JPH02146820U - - Google Patents
Info
- Publication number
- JPH02146820U JPH02146820U JP5509889U JP5509889U JPH02146820U JP H02146820 U JPH02146820 U JP H02146820U JP 5509889 U JP5509889 U JP 5509889U JP 5509889 U JP5509889 U JP 5509889U JP H02146820 U JPH02146820 U JP H02146820U
- Authority
- JP
- Japan
- Prior art keywords
- external
- electrode
- external electrode
- terminal
- ceramic dielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000003985 ceramic capacitor Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
Description
第１図は本考案にかかるチツプ形セラミツクコ
デンサの一実施例を示す断面図、第２図は同絶縁
塗装前の斜視図、第３図ａ〜ｄは同製造工程を示
す図、第４図は円板形セラミツクコンデサを一部
を切欠いて示す上面図、第５図は本考案者らが先
に提案したチツプ形セラミツクコンデンサを示す
断面図である。
１１……セラミツク誘電体、１２，１３……外
部電極、１４，１５……金属キヤツプからなる端
子電極、１６……絶縁樹脂、１７……樹脂溜り溝
。
FIG. 1 is a sectional view showing an embodiment of the chip-shaped ceramic coder according to the present invention, FIG. 2 is a perspective view of the same before insulating coating, FIGS. 3 a to d are views showing the manufacturing process, and FIG. The figure is a partially cutaway top view of a disc-shaped ceramic capacitor, and FIG. 5 is a cross-sectional view of a chip-shaped ceramic capacitor previously proposed by the present inventors. 11... Ceramic dielectric, 12, 13... External electrode, 14, 15... Terminal electrode made of metal cap, 16... Insulating resin, 17... Resin reservoir groove.
Claims (1)
からなる外部電極を形成し、前記外部電極の上下
の一方にそれぞれ接続されるように金属キヤツプ
からなる半田付け用の端子電極を前記セラミツク
誘電体の両端面に設け、この端子電極部を除いて
全体を絶縁樹脂で外装した構成を具備し、かつ前
記外部電極と端子電極間のギヤツプに半円状の樹
脂溜り溝を設けたことを特徴とするチツプ形セラ
ミツクコンデンサ。 External electrodes made of conductive metal are formed on the upper and lower surfaces of a square plate-shaped ceramic dielectric, and soldering terminal electrodes made of metal caps are attached to the ceramic dielectric so as to be connected to the upper and lower sides of the external electrodes, respectively. The external electrode is provided on both end faces of the external electrode and is entirely covered with insulating resin except for the terminal electrode part, and a semicircular resin reservoir groove is provided in the gap between the external electrode and the terminal electrode. Chip type ceramic capacitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5509889U JPH02146820U (en) | 1989-05-12 | 1989-05-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5509889U JPH02146820U (en) | 1989-05-12 | 1989-05-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146820U true JPH02146820U (en) | 1990-12-13 |
Family
ID=31577750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5509889U Pending JPH02146820U (en) | 1989-05-12 | 1989-05-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146820U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008227101A (en) * | 2007-03-12 | 2008-09-25 | Tdk Corp | Electronic component, method for manufacturing the same, and inverter device |
| JP2008227100A (en) * | 2007-03-12 | 2008-09-25 | Tdk Corp | Electronic component, method for manufacturing the same, and inverter device |
-
1989
- 1989-05-12 JP JP5509889U patent/JPH02146820U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008227101A (en) * | 2007-03-12 | 2008-09-25 | Tdk Corp | Electronic component, method for manufacturing the same, and inverter device |
| JP2008227100A (en) * | 2007-03-12 | 2008-09-25 | Tdk Corp | Electronic component, method for manufacturing the same, and inverter device |