JPH0215892A - Laser cutting method for plate of brittle material - Google Patents

Laser cutting method for plate of brittle material

Info

Publication number
JPH0215892A
JPH0215892A JP63164947A JP16494788A JPH0215892A JP H0215892 A JPH0215892 A JP H0215892A JP 63164947 A JP63164947 A JP 63164947A JP 16494788 A JP16494788 A JP 16494788A JP H0215892 A JPH0215892 A JP H0215892A
Authority
JP
Japan
Prior art keywords
plate
notch
steel plate
laser beam
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63164947A
Other languages
Japanese (ja)
Inventor
Kazutoshi Takaishi
和年 高石
Sadao Sugiyama
杉山 貞夫
Kiyoshi Yamada
清 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP63164947A priority Critical patent/JPH0215892A/en
Publication of JPH0215892A publication Critical patent/JPH0215892A/en
Pending legal-status Critical Current

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  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To easily and speedily cut off a plate material irrespective of its thickness with a laser beam machine of small capacity by providing a V-shaped notch in laser beams on one side of the plate material, then, lowering the temperature of this plate material to the room temperature, then, irradiating laser beams to the bottom part of the V-shaped notch again and breaking it. CONSTITUTION:The laser beams 2 emitted from a laser beam oscillator 1 is bent by a reflector 3 downward, condensed by a condenser 4 stored in a nozzle head, irradiated to a thick steel plate 5 to form a rectilinear or nearly rectilinear notch 5a on the surface of the steel plate 5. Then, this preworked steel plate 5 is returned to the original point and carbon dioxide gas laser beams 2 irradiates the lower end of the notch 5a. Then, the steel plate 5 receives a quick thermal shock, a crack is generated from the bottom of the notch 5a, arrives at the lower surface to break the steel plate instantly. In this manner, a thick plate can be cut off easily even by a laser beam machine of small capacity.

Description

【発明の詳細な説明】 〔発明の目的〕 (産業上の利用分野) 本発明は、レーザ光による脆性材料板材の切断方法に関
する。
DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a method for cutting a brittle material plate using a laser beam.

(従来の技術) 従来、例えばモリブデンやタングステンなどの金属脆性
材料や、ガラス、石材などの非金属脆性材料の切断には
、ダイヤモンドカッタや砥石が使われ、厚い鋼板にはガ
ス切断が一般的で、最近は薄板用にレーザ光も使われて
いる。
(Conventional technology) Conventionally, diamond cutters and grindstones have been used to cut brittle metal materials such as molybdenum and tungsten, and brittle non-metal materials such as glass and stone, while gas cutting has been commonly used to cut thick steel plates. Recently, laser light has also been used for thin plates.

(発明が解決しようとする課W1) しかし、これらの加工は材料が厚くなると時間がかかる
。そのうえ、一般に切断寸法の精度が悪く、切断面も粗
い。更に、ガス切断の場合は、裏面にドロスが付いてそ
のままでは使えないことが多い。
(Problem W1 to be solved by the invention) However, these processes take time as the material becomes thicker. Moreover, the accuracy of cutting dimensions is generally poor and the cut surface is rough. Furthermore, in the case of gas cutting, there is often dross on the back side, making it unusable as is.

そのため、最近は上記のレーザ光による切断も行なわれ
ているが、最近実用化された大出力の炭酸ガスレーザ加
工機(出力10KW)でも、鋼板で1,2〜16.am
程度が限界であり、上記のガス切断と同様に切断面の粗
さ、ドロスの付着等の問題があるだけでなく、例えばS
S41材などの鋼板はその熱で亀裂が発生するおそれも
ある。
For this reason, cutting with the above-mentioned laser beam has recently been carried out, but even with the recently put into practical use a high-output carbon dioxide gas laser processing machine (output 10KW), a steel plate can be cut with a cutting speed of 1.2 to 16 kW. am
As with gas cutting, there are problems such as roughness of the cut surface and adhesion of dross.
Steel plates such as S41 material may crack due to the heat.

そこで、本発明の目的は、・脆性材料の板材を厚さに無
関係に小さなエネルギーで容易に早く切断できる脆性材
料板材のレーザ切断方法を得ることである。
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to obtain a laser cutting method for a brittle material plate that can easily and quickly cut a brittle material plate regardless of its thickness with a small amount of energy.

【発明の構成〕[Structure of the invention]

(課題を解決するための手段と作用) 本発明は、脆性材料の板材をレーザ光でほぼ直線に切断
する方法において、まず、レーザ光で板材の片面にV状
の切り欠きを設け、次いでこの板材を常温に下げた後、
再度レーザ光をV状の切り欠きの底部に照射して破断す
ることにより、小容量のレーザ加工機で板厚に関係なく
容易に早く切断することのできる脆性材料板材のレーザ
切断方法である。
(Means and effects for solving the problem) The present invention is a method of cutting a plate made of a brittle material into a substantially straight line using a laser beam. First, a V-shaped notch is formed on one side of the plate using a laser beam, and then After cooling the board to room temperature,
This is a laser cutting method for a brittle material plate that can be easily and quickly cut by a small-capacity laser processing machine regardless of the plate thickness by irradiating the bottom of the V-shaped notch with laser light again to break it.

(実施例) 以下、本発明の脆性材料板材のレーザ切断方法の一実施
例を図面を参照して説明する。
(Example) Hereinafter, an example of the laser cutting method for a brittle material plate according to the present invention will be described with reference to the drawings.

第1図において、レーザ発振器1から出射されたレーザ
光2は、図示しない伝送路に設けられた反射ミラー3で
下方に曲げられ、図示しないノズルヘッドに収納された
集光ミラー4で集光されて図示しないNCテーブル上の
厚い鋼板5に照射され、直線又はほぼ直線の切欠き5a
を鋼板5の表面に形成する。そして、この切り欠き5a
の深さは、本発明者らの実験結果では鋼板5の厚さの1
0%程度が好ましい。(注;あまり深いと鋼板5に脆性
による亀裂ができるおそれがある。) 次に、この前加工された鋼板5を図示しないNCテーブ
ルで原点に戻し、切欠きに使ったNCテープで駆動し出
力soowの炭酸ガスレーザ光2を切欠き5aの下端に
照射する。
In FIG. 1, a laser beam 2 emitted from a laser oscillator 1 is bent downward by a reflection mirror 3 provided in a transmission path (not shown), and is focused by a condensing mirror 4 housed in a nozzle head (not shown). A thick steel plate 5 on an NC table (not shown) is irradiated with a straight or almost straight notch 5a.
is formed on the surface of the steel plate 5. And this notch 5a
According to the experimental results of the present inventors, the depth is 1 of the thickness of the steel plate 5.
Approximately 0% is preferable. (Note: If the depth is too deep, cracks may occur in the steel plate 5 due to brittleness.) Next, the previously processed steel plate 5 is returned to its origin using an NC table (not shown), and is driven by the NC tape used for the notch to output. The lower end of the notch 5a is irradiated with a carbon dioxide gas laser beam 2 of a low temperature.

すると、鋼板5は急激な熱衝撃で第2図に示すように、
切欠き5aの底から亀裂6が発生して下面に達し、瞬時
に破断する。
Then, the steel plate 5 undergoes a sudden thermal shock, as shown in FIG.
A crack 6 occurs from the bottom of the notch 5a, reaches the lower surface, and breaks instantly.

したがって、この加工方法によれば、従来できなかった
30mn+程度の鋼板でも5Kli1級のレーザ加工機
で容易に切断できる。
Therefore, according to this processing method, even a steel plate of about 30 mm+, which could not be cut conventionally, can be easily cut with a 5Kli1 class laser processing machine.

第3図は本発明の脆性材料板材のレーザ切断方法の他の
実施例を示す。
FIG. 3 shows another embodiment of the laser cutting method for a brittle material plate according to the present invention.

第3図において、直線状の切欠き5aを形成した鋼板5
の下面には、切欠き5aの垂線から左右に等間隔に丸棒
の治具7aが敷かれ、上面左右には同じく等間隔に丸棒
の治具7bが設けられ、あらかじめ又はレーザ光照射開
始と同時に治具7b上に荷重を印加して板材5の上面に
引張り応力を付加する。
In FIG. 3, a steel plate 5 with a linear notch 5a formed therein.
On the bottom surface, round bar jigs 7a are placed at equal intervals left and right from the perpendicular line of the notch 5a, and on the left and right of the top surface, round bar jigs 7b are placed at equal intervals. At the same time, a load is applied on the jig 7b to apply tensile stress to the upper surface of the plate material 5.

この方法は、第2図の応力を加えない方法に比べて切欠
き5aが浅くても、又、加工時のレーザ光1の強度が弱
くても破断てきる利点がある。
This method has the advantage that it can break even if the notch 5a is shallow or the intensity of the laser beam 1 during processing is weak compared to the method shown in FIG. 2 in which stress is not applied.

第4図は、本発明の脆性材料板材のレーザ切断方法の異
なる他の実施例を示す。第4図においては、第3図の他
に、これらが氷水、ドライアイス又は液体窒素などの冷
媒8が満たされた容器9に入れられ、板材5は冷やされ
ている。
FIG. 4 shows another embodiment of the laser cutting method for a brittle material plate according to the present invention. In FIG. 4, in addition to FIG. 3, the plates 5 are cooled by being placed in a container 9 filled with a refrigerant 8 such as ice water, dry ice, or liquid nitrogen.

この場合は、第3図の方法よりも更に熱衝撃が大きくな
るので、より弱いレーザ光でより厚い材料を破断てきる
。なお、この方法で鋼材を切断するときには、鋼材の低
温脆性を生じる遷移温度(構造用炭素鋼で約−40℃)
以下に冷やすと、極めて容易に破断する。
In this case, the thermal shock is even greater than in the method shown in FIG. 3, so that a weaker laser beam can break a thicker material. When cutting steel materials using this method, the transition temperature (approximately -40°C for structural carbon steel) that causes low-temperature embrittlement of the steel material is required.
It breaks very easily when cooled below.

なお、この冷却方法は、第2図のように板材5の上面に
に引張り応力を付加しない方法にも適用できる。
Note that this cooling method can also be applied to a method in which no tensile stress is applied to the upper surface of the plate material 5 as shown in FIG.

〔発明の効果〕〔Effect of the invention〕

以上、本発明の脆性材料板材のレーザ切断方法によれば
、脆性材料の板材の片面に、まず前加工としてのV状の
切り欠きを設け、この板材を常温に戻した後に再度レー
ザ光をV状の切り欠きの底部に照射して板材の脆性を利
用して切断したので、小容量のレーザ加工機でも厚板を
容易に切断することのできる脆性材料板材のレーザ切断
方法を得ることができる。
As described above, according to the laser cutting method for a brittle material plate of the present invention, a V-shaped notch is first provided as a pre-processing on one side of a brittle material plate, and after the plate is returned to room temperature, the laser beam is applied to the V-shaped cutout again. Since the cutting was performed by irradiating the bottom of the shaped notch and taking advantage of the brittleness of the plate material, it is possible to obtain a laser cutting method for brittle material plates that can easily cut thick plates even with a small-capacity laser processing machine. .

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の脆性材料板材のレーザ切断方法の一実
施例を示す図、第2図〜第4図は本発明の脆性材料板材
のレーザ切断方法の他の実施例を示す図である。 1・・・レーザ発振器 2・・・レーザ光 5・・・脆性材料の板材 5a・・・切り欠き (8733)代理人弁理士 猪 股 祥 晃(ほか1名
)嬉 図 第 図 A 第 図 第 図
FIG. 1 is a diagram showing one embodiment of the laser cutting method for a brittle material plate according to the present invention, and FIGS. 2 to 4 are diagrams showing other embodiments of the laser cutting method for a brittle material plate according to the present invention. . 1...Laser oscillator 2...Laser light 5...Brittle material plate 5a...Notch (8733) Representative patent attorney Yoshiaki Inomata (and 1 other person) Hizuzu Figure A Figure figure

Claims (1)

【特許請求の範囲】 脆性材料の板材にレーザ光を照射して切断する脆性材料
板材のレーザ切断方法において、 前記板材の切断線に沿って前記レーザ光でV字状の切り
欠き部を設け、次いでこの板材を常温以下の温度に下げ
前記切り欠き部に再度レーザ光を照射して前記切断線に
沿って破断させる脆性材料板材のレーザ切断方法。
[Claims] A method for laser cutting a brittle material plate by irradiating a laser beam onto the brittle material plate, comprising: providing a V-shaped notch with the laser beam along a cutting line of the plate; A method for laser cutting a brittle material plate, in which the plate is then lowered to room temperature or lower, and the cutout portion is irradiated with laser light again to break along the cutting line.
JP63164947A 1988-07-04 1988-07-04 Laser cutting method for plate of brittle material Pending JPH0215892A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63164947A JPH0215892A (en) 1988-07-04 1988-07-04 Laser cutting method for plate of brittle material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63164947A JPH0215892A (en) 1988-07-04 1988-07-04 Laser cutting method for plate of brittle material

Publications (1)

Publication Number Publication Date
JPH0215892A true JPH0215892A (en) 1990-01-19

Family

ID=15802879

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63164947A Pending JPH0215892A (en) 1988-07-04 1988-07-04 Laser cutting method for plate of brittle material

Country Status (1)

Country Link
JP (1) JPH0215892A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03489A (en) * 1989-05-24 1991-01-07 Nippon Sekigaisen Kogyo Kk Cracking method and cracking device for brittle material by using laser for which concentrated thermal stress generated in work is used as heat source
US5767479A (en) * 1994-02-28 1998-06-16 Mitsubishi Denki Kabushiki Kaisha Laser beam machining apparatus and corresponding method which employs a laser beam to pretreat and machine a workpiece

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03489A (en) * 1989-05-24 1991-01-07 Nippon Sekigaisen Kogyo Kk Cracking method and cracking device for brittle material by using laser for which concentrated thermal stress generated in work is used as heat source
US5767479A (en) * 1994-02-28 1998-06-16 Mitsubishi Denki Kabushiki Kaisha Laser beam machining apparatus and corresponding method which employs a laser beam to pretreat and machine a workpiece
US5889253A (en) * 1994-02-28 1999-03-30 Mitsubishi Denki Kabushiki Kaisha Laser beam machining apparatus and method which employs a laser beam to pretreat and machine a workpiece
US6040549A (en) * 1994-02-28 2000-03-21 Mitsubishi Denki Kabushiki Kaisha Laser beam machining apparatus and corresponding method which employs a laser beam to pretreat and machine a workpiece

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