JPH0215741U - - Google Patents
Info
- Publication number
- JPH0215741U JPH0215741U JP9442188U JP9442188U JPH0215741U JP H0215741 U JPH0215741 U JP H0215741U JP 9442188 U JP9442188 U JP 9442188U JP 9442188 U JP9442188 U JP 9442188U JP H0215741 U JPH0215741 U JP H0215741U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chips
- circuit board
- support body
- ceramic circuit
- lid part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 239000003507 refrigerant Substances 0.000 claims 3
- 230000002093 peripheral effect Effects 0.000 claims 2
- 239000002826 coolant Substances 0.000 claims 1
- 239000011159 matrix material Substances 0.000 claims 1
- 239000012528 membrane Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000000108 ultra-filtration Methods 0.000 claims 1
Description
第１図は本考案に係る冷却構造の側断面図Ａと
Ｘ―Ｘ′位置の断面図Ｂ、第２図は従来の冷却構
造を説明する断面斜視図、である。
図において、１は半導体チツプ、３はセラミツ
ク回路基板、４は蓋部、５は支持体、６は外周部
、７は空隙、８は吸引口、９は供給口、１０は排
出口、である。
FIG. 1 is a side sectional view A and a sectional view B taken along line X-X' of the cooling structure according to the present invention, and FIG. 2 is a sectional perspective view illustrating a conventional cooling structure. In the figure, 1 is a semiconductor chip, 3 is a ceramic circuit board, 4 is a lid, 5 is a support, 6 is an outer periphery, 7 is a gap, 8 is a suction port, 9 is a supply port, and 10 is a discharge port. .
Claims (1)
チツプを該基板に接して上部に設けられる枠体に
より複数列に分割し、各枠体の中に冷媒を強制循
環させて前記の半導体チツプを冷却する装置が、 マトリツクス状に半導体チツプ１を搭載してあ
るセラミツク回路基板３と、 該セラミツク回路基板３の上に設置され、櫛歯
状の断面形状をゑした限外濾過膜により前記複数
の半導体チツプ１を複数の流路に分割する蓋部４
と、 該蓋部４の外側に密着して設けられ、該蓋部４
を補強する発泡金属よりなる支持体５と、 該支持体５の外側に空隙７を挾んで設けられ、
支持体５を通して透過してきた冷媒蒸気を減圧吸
引してコンプレツサに送る吸引口８を備えた外周
部６と、 外周部６の端部に設けられ、半導体チツプ１に
冷媒を供給する供給口９と、冷却の終わつた冷媒
を循環ポンプと熱交換器に送る排出口１０と、 を少なくとも備えて構成することを特徴とする半
導体装置の冷却構造。[Claim for Utility Model Registration] A plurality of semiconductor chips mounted on a ceramic circuit board are divided into a plurality of rows by a frame provided at the top in contact with the board, and a refrigerant is forcedly circulated in each frame. The device for cooling the semiconductor chips includes a ceramic circuit board 3 on which the semiconductor chips 1 are mounted in a matrix, and an ultrafiltration device installed on the ceramic circuit board 3 and having a comb-like cross-sectional shape. A lid part 4 that divides the plurality of semiconductor chips 1 into a plurality of flow paths by a membrane.
and, provided in close contact with the outside of the lid part 4, and the lid part 4
a support body 5 made of foamed metal that reinforces the support body 5; and a gap 7 provided on the outside of the support body 5,
an outer peripheral part 6 equipped with a suction port 8 that sucks the refrigerant vapor that has permeated through the support 5 under reduced pressure and sends it to the compressor; and a supply port 9 provided at the end of the outer peripheral part 6 for supplying refrigerant to the semiconductor chip 1. 1. A cooling structure for a semiconductor device, comprising at least the following: a discharge port 10 for sending cooled coolant to a circulation pump and a heat exchanger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9442188U JPH0719158Y2 (en) | 1988-07-15 | 1988-07-15 | Semiconductor device cooling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9442188U JPH0719158Y2 (en) | 1988-07-15 | 1988-07-15 | Semiconductor device cooling structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0215741U true JPH0215741U (en) | 1990-01-31 |
| JPH0719158Y2 JPH0719158Y2 (en) | 1995-05-01 |
Family
ID=31318944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9442188U Expired - Lifetime JPH0719158Y2 (en) | 1988-07-15 | 1988-07-15 | Semiconductor device cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0719158Y2 (en) |
-
1988
- 1988-07-15 JP JP9442188U patent/JPH0719158Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0719158Y2 (en) | 1995-05-01 |
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