JPH02146868U - - Google Patents
Info
- Publication number
- JPH02146868U JPH02146868U JP5413289U JP5413289U JPH02146868U JP H02146868 U JPH02146868 U JP H02146868U JP 5413289 U JP5413289 U JP 5413289U JP 5413289 U JP5413289 U JP 5413289U JP H02146868 U JPH02146868 U JP H02146868U
- Authority
- JP
- Japan
- Prior art keywords
- mounting plate
- soldered
- electrode
- electronic component
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000009413 insulation Methods 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案の実装構造の実施例を示す斜
視図、第２図は第１図のＡ−Ａ断面図、第３図イ
はこの考案に使用する取付板の平面図、ロはイの
側断面図、第４図イは取付板の他の例の平面図、
ロはイの側断面図、第５図は従来の実装構造を示
す斜視図である。
Fig. 1 is a perspective view showing an embodiment of the mounting structure of this invention, Fig. 2 is a sectional view taken along the line A-A in Fig. 1, Fig. 3 A is a plan view of the mounting plate used in this invention, and B is an illustration of the mounting structure. Figure 4A is a side sectional view of another example of the mounting plate.
B is a side sectional view of A, and FIG. 5 is a perspective view showing a conventional mounting structure.
Claims (1)
る取付板の両面上に互いに電気的に接続された電
極が形成され、 前記導体ランドに前記取付板の一面上の前記電
極が半田付けされ、 前記取付板の他面上の前記電極に電子部品が半
田付けされることを特徴とする電子部品の実装構
造。[Claims for Utility Model Registration] A conductor land is formed on one surface of an insulating substrate, and electrodes electrically connected to each other are formed on both sides of a mounting plate made of insulation having a lower thermal conductivity than the insulating substrate. A mounting structure for an electronic component, characterized in that the electrode on one surface of the mounting plate is soldered to the conductor land, and the electronic component is soldered to the electrode on the other surface of the mounting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5413289U JPH02146868U (en) | 1989-05-10 | 1989-05-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5413289U JPH02146868U (en) | 1989-05-10 | 1989-05-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146868U true JPH02146868U (en) | 1990-12-13 |
Family
ID=31575924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5413289U Pending JPH02146868U (en) | 1989-05-10 | 1989-05-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146868U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63313477A (en) * | 1987-06-16 | 1988-12-21 | Nec Corp | Electrical connection terminal |
-
1989
- 1989-05-10 JP JP5413289U patent/JPH02146868U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63313477A (en) * | 1987-06-16 | 1988-12-21 | Nec Corp | Electrical connection terminal |