JPH0215254Y2 - - Google Patents
Info
- Publication number
- JPH0215254Y2 JPH0215254Y2 JP4973185U JP4973185U JPH0215254Y2 JP H0215254 Y2 JPH0215254 Y2 JP H0215254Y2 JP 4973185 U JP4973185 U JP 4973185U JP 4973185 U JP4973185 U JP 4973185U JP H0215254 Y2 JPH0215254 Y2 JP H0215254Y2
- Authority
- JP
- Japan
- Prior art keywords
- rail
- side piece
- receiving part
- solder
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 2
- 238000005219 brazing Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
【考案の詳細な説明】 産業上の利用分野 本考案はレールボンドに関する。[Detailed explanation of the idea] Industrial applications The present invention relates to rail bonds.
従来の技術
レールボンドについては従来より種々開発され
てきている。例えば実公昭26−6209号、実公昭25
−4649号及び実公昭54−26561号等が公知の技術
として知られている。Conventional Technology Various types of rail bonds have been developed in the past. For example, Jitko No. 26-6209, Jitko No. 25
-4649 and Utility Model Publication No. 54-26561 are known as known techniques.
考案が解決しようとする問題点
従来板材で成形された端子において、導線Ａを
原形（断面円形）のまゝ保持する端子は第３図に
示す様な形状となり、これをレールＣに鑞付けす
るとき、レールＣと端子の導線保持部１２側の側
面部１１，１３との間に間隙が出来、溶鑞が外部
へ流出し、これを防止するためにレールＣと端子
の側面部１１，１３との間隙に予めパツキン材を
充填する作業を必要とした。Problems that the invention aims to solve In conventional terminals formed from plate materials, the terminal that holds the conductor A in its original shape (circular cross section) has a shape as shown in Figure 3, and is brazed to the rail C. At this time, a gap is created between the rail C and the side surfaces 11 and 13 of the terminal on the conductor holding portion 12 side, and molten solder flows out to the outside.To prevent this, the rail C and the side surfaces 11 and 13 of the terminal are It was necessary to fill the gap with packing material in advance.
本考案はこれらの事項に鑑み開発されたもの
で、レールと端子の接合面を密着せしめて、間隙
をなくし、鑞付作業の容易な、且つ安全で安定し
たレールボンドを提供することを目的としたもの
である。 The present invention was developed in consideration of these matters, and its purpose is to provide a safe and stable rail bond that allows easy brazing work by bringing the joint surfaces of the rail and terminal into close contact and eliminating gaps. This is what I did.
問題点を解決するための手段 次に本考案の構成について説明する。Means to solve problems Next, the configuration of the present invention will be explained.
帯板状の導板より形成した基板１の両端に側片
２，３を略直角に立て起して鑞受部４を構成し、
一方の側片３より該側片３に対して略直角に折曲
させた導線Ａを巻きこんで保持した導線保持部５
を設け、該保持部５の側片３側は鑞受部４のレー
ルＣとの接合面と同一平面とすると共に、導線保
持部５の合せ目６の間隙を少なくとも側片３付近
では零とし、導線Ａの鑞受部４に出ている端部を
扁平に押圧して鑞付し、鑞受部４の表面に鑞Ｂを
薄膜状に設けてなるものである。 The side pieces 2 and 3 are stood up substantially at right angles on both ends of the substrate 1 formed from a band-shaped conductive plate to constitute the braze receiving part 4,
A conductor holding portion 5 that holds a conductor A bent from one side piece 3 at a substantially right angle to the side piece 3 by winding it therein.
The side piece 3 side of the holding part 5 is flush with the joint surface of the solder receiving part 4 with the rail C, and the gap at the seam 6 of the conductor holding part 5 is made zero at least near the side piece 3. The end of the conducting wire A protruding from the solder receiving part 4 is pressed flat and soldered, and the solder B is provided in a thin film form on the surface of the solder receiving part 4.
作 用
本考案は以上の様な構成で、これが使用に際し
ては、従来のレールボンドと同様に使用するもの
であるが、本考案の端子とレールＣとの接合面に
は間隙がないので鑞付に際しては、容易に作業が
出来、間隙を予めうめておく等の作業も必要な
い。Function The present invention has the above-mentioned configuration, and when used, it is used in the same way as a conventional rail bond, but since there is no gap between the joint surface of the terminal of the present invention and the rail C, brazing is not required. In this case, the work can be done easily, and there is no need for work such as filling gaps in advance.
実施例
帯板状の導板をプレス加工により、基板１の両
端部に基板１に対して略直角に立て起した側片
２，３を形成して鑞受部４となし、一方の側片３
の上部より略直角に外方に折曲させて形成した縦
断面が略Ｕ字状の樋状体に導線Ａを保持させて、
これを巻きこんで、導線保持部５を形成し、該保
持部５の合せ目６は前記側片３側において側片３
のレールＣに接する端面と同一平面上に位置させ
ると共に、合せ目６の間隙を少なくとも側片３に
近い位置では零となし、保持部５を外部より締め
つけて保持部５内の導線Ａをしつかりと保持さ
せ、更に鑞受部４内に出ている導線Ａの端部を扁
平状に押圧し、これを鑞付し、基板１と両側片
２，３の表面上に鑞Ｂを薄膜状に被覆してなるも
のである。Embodiment By pressing a band-shaped conductive plate, side pieces 2 and 3 are formed at both ends of the board 1 at approximately right angles to the board 1 to form a brazing part 4, and one side piece 3
The conducting wire A is held in a gutter-like body having a substantially U-shaped vertical section and formed by bending outward at a substantially right angle from the upper part of the conductor A.
This is rolled up to form a conducting wire holding part 5, and the seam 6 of the holding part 5 is on the side piece 3 side.
The conductor A in the holding part 5 is placed on the same plane as the end surface in contact with the rail C, and the gap 6 is made zero at least at a position close to the side piece 3, and the holding part 5 is tightened from the outside. The ends of the conductive wire A protruding into the solder receiving part 4 are pressed flat and soldered, and a thin film of solder B is applied to the surfaces of the substrate 1 and both side pieces 2 and 3. It is coated with.
考案の効果
本考案は以上の様な構成であるから、本考案品
をレールに取り付ける場合端子とレールとの接合
面には隙間がないので鑞が外部にもれる恐れもな
く、現場における作業が容易となり、短時間で済
むため安全であると共に、精度の高い、安定した
製品を提供出来る等著しい効果を有するものであ
る。Effects of the invention Since the invention has the above-mentioned configuration, when the invention is installed on a rail, there is no gap between the joint surface of the terminal and the rail, so there is no risk of solder leaking outside, and the work on site is simplified. It is easy to use, takes only a short time, is safe, and has remarkable effects such as being able to provide highly accurate and stable products.
第１図は本考案の１実施例の要部を示す斜面
図、第２図は同使用状態を示す平面図、第３図は
従来品の要部を示す斜面図。
１……基板、２，３……側片、４……鑞受部、
５……導線保持部、６……合せ目、Ａ……導線、
Ｂ……鑞、Ｃ……レール。
FIG. 1 is a perspective view showing the main parts of an embodiment of the present invention, FIG. 2 is a plan view showing the state of use, and FIG. 3 is a perspective view showing the main parts of a conventional product. 1... Board, 2, 3... Side piece, 4... Brass receiver,
5...Conductor holding part, 6...Seam, A...Conductor,
B...Rail, C...Rail.
Claims (1)
２，３を略直角に立て起して鑞受部４を構成し、
一方の側片３より該側片３に対して略直角に折曲
させた導線Ａを巻きこんで保持した導線保持部５
を設け、該保持部５の側片３側は鑞受部４のレー
ルＣとの接合面と同一平面とすると共に、導線保
持部５の合せ目６の間隙を少なくとも側片３付近
では零とし、導線Ａの鑞受部４に出ている端部を
扁平に押圧して鑞付し、鑞受部４の表面に鑞Ｂを
薄膜状に設けてなることを特徴とするレールボン
ド。 The side pieces 2 and 3 are stood up substantially at right angles on both ends of the substrate 1 formed from a band-shaped conductive plate to constitute the braze receiving part 4,
A conductor holding portion 5 that holds a conductor A bent from one side piece 3 at a substantially right angle to the side piece 3 by winding it therein.
The side piece 3 side of the holding part 5 is flush with the joint surface of the solder receiving part 4 with the rail C, and the gap at the seam 6 of the conductor holding part 5 is made zero at least near the side piece 3. A rail bond characterized in that the end of the conducting wire A protruding from the solder receiving part 4 is pressed flat and soldered, and the solder B is provided in the form of a thin film on the surface of the solder receiving part 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4973185U JPH0215254Y2 (en) | 1985-04-03 | 1985-04-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4973185U JPH0215254Y2 (en) | 1985-04-03 | 1985-04-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61166476U JPS61166476U (en) | 1986-10-15 |
| JPH0215254Y2 true JPH0215254Y2 (en) | 1990-04-24 |
Family
ID=30567198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4973185U Expired JPH0215254Y2 (en) | 1985-04-03 | 1985-04-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0215254Y2 (en) |
-
1985
- 1985-04-03 JP JP4973185U patent/JPH0215254Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61166476U (en) | 1986-10-15 |
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