JPH02148724U - - Google Patents
Info
- Publication number
- JPH02148724U JPH02148724U JP5615789U JP5615789U JPH02148724U JP H02148724 U JPH02148724 U JP H02148724U JP 5615789 U JP5615789 U JP 5615789U JP 5615789 U JP5615789 U JP 5615789U JP H02148724 U JPH02148724 U JP H02148724U
- Authority
- JP
- Japan
- Prior art keywords
- metal
- mold according
- molding mold
- thermosetting resin
- urethane resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 3
- 239000011247 coating layer Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims 2
- 229920001187 thermosetting polymer Polymers 0.000 claims 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 1
- 229910052796 boron Inorganic materials 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000005300 metallic glass Substances 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 229910001220 stainless steel Inorganic materials 0.000 claims 1
- 239000010935 stainless steel Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Punching Or Piercing (AREA)
- Mounting, Exchange, And Manufacturing Of Dies (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
Description
第１図は本考案に係る金属成形加工用金型の好
適な実施例を示す断面図、第２図は第１図におけ
る金型の要部を詳細に示す断面図、第３図は被加
工物に「だれ」が生じている状態を示す一部省略
説明図、第４図は被加工物に「反り」が生じた状
態を示す説明図である。
１０……金型（金属成形加工用金型）、１２…
…ワーク（被加工物）、１６……パツド、１６ａ
……コーテイング層。
Figure 1 is a cross-sectional view showing a preferred embodiment of the metal forming mold according to the present invention, Figure 2 is a cross-sectional view showing the main parts of the mold in Figure 1 in detail, and Figure 3 is a workpiece. A partially omitted explanatory diagram showing a state in which "curvature" has occurred on the object, and FIG. 4 is an explanatory diagram showing a state in which "warp" has occurred in the workpiece. 10... Mold (metal molding mold), 12...
...Work (workpiece), 16...Pad, 16a
...Coating layer.
Claims (1)
ス金属、ケプラーまたはボロンを含む物質が熱硬
化樹脂に混入されたコーテイング材料を被加工物
押圧用パツドの押圧面にコーテイング層として形
成する、 ことを特徴とする金属成形加工用金型。 (2) 請求項１記載の金属成形加工用金型におい
て、 熱硬化樹脂はウレタン樹脂である、 ことを特徴とする金属成形加工用金型。 (3) 請求項２記載の金属成形加工用金型におい
て、 ウレタン樹脂は２mm乃至３mmの厚さである、 ことを特徴とする金属成形加工用金型。[Claims for Utility Model Registration] (1) A coating material in which a thermosetting resin is mixed with a substance containing at least stainless steel powder, amorphous metal, Kepler, or boron is formed as a coating layer on the pressing surface of a pad for pressing a workpiece. A mold for metal forming processing, characterized by: (2) The metal molding mold according to claim 1, wherein the thermosetting resin is a urethane resin. (3) The metal molding mold according to claim 2, wherein the urethane resin has a thickness of 2 mm to 3 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5615789U JPH02148724U (en) | 1989-05-16 | 1989-05-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5615789U JPH02148724U (en) | 1989-05-16 | 1989-05-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02148724U true JPH02148724U (en) | 1990-12-18 |
Family
ID=31579736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5615789U Pending JPH02148724U (en) | 1989-05-16 | 1989-05-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02148724U (en) |
-
1989
- 1989-05-16 JP JP5615789U patent/JPH02148724U/ja active Pending
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