JPH0215728U - - Google Patents
Info
- Publication number
- JPH0215728U JPH0215728U JP1988093295U JP9329588U JPH0215728U JP H0215728 U JPH0215728 U JP H0215728U JP 1988093295 U JP1988093295 U JP 1988093295U JP 9329588 U JP9329588 U JP 9329588U JP H0215728 U JPH0215728 U JP H0215728U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- mounting portion
- groove
- view
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/381—Auxiliary members
- H10W72/387—Flow barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988093295U JPH0215728U (mo) | 1988-07-13 | 1988-07-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988093295U JPH0215728U (mo) | 1988-07-13 | 1988-07-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0215728U true JPH0215728U (mo) | 1990-01-31 |
Family
ID=31317741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988093295U Pending JPH0215728U (mo) | 1988-07-13 | 1988-07-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0215728U (mo) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07201893A (ja) * | 1995-01-31 | 1995-08-04 | Sony Corp | 半導体装置 |
| JP2014186244A (ja) * | 2013-03-25 | 2014-10-02 | Stanley Electric Co Ltd | Ｍｅｍｓデバイス |
| WO2020117431A3 (en) * | 2018-12-07 | 2020-07-30 | Google Llc | Integrated circuit substrate for containing liquid adhesive bleed-out |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61156753A (ja) * | 1984-12-27 | 1986-07-16 | Toshiba Corp | 半導体装置の外囲器 |
| JPS61212043A (ja) * | 1985-03-18 | 1986-09-20 | Hitachi Ltd | 半導体実装基板 |
| JPS62241355A (ja) * | 1986-04-14 | 1987-10-22 | Hitachi Ltd | 半導体装置 |
-
1988
- 1988-07-13 JP JP1988093295U patent/JPH0215728U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61156753A (ja) * | 1984-12-27 | 1986-07-16 | Toshiba Corp | 半導体装置の外囲器 |
| JPS61212043A (ja) * | 1985-03-18 | 1986-09-20 | Hitachi Ltd | 半導体実装基板 |
| JPS62241355A (ja) * | 1986-04-14 | 1987-10-22 | Hitachi Ltd | 半導体装置 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07201893A (ja) * | 1995-01-31 | 1995-08-04 | Sony Corp | 半導体装置 |
| JP2014186244A (ja) * | 2013-03-25 | 2014-10-02 | Stanley Electric Co Ltd | Ｍｅｍｓデバイス |
| WO2020117431A3 (en) * | 2018-12-07 | 2020-07-30 | Google Llc | Integrated circuit substrate for containing liquid adhesive bleed-out |
| US10818567B2 (en) | 2018-12-07 | 2020-10-27 | Google Llc | Integrated circuit substrate for containing liquid adhesive bleed-out |
| US11264295B2 (en) | 2018-12-07 | 2022-03-01 | Google Llc | Integrated circuit substrate for containing liquid adhesive bleed-out |
| EP4468324A3 (en) * | 2018-12-07 | 2025-04-16 | Google LLC | Integrated circuit substrate for containing liquid adhesive bleed-out |