造の一実施例のうち、射出成形用金型の可動側部
分と射出成形機の可動盤とを示す一部切り欠き斜
視図、第２図は上記実施例における受板の可動盤
への取付け構造を示す断面図、第３図は射出成形
用金型の可動側部分の変型例を示す斜視図、第４
図ａ〜ｄは、それぞれ、上記実施例における射出
成形用金型取付け時の各工程を示す正面図、第５
図は従来の金型取付け金具を示す正面図である。
１……ダイプレート（可動盤）、２……射出成
形用金型、２１，２１′……可動側型板、２５，
２５′……固定側型板、２３，２６……磁気シー
ルド板、２４，２７……取付け板、３，３′……
電磁石装置、４，４′……受板、５……ダイプレ
ート（固定盤）。
FIG. 1 is a partially cutaway perspective view showing the movable side portion of the injection mold and the movable platen of the injection molding machine in an embodiment of the injection mold mounting structure of this invention; The figures are a cross-sectional view showing the mounting structure of the receiving plate to the movable platen in the above embodiment, FIG. 3 is a perspective view showing a modification of the movable side portion of the injection mold, and FIG.
Figures a to d are a front view and a fifth figure showing each process when installing an injection mold in the above embodiment, respectively.
The figure is a front view showing a conventional mold mounting fitting. 1... Die plate (movable plate), 2... Injection mold, 21, 21'... Movable side template, 25,
25'... Fixed side template, 23, 26... Magnetic shield plate, 24, 27... Mounting plate, 3, 3'...
Electromagnetic device, 4, 4'...Socket plate, 5...Die plate (fixed plate).
Claims (1)
を介して強磁性材料からなる取付け板を取付け、
射出成形機のダイプレートには、上記取付け板を
吸着する電磁石装置と、取付け板を下方から支持
する受板とを設け、取付け板を受板によつて支持
しつつ、電磁石装置によつてダイプレートに吸着
させていることを特徴とする射出成形用金型の取
付け構造。 ２ 射出成形用金型の型板を反磁性材料または弱
磁性材料で形成し、この型板に強磁性材料からな
る取付け板を取付け、射出成形機のダイプレート
には、上記取付け板を吸着する電磁石装置と、取
付け板を下方から支持する受板とを設け、取付け
板を受板によつて支持しつつ、電磁石装置によつ
てダイプレートに吸着させていることを特徴とす
る射出成形用金型の取付け構造。[Claims for Utility Model Registration] 1. A mounting plate made of ferromagnetic material is attached to the template of an injection mold through a magnetic shield plate,
The die plate of the injection molding machine is equipped with an electromagnetic device that attracts the mounting plate, and a receiving plate that supports the mounting plate from below, and while the mounting plate is supported by the receiving plate, the die is An injection mold mounting structure characterized by adsorption to a plate. 2. A template for an injection mold is formed of a diamagnetic material or a weakly magnetic material, a mounting plate made of a ferromagnetic material is attached to this template, and the mounting plate is attracted to the die plate of the injection molding machine. An injection molding metal comprising an electromagnet device and a receiving plate that supports the mounting plate from below, and the mounting plate is supported by the receiving plate and is attracted to the die plate by the electromagnet device. Mold mounting structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5118689U JPH02142013U (en) | 1989-04-28 | 1989-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5118689U JPH02142013U (en) | 1989-04-28 | 1989-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02142013U true JPH02142013U (en) | 1990-11-30 |
Family
ID=31570392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5118689U Pending JPH02142013U (en) | 1989-04-28 | 1989-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02142013U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009028129A1 (en) * | 2007-08-31 | 2009-03-05 | Pascal Engineering Corporation | Injection molding machine |
-
1989
- 1989-04-28 JP JP5118689U patent/JPH02142013U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009028129A1 (en) * | 2007-08-31 | 2009-03-05 | Pascal Engineering Corporation | Injection molding machine |
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