JPH02146845U - - Google Patents
Info
- Publication number
- JPH02146845U JPH02146845U JP5284589U JP5284589U JPH02146845U JP H02146845 U JPH02146845 U JP H02146845U JP 5284589 U JP5284589 U JP 5284589U JP 5284589 U JP5284589 U JP 5284589U JP H02146845 U JPH02146845 U JP H02146845U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- semiconductor device
- thermal conductivity
- derived
- good thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
- 238000001816 cooling Methods 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
第１図はこの考案の半導体装置の一実施例の斜
視図、第２図はこの考案の半導体装置の異なる実
施例の側面図、第３図は半導体装置の従来例の斜
視図、第４図は第１図、第２図、第３図に示した
半導体装置の等価回路図、第５図は第１図、第２
図、第３図に示した半導体装置の接続される駆動
回路の外観模式図である。
１……外囲器、２……冷却ベース、４Ａ，４Ｂ
，４Ｃ……主電極端子、５Ａ，５Ｂ，５Ｃ，５Ｄ
……制御電極端子。
FIG. 1 is a perspective view of one embodiment of the semiconductor device of this invention, FIG. 2 is a side view of a different embodiment of the semiconductor device of this invention, FIG. 3 is a perspective view of a conventional example of the semiconductor device, and FIG. 4 is an equivalent circuit diagram of the semiconductor device shown in FIGS. 1, 2, and 3, and FIG. 5 is an equivalent circuit diagram of the semiconductor device shown in FIGS.
FIG. 4 is a schematic external view of a drive circuit to which the semiconductor device shown in FIGS. 1... Envelope, 2... Cooling base, 4A, 4B
, 4C...Main electrode terminal, 5A, 5B, 5C, 5D
...Control electrode terminal.
Claims (1)
からなる外囲器とで構成される容器内に半導体素
子を１個または複数個内蔵し、該素子からそれぞ
れ前記外囲器の一面を介して前記半導体素子の主
電極端子および異なる機能のものを含む複数の制
御電極端子が導出されてなる半導体装置において
、前記半導体素子から導出される複数の制御電極
端子の外部形状を前記異なる機能の端子間では異
なる形状にしたことを特徴とする半導体装置。 One or more semiconductor elements are housed in a container consisting of a cooling base made of a material with good thermal conductivity and an envelope made of an insulating material, and each of the semiconductor elements is connected to a cooling base made of a material with good thermal conductivity and an envelope made of an insulating material. In a semiconductor device in which a main electrode terminal of the semiconductor element and a plurality of control electrode terminals including those with different functions are derived, the external shape of the plurality of control electrode terminals derived from the semiconductor element is determined between the terminals of the different functions. A semiconductor device characterized by having a different shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5284589U JPH02146845U (en) | 1989-05-08 | 1989-05-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5284589U JPH02146845U (en) | 1989-05-08 | 1989-05-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146845U true JPH02146845U (en) | 1990-12-13 |
Family
ID=31573502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5284589U Pending JPH02146845U (en) | 1989-05-08 | 1989-05-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146845U (en) |
-
1989
- 1989-05-08 JP JP5284589U patent/JPH02146845U/ja active Pending