JPH02148545A - Flat type cathode ray tube - Google Patents

Abstract

PURPOSE:To absorb stress to a metal plate produced at the time of an exhaust process or the like and prevent deformation of the metal plate by providing a stress absorbing means to the metal plate. CONSTITUTION:A stress absorbing means is provided to a metal plate 7. That is, a rib 9 is provided at the metal plate 7. Stress produced by action of atmospheric pressure from thermal expansion till completion in an exhaust process can thus be absorbed by the rib 9. Production of wrinkles 34 referred to the stress can thus be prevented, and thereby appearance becomes beautiful.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a flat cathode ray tube capable of projecting various images.

[Summary of the invention]

The present invention provides a flat type casing comprising a metal plate, a transparent panel facing the transparent panel, and a metal frame which is fixed to the transparent panel and joined to the metal plate by low melting point solder to form a flat casing. A flat cathode ray tube that can be sealed as a container without affecting the contents (cathode, etc.) by heat such as oxidation by selectively providing stress absorption means on the metal plate. The exhaust process and the stress generated after the exhaust process are alleviated to prevent deformation of the flat cathode ray tube, particularly the metal plate.

[Conventional technology]

As a conventional image display device, a so-called cone-shaped cathode ray tube is mainly used, which is constructed in a tube made of a transparent material such as glass and has an electron gun disposed as a cathode ray generating means.

In this conventional image display device, the front panel of the tube serving as the display surface is formed into a spherical or cylindrical surface. This is because the inside of the tube is in a substantially vacuum state, so the tube needs to have a shape as close to a sphere as possible. That is, since the interior of the tube is substantially vacuum, a pressing force due to atmospheric pressure is applied to the tube. This is because, in order for the tube to withstand the pressure exerted by atmospheric pressure, it is more advantageous to form the tube with a convex surface than with a flat or concave surface.

By the way, in the past, research has been carried out to make the display tubes as described above even thinner. This thinning means reducing the depth from the front panel. Therefore, instead of a tube, a flat cathode ray tube is constructed by arranging an electron beam irradiation means such as a cathode and a control ring inside a container with a flat front panel and a flat back panel at the rear. has been proposed (UK patent 145
(See specification No. 8909, Japanese Patent Publication No. 58-8546)
.

[Problems to be Solved by the Invention] Incidentally, a flat cathode ray tube using a container as described above has a problem compared to a cathode ray tube using a tube as described above because the front panel of the container is pressed by atmospheric pressure. It can only be applied to those with small front panels. That is, if a front panel of the same size as a cathode ray tube constructed using the above tube is formed into a flat shape, mechanical strength cannot be guaranteed.

Since the front panel is made of a material such as -1iG glass, it is extremely dangerous if it breaks due to pressure from atmospheric pressure and its own weight, making it impossible to put it into practical use.

In order to increase the mechanical strength of the flat front panel, it is conceivable to increase the thickness of the front panel, but this increases the weight of the entire container (and is therefore impractical. As the size of containers increases, the thickness necessary to ensure the mechanical strength of the front panel increases, and the weight of the container becomes extremely large.

Therefore, in order to solve the above problem, the present applicant has developed a front panel (41), a rear panel (42), and a side panel, each of which is formed into a flat shape from a transparent member such as glass, as shown in FIG. 14, for example. A plurality of cathode ray generating cathodes (45) that generate cathode rays and a grid electrode (46) provided corresponding to the cathode (45) are installed inside a container (44) having a panel (43). A plurality of control electrodes (49) are provided, and a plurality of control electrodes (49) are brought into contact with the inner surface of the fluorescent screen (48) by means of supporting electrodes (47) provided on the inner surface of the back panel (42).
A flat cathode ray tube (Japanese Patent Application No. 1983-1983) in which a front panel panel 41) is reinforced and supported so as to support an electron multiplier (50) laminated further inside the control electrode (49).
166529)). Furthermore, the applicant has provided a front panel (41) as shown in FIGS. 15 and 16.
In a volume 2g (44) consisting of a back panel (42) and a side panel (43), the spacer is perpendicular to the back panel (42) so that one end surface (61a) of each side abuts the back panel (42). The plurality of insulating support walls (61) arranged in parallel along the first direction (X direction) and the front panel (41) are perpendicular to each other, and the first direction (X direction) and the second direction (X direction) It is made up of a plurality of parallel electrode plates (62) and (63) each extending in the first direction (X direction), with one end surface (62a) and (63a) of each parallel electrode plate abutting against the inner surface of the front panel (41). a cross-shaped accelerating electrode (64) arranged so that each other end surface (62b) of each parallel electrode plate (62) along the insulating support wall (61) abuts each other end surface (61b); Supporting wall (
61), a cathode (65), an electron beam extraction electrode (66), and a horizontal electrostatic deflection electrode (67);
It is configured such that a group of electrodes such as a vertical electrostatic deflection electrode (68) and a signal control electrode (69) are arranged, and the supporting wall (61)
) and the cross-shaped accelerating electrode (64) provide mechanical support between the front panel (41) and the back panel (42) to maintain a sufficiently high mechanical withstand pressure against external pressure on the container (70). He proposed a flat cathode ray tube (Japanese Patent Application No. 331658/1983) that was able to do this.

However, the flat cathode ray tube shown above has a container (4
When frit-sealing 4) or (70), the front panel (41) and the back panel (42) are opposed to each other, and the upper and lower sides of the side panels (43) arranged around the opposing surfaces and the opposing surfaces, respectively. After supplying glass frit to the end face, the front panel (41), side panel (43), and back panel (42) are joined together, and then fired and sealed in a furnace. In order to prevent objects (cathode, etc.) from being oxidized, inert gas (
For example, the firing is performed in a nitrogen (NZ) atmosphere. Therefore, if the flat cathode ray tube itself is small, this will not be much of a problem, but if the tube is large (for example, 50 inches to
In the case of a flat cathode ray tube (100 inch type), it is difficult to create an inert gas atmosphere furnace suitable for its size, and when baking and sealing the container (44) or (70), the contents (
There is a disadvantage that the cathode, etc.) is oxidized to a considerable extent, significantly shortening the service life of the flat cathode ray tube.

In order to solve the above-mentioned disadvantages, the present applicant has developed a metal plate (force), a transparent panel (front panel (1) and a support panel (2)) facing the force, and a support panel (front panel (1) and support panel (2)), as shown in FIG. We have proposed a flat cathode ray tube consisting of a metal frame (6) fixed to a panel (2) and joined to the metal plate (7) by low melting point solder to form a flat casing (3).

The purpose of the present invention is 1. To provide a flat cathode ray tube shown in FIG. 1 which has an elegant appearance by absorbing stress on the metal plate generated during an evacuation process, etc., thereby preventing deformation of the metal plate due to the stress. It is in.

[Means to solve the problem]

The flat cathode ray tube of the present invention includes a metal plate (7), a transparent panel (front panel (1)) and a support panel (
2)) and is fixed to the support panel (2) with low melting point solder (
21) to the metal plate (7) to form a flat casing (
In a flat cathode ray tube consisting of a metal frame (6) forming a metal plate (7), stress absorbing means (ribs (9)
)) should be provided selectively.

[Effect]

According to the above-described structure of the present invention, since the stress absorbing means (rib (9)) is selectively provided on the metal plate (force), thermal expansion during the evacuation process and pressure due to atmospheric pressure after the evacuation process is completed. Wrinkles (34) appear near the resulting metal plate (which can absorb stress and is usually connected to the metal frame (6) at the joint 00), impairing the aesthetic appearance of the metal plate (7). However, due to the absorption of the stress mentioned above, the metal plate (force is wrinkled (34)
) does not occur and the appearance is elegant.

〔Example〕

Hereinafter, the present invention will be described in detail with reference to FIGS. 1 to 11.

As shown in FIG. 1, the flat cathode ray tube according to this embodiment includes a front panel (1), a support panel (2) constituting a side surface, and a metal member (3). The front panel (1), the support panel (2), and the metal member (3) constitute one flat case, that is, a container (A), and the electrode group consisting of a cathode and various control electrodes and the support member are contained inside. For example, contents (4) as shown in FIGS. 14 and 15 are accommodated.

The front panel (1) is formed into a planar shape from a transparent member such as glass, and has a phosphor layer (5) on its inner surface. This phosphor layer (5) includes, for example, each red, green, and blue phosphor R.
, G, and B are colored differently in a predetermined order.

The support panel (2) consists of two types of glass plates, the first support panel (2a) is arranged on the periphery of the front panel (1) and is fritted, the second support panel (2b)
is fritted onto the first support panel (2a) via one end (6a) of a metal frame-like body (6), which will be described later.

The metal member (3) includes a metal frame (6) extending outward from the support panel (2) and a metal plate (7) facing the front panel (1). Become.

The metal frame (6) has a roughly L-shaped cross section, and one end (6a) is sandwiched between support panels (2a) and (2b), and extends outward from there at a required distance (m). It is bent in the back direction, and further bent horizontally outward at the other end (6b).

As shown in Figure 2, the metal plate (7) has a larger area than the front panel (1), and has a chip tube (7) in the center.
8) is attached by welding or frit attachment, and a plurality of upwardly convex ribs (9) are radially formed around the periphery. The peripheral edge (7a) is joined to the other end (6b) of the metal frame (6) by the adhesive method described later (hereinafter referred to as the metal frame (6) and the metal plate (7).
) is referred to as the joint part (10))
. Further, the chamber (11) formed on the inner surface side of the rib (9) and the chamber (12) formed between the metal frame (6) and the second support panel (2b) are the above-mentioned joints. The chambers (11) and (12) communicate with each other near the section (10), and in this example, a gas adsorption material (13) made of activated carbon or the like is accommodated in the chambers (11) and (12).

Note that (14) is an insulator made of a glass plate, etc., and its area is slightly smaller than that of the front panel (1).
4) to cut off contact between the electrode group and the metal plate (7). A hole (15) is provided in the metal plate (7) at a location corresponding to the tip tube (8). This insulator (14) is the contents (4) and the metal plate (7)
It may be fixed by being held between the two, or it may be left in a free state without being held.

Further, the lead terminals (16) extending from the electrode group are led out from between the front panel (1) and the first support panel (2a).

Next, an example of how to assemble the flat cathode ray tube according to this embodiment will be explained based on the process diagram shown in FIG.

First, as shown in FIG.
Place the lead frame (lead terminals (16)) on the front 2 quenelle (1) that has been formed, and then attach the front panel (1
) After applying the glass frit (17) to the peripheral edge of the first support panel (2a), the first support panel (2a) is placed on the peripheral edge.

Next, as shown in Figure B, the first support panel (2a)
After applying frit glass (19) to the end face (18) of The glass frits (17) and (19) are solidified by firing.

The firing temperature is about 440'C and the firing time is 40 to 50 minutes.

Next, as shown in Figure C, a box body (B) formed by the front panel (1) and support panels (2a) and (2h)
) After putting the contents (4) into the container, the insulating material (14) is placed on top of the contents (4).

Next, as shown in the figure, the metal plate (7) is attached to the box (B).
), and its peripheral edge (7a) and the other end (6a) of the metal frame plate (6) are joined to form one flat sealed container (A
). As an example of this joining method is shown in FIG. 4, the metal plate (
After cleaning the peripheral edge (7a) of the metal frame (6) with oil or the like, solder (20) having a relatively high melting point is applied to the other end (7) of the metal frame (6) without flux using high-temperature ultrasonic waves. 6b)
and the peripheral edge (7a) of the metal plate C, and further solder (
20) A low melting point solder (21) is applied on top using low temperature ultrasonic waves. A wire (2) formed of the same low melting point solder as the low melting point solder (21) is placed between these low melting point solders (21).
2), the bonded portion (10) is bonded by applying temperature and pressure.

An example of the bonding method is shown in FIG.
4) On the upper side, the width (1]) is smaller than the outward extension width (■1) of the other end (6b) of the metal frame (6) or the peripheral edge (7b) of the metal plate (7). Two presser plates (25) having high thermal conductivity as shown in FIG.

The solder (20) surface and (21) of the joint (10) are melted by the heater heat from the iron plate (24), and are pressed while being held by the temporary presser (25) to form the joint plate (
10) is glued. This adhesion (installation of the iron plate (24) and presser plate (25) and pressing from above) is performed at the joint (10
), that is, for each of the four sides, by using the holding plate (25) as a frame-shaped body and further preparing two or more iron plates (24) having heaters (23) or using them as a frame-shaped body. , the number of times the iron plate (24) and the holding plate (25) are installed and pressed can be reduced without reducing the number of times the iron plate (24) and the holding plate (25) are installed, and if the iron plate (24) with the heater (23) is also installed on the back side, the solder (20) surface and The melting of (21) is accelerated, leading to savings in the time required for bonding.

In the above embodiment, the wire (22) made of low melting point solder is sandwiched between the low melting point solders (21) to adjust the amount of the low melting point solder (21). (2
When applying the low melting point solder (21) on the solder wire (21), if a sufficient amount is supplied in advance, the wire (22) becomes unnecessary.

In addition, high melting point solder (20) is applied to the metal frame (6) and metal plate (7) in advance, and then the high melting point solders (20) are bonded together with low melting point solder (21). This is to increase the adhesive strength between the metal frame (6) and the metal plate (force). In other words, the metal frame (6) and metal plate (7) are directly bonded with low melting point solder. However, since the adhesion temperature of the low melting point solder is relatively low, the adhesion between the low melting point solder and the metal is weak, and as a result, the metal frame (6) and the metal plate (7) cannot be firmly bonded. On the other hand, if only high melting point solder is used, the high temperature will be applied when applying the high melting point solder to the metal frame (6) and the metal plate (7), so the high melting point solder and metal The surfaces melt together, and as a result, the adhesion between the high melting point solder and the metal improves. However, when bonding high melting point solders together, it is done at the same high temperature, and as a result, the adhesion between the high melting point solder and the metal increases. Therefore, as in this example,
By using low melting point solder to bond high melting point solder, it is possible to bond high melting point solder to each other without affecting the adhesion between high melting point solder and metal, and the metal frame as a whole (
6) and the metal plate (7) become strong.

Returning to the explanation of the process diagram (Fig. 3), next, as shown in the same diagram, the container (A) is placed in the heating furnace (27) and heated at 380°C.
Exhaust treatment is performed by heating at °C (in a vacuum state). Exhaust of gas is carried out by a tip tube (8).

At this time, as shown in Fig. 6, a copper pipe (28) is installed along the joint (10), and cooling water (29) is poured into the copper pipe (28) to close the joint (10). Cool to prevent the solders (20) and (21) of the joint (10) from melting due to the furnace temperature (380°C).

That is, the copper pipe (28a) and ( 28b)
Piping. At this time, the peripheral part (7a) and the other end part (6
b) is formed in the shape of a groove with an upper opening and a lower opening, respectively, so that the copper pipes (28a) and (28b) can be fitted into the joint (10) of the copper pipes (28a) and (28b).
) can be prevented from coming off. This copper pipe (
After piping of 28), aluminum foil (30
). The aluminum foil (30) coating prevents the copper pipe shaft 8) from being directly heated in the heating furnace (27).

On the other hand, the copper pipe (28) has a diameter of 60 mm as shown in FIG.
°C to 65°C hot water (cooling water (29)) is pumped from the tank (31) to the heating furnace (27) via the pump (32).
), and after being piped to the joint (10) of the container (A), it is placed in a constant temperature cooling device (33) outside the heating furnace (27).
) into the tank (31) again.

Therefore, the hot water (
29) is supplied to the container (A) in the heating furnace (27),
The temperature of the joint (10) is kept constant (below the melting point of the low melting point solder (21), e.g. 160"C or less), and heated in a heating furnace (27).
The hot water that has been heated to some extent inside is heated to a constant temperature cooling device (33
) in the tank (3
1). The above cycle is continued until the exhaust treatment is completed.

Next, based on FIG. 8, cooling water (warm water) (29 ) temperature change (curve ■) and temperature change at the joint (10) (curve ■)
Explain. The aluminum foil (30) at the joint (10) is double layered, and the temperature measurement points of the joint (10) and the cooling water (29) are as shown in FIG.

That is, as shown in FIG. 8, as the temperature inside the heating furnace (27) gradually increases, the temperature at the joint (10) also increases, but the slope is very gentle (section ■). . When the temperature inside the heating furnace (27) reaches the required temperature (380°C), the temperature of the joint (10) is about 120°C to 130°
C, and even if the temperature inside the heating furnace (27) is kept constant at the above-mentioned required temperature for about 1 hour, the temperature of the joint (10) remains at 120-130°C due to the cooling water (29). Retained (interval ■). At this time, the temperature of the cooling water (29) is the temperature in the tank (31) (60°C to 65"C).
) is about 10°C higher. Joint (1
0) temperature of 120°C to 130°C is a low melting point solder (2
Since the temperature is lower than the melting point of 1), the heating furnace (27)
Inside the semi-EFI (20) and (21) do not melt.

The reason why the temperature of the joint (10) is maintained at a higher temperature (120°C to 130°C) than what is normally called cooling is because if the joint (10) is cooled too much,
As the metal frame (6) cools, the entire metal frame (6) is also cooled, and stress is created between the support panels (2a) and (2b) due to the extreme temperature difference between the metal frame (6) and the support panel (2). This is because there is an inconvenience that the support panel (2) may crack or break due to the stress.

In the above exhaust process, the container (A) is exposed to a high temperature of 380°C in a heating furnace (vacuum state) (27), so the entire container (A) expands thermally, and in particular, the container (A) is made of glass plate. and a metal plate, the degree of expansion is different, and since the joint (10) is cooled as described above, as shown in FIG. 10A, the metal plate (7),
In particular, a bulge is created with the top at the central portion where the tip tube (8) is located. After the exhaust stroke, the container (A) is taken out of the vacuum heating furnace (27) and returned to the air, so atmospheric pressure is applied to the entire container (A), and this atmospheric pressure Press the bulge and as a result, the joint (1
Stress is applied to the area around 0), and wrinkles (34) usually occur in that area, as shown in Figure B. However, in this example, since the ribs (9) are provided around the periphery of the metal plate (7), the stress mentioned above is absorbed by the ribs (9), and the wrinkles (34) described above do not occur. That is, the rib (9) is the first
As shown in Fig. 1, the force (f) from the left and right directions due to the above stress is dispersed upward. At this time, the rib (9) becomes more raised than usual as shown by the broken line,
The swelling is not noticeable in appearance.

In addition, in the above exhaust process, the contents (4) are removed by heating.
The gas is released from the tip tube (8), and the gas is then transferred to the tip tube (8).
However, since there are many contents (4), it is difficult to discharge and exhaust the gas to all the contents (4). Therefore, when the cathode ray tube is used, there is a risk that gas will be generated again from the contents (4). However, in this example, as shown in Figure 1, the rib (9)
A chamber (11) formed on the inner surface side of the metal frame (6)
and the second support panel (2b).
2) Gas adsorbent! (13), so by adsorbing the gas generated during use, the contents (4)
This makes it possible to remove gas from the space where it exists, and prevents a decrease in brightness and a decrease in service life due to the generation of gas.

As described above (according to this example), when constructing the container (A), the front panel (1) and the support panel (2) form the box body (B), and the box body (B) Contents (4)
After accommodating the front panel (1), a metal plate (7) facing the front panel (1) is placed in a metal frame (6) extending from the support panel (2).
Since the container (A) is locally bonded, that is, by low melting point soldering, there is no need to seal it in an inert gas atmosphere as in the conventional case, and it is possible to seal it in the air when forming the container (A). In addition, because of local low-temperature bonding, the contents (4), especially the cathode, are not oxidized. Therefore, it is possible to increase the size of the flat cathode ray tube, and at the same time, it is possible to achieve a long life.

Also, the second support panel (2b) is connected to the first support panel (2b).
2a) Since the metal frame (6) is fixed onto the support panel (2) through one end (6a), the metal frame (6) is prevented from coming off from the support panel (2), resulting in a robust container. (A).

Furthermore, when a large number of flat cathode ray tubes are arranged to display a large screen, since the joint (10) is made of metal, the joint θ
0) It is only necessary to weld them together, and there is no need to provide a new frame for fixing.

In addition, the metal frame (6) extends from the support panel (2) by a predetermined distance (m) and then is bent upward in the drawing to provide flexibility in the vertical direction for carrying, etc., and in the exhaust process. Since it has flexibility against temperature differences such as local cooling at the joint (10), it prevents cracks, etc. at the corner portion of the first support panel (2a) on the side of the metal rod (6) under these environments. be able to.

In addition, in the exhaust process, a copper pipe (
28), and hot water (60°C ~
65"C) to maintain the temperature at the junction (10) at approximately 120°C to 130°C, there is no need to lower the exhaust temperature, and the temperature is lower than the normal exhaust temperature (380°C).
), gas release from the inside of the container (A) is promoted, leading to a longer life of the cathode ray tube. Furthermore, as mentioned above, the temperature of the joint (10) is maintained at a constant temperature below the melting point of the low melting point solder, so the solders (20) and (21) of the joint (10) are unlikely to melt. This makes it possible to prevent solder from being sucked into the container (A) due to melting of the solder and from generating leakage current due to the sucked solder.
10) Since there is no extreme temperature difference between the support panel (
2) Cracks and the like do not occur, leading to improved reliability of the cathode ray tube.

In addition, since the ribs (9) are provided on the metal plate (7), the stress caused by thermal expansion during the exhaust process and the action of atmospheric pressure at the end of the exhaust process can be absorbed by the ribs (9). It is possible to prevent the occurrence of wrinkles (34) on the metal plate (7), which is the cause, and the appearance is elegant.

In addition, since the gas adsorbing material (13) is accommodated in the chambers (11) and (12) formed on the inner surface of the rib (9) and the inner surface of the metal rod (6), when using the cathode ray tube, ,
Since the gas generated from the contents (4) can be adsorbed, the brightness can be improved and the life can be extended.

Furthermore, when adhering the joint portion (10), the metal frame (6) may be bonded in advance.
) and metal Fi, (7) are coated with high melting point solder (20), and then the high melting point solder (20) is bonded with low melting point solder (21).
Since the adhesive is bonded with the adhesive, the bonded portion (10) is firmly bonded.

In addition, in the above embodiment, the other end (6b) of the metal frame body (6)
was made to protrude outward from the container (A),
As shown in Figure 12A, the metal plate (7
) may be combined with In this case, the bonding is done by laser welding. In addition, as shown in Figure B, a metal frame-like body (6
) may be bent inward. In this case, low melting point soldering can be used for joining the metal plate (as in this example), and an iron plate (24 pins) having a heater (23) for supplying heat and pressure to the joint (10). Horizontally, connect the joint (1) with the part of the heater (23).
0) may be held.

Also, in the exhaust process, when keeping the joint (10) at a predetermined temperature, hot water (60" to 65'C) was flowed into the copper pipe (28) piped to the joint (10). Air may be used instead of hot water.

Furthermore, although the ribs (9) provided on the metal plate (7) have a convex cross section as shown in FIG. 11, they may also have a thinner shape with an etched lower surface as shown in FIG. 13.

In this case, the space generated by the exhaust process is absorbed by deforming into the shape shown by the broken line.

[Effects of the Invention] The flat cathode ray tube according to the present invention includes a metal plate, a transparent panel facing the metal plate, and a flat casing that is fixed to the transparent panel and joined to the metal plate with low melting point solder. In the flat cathode ray tube consisting of a metal frame-like body, the stress absorbing means is selectively provided on the metal plate, so that the stress generated in the metal plate after the exhaust process and the air process is alleviated. Deformation of the metal plate due to the above stress can be prevented,
The beauty of the metal plate can be maintained.

[Brief explanation of the drawing]

Fig. 1 is a partially omitted sectional view showing the configuration of the flat cathode ray tube according to this embodiment, Fig. 2 is a perspective view showing an example of the shape of the metal plate, Fig. 3 is an assembly process diagram, and Fig. 4 is An explanatory diagram showing an example of a method for joining a metal frame-like body and a metal plate, FIG. 5 is an explanatory diagram showing an example of a method for adhering the joint, and FIG. 6 is a cross-sectional view showing the piping of a copper pipe to the joint. , Fig. 7 is a configuration diagram showing the piping route of copper pipes, Fig. 8 is a characteristic diagram showing temperature changes of cooling water and joints due to temperature changes in the heating furnace, and Fig. 9 shows temperature measurement points. FIG. 10 is an explanatory diagram showing the shape change of a metal plate due to stress, FIG. 11 is an explanatory diagram showing the cross-sectional shape of a rib and deformation due to stress, and FIG. 12 is an explanatory diagram showing another example of a metal frame-like body. FIG. 13 is a sectional view showing another example of the rib, FIG. 14 is a partially cutaway perspective view showing a conventional example,
FIGS. 15 and 16 are configuration diagrams showing other conventional examples. (A) is the container, (B) is the box, (1) is the front panel, (
2) is a support panel, (2a) is a first support panel, (2) is a support panel; (2a) is a first support panel;
b) is the second support panel, (3) is the metal member, (4) is the content, (5) is the phosphor layer, (6) is the metal frame, (7
) is a metal plate, (8) is a chip tube, (9) is a rib, (10
) are joints, (11), (12) are chambers, (13) are gas adsorbing materials, (14) are insulators, (16) are lead terminals, (21) are low melting point solder, (22) are wires , (23)
is the heater, (24) is the iron plate, (25) is the holding plate, (26
) is a plate, (27) is a heating furnace, (2 days) is a copper pipe, (2
9) is cooling water (hot water), (30) is aluminum foil, (31
) is a tank, (32) is a pump, (33) is a constant temperature cooling device, and (34) is a wrinkle.

Claims (1)

[Scope of Claims] Consisting of a metal plate, a transparent panel facing the metal plate, and a metal frame-shaped body that is fixed to the transparent panel and joined to the metal plate with low melting point solder to form a flat casing. A flat cathode ray tube, characterized in that the metal plate selectively has stress absorbing means.