JPH02148891A - Structure for cooling power source module of electronic equipment - Google Patents

Abstract

PURPOSE:To make pipings in a power source module unnecessary and to improve workability in assembling and workability in maintenance by sealing refrigerant wherein electronic circuit component units are immersed in a case, and providing a heat radiating unit which is in contact with the power source modules, absorbs heat and radiates it to the outside in a housing unit. CONSTITUTION:At first, a power source module 3 is mounted in a housing unit 2. When an electronic circuit component unit 4 generates heat, the generated heat is transferred to a refrigerant 5. The heat is transferred to each wall surface of the housing unit 2 which is in close contact with a case 6 through a case 6. Then the heat which is transferred to the wall surface is absorbed with cooling water which flows in water paths 7. The water is transferred to the outside. Therefore, the temperature of the electronic circuit component unit 4 does not exceed a specified temperature, and a stable function can be maintained. Since a heat radiating unit 7 which is to become a heat conducting surface can be arranged on the entire outer surface of the power source module 3, the cooling ability is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a power module cooling structure for an electronic device that performs liquid cooling such as a power module, which is a heat generating unit mounted in an electric device such as a computer. Regarding.

[Prior Art] Conventionally, as shown in FIG. 3, this type of power supply module cooling structure uses a non-corrosive and non-electrolytically dissociable material to cool a high-density, highly integrated electronic circuit component unit 4. Refrigerant liquid 15
In order to keep the temperature of the refrigerant liquid 15 constant, a cooling unit was installed above the power supply module 13. This cooling unit is
Heat of the refrigerant liquid 15 is absorbed by a water channel 17 that circulates water sent from an external water supply machine, and the temperature of the refrigerant liquid 15 is kept constant.

[Problems to be Solved by the Invention] The conventional power supply module cooling structure described above is equipped with a cooling unit for each power supply module.
A shield structure is required to prevent liquid leakage between the cooling unit 6 and the cooling unit, which has the disadvantage of complicating the design.

Furthermore, each power supply module 13 requires separate piping work to feed cooling water from a water supply machine, and rFf after the power supply module 13 is assembled.

At the time of air quality inspection and maintenance work when the power supply module 13 breaks down, it is necessary to install and remove piping, and there is a disadvantage that replacing and installing piping takes a lot of time.

Furthermore, when piping is installed, there is a high risk of liquid leakage, especially since there are many other electrical circuits inside the housing, and there is a risk of personal injury such as damage to other parts due to liquid leakage and electric shock to workers due to high voltage parts. There are some drawbacks.

[Means for Solving the Problems] The power supply module cooling structure for electronic equipment of the present invention has been made in order to solve the above-mentioned conventional problems, and includes a power supply module incorporating an electronic circuit component unit, and the above-mentioned power supply module. In an electronic device having an accommodation unit for accommodating a module, a case made of a heat conductive material for accommodating the electronic circuit component unit is disposed in the power supply module, and the case has a refrigerant liquid in which the electronic circuit component unit is immersed. The accommodating unit is provided with a heat dissipation unit that contacts the power supply module, absorbs heat, and radiates the heat to the outside.

[Example] Next, an example of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing one embodiment of the present invention, and FIG. 2 is a longitudinal cross-sectional view of a state in which a power supply module is mounted in the accommodation unit of this embodiment.

In the electronic device of this embodiment, a housing unit 2 is disposed within a housing 1, and a plurality of removable power supply modules 3 are disposed inside the housing unit 2.

The power supply module 3 includes an electronic circuit component unit 4 that generates heat, and a case 6 that houses the electronic circuit component unit 4 (FIG. 2).

The case 6 is a box made of a heat conductive material such as metal,
A refrigerant liquid 5 is sealed inside.

The refrigerant liquid 5 is a non-corrosive and non-electrolysis liquid refrigerant, and the electronic circuit component unit 4 is immersed therein. This case 6 radiates heat generated in the electronic circuit component unit 4 to the outside of the case 6 via the refrigerant liquid 5.

The accommodation unit 2 is provided with a heat radiation unit inside.

The heat dissipation unit includes a wall surface that contacts the periphery of the power supply module 3 and is capable of absorbing heat, and a plurality of water channels 7 adjacent to the wall surface.

The water channel 7 is made of a bent cylindrical pipe, into which cooling water from an external water supply device flows in through a pipe 8, and which circulates the cooling water and flows out through the pipe 8. Therefore, the waterway 7 is connected to the case 6 of the power supply module 3.
The heat absorbed by the cooling water is absorbed by the cooling water and discharged to the outside.

Next, the operation of this embodiment will be explained.

First, the power supply module 3 is mounted on the accommodation unit 2,
When the electronic circuit component unit 4 generates heat, the generated heat is transmitted to the refrigerant liquid 5, and is transmitted via the case 6 to each wall surface of the housing unit 2 that is in close contact with the case 6. Next, the heat transmitted to the wall surface is absorbed by the cooling water flowing through the water channel 7 within the wall surface and carried to the outside. Therefore, the temperature of the electronic circuit component unit 4 will not rise above a certain temperature, and stable functionality can be maintained.

In addition, in this embodiment, since the heat dissipation unit 7 serving as a heat conduction surface can be disposed on the entire outer surface of the power supply module 3 compared to the conventional cooling method, the cooling capacity is improved.

[Effects of the Invention] As explained above, the power supply module cooling structure of the present invention provides a power supply module cooling structure for an electronic device that has a power supply module incorporating an electronic circuit component unit and an accommodation unit that accommodates an L power distribution module. A case made of a heat conductive material for housing the electronic circuit component unit is disposed in the power supply module, the case is filled with a refrigerant liquid for immersing the electronic circuit component unit, and the housing unit is provided with a case made of a heat conductive material. By providing a heat dissipation unit that is in contact with the power supply module and absorbs heat and radiates the heat to the outside, the power supply module and the heat dissipation unit are separate bodies, so the power supply module itself is miniaturized, and
Since piping within the power supply module is not required, assembly workability and maintenance workability are improved. Furthermore, it has the effect of preventing personal accidents caused by electrical leakage during piping as in the past.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing an embodiment of the present invention, Fig. 2 is a vertical cross-sectional view of a power supply module mounted in the accommodation unit of this embodiment, and Fig. 3 is a perspective view of a conventional power supply module. be. 1: Housing 2: Accommodation unit 3: Power supply module 4: Electronic circuit component unit 5: Refrigerant liquid 6: Case 7: Heat dissipation unit (water channel) 8: Piping

Claims (1)

[Scope of Claims] An electronic device having a power supply module incorporating an electronic circuit component unit and a housing unit housing the power supply module, wherein the power supply module includes a case made of a heat conductive material housing the electronic circuit component unit. The housing unit is provided with a heat radiation unit that contacts the power supply module, absorbs heat, and radiates the heat to the outside. A power module cooling structure for electronic equipment characterized by: