JPH0215899U - - Google Patents
Info
- Publication number
- JPH0215899U JPH0215899U JP9376588U JP9376588U JPH0215899U JP H0215899 U JPH0215899 U JP H0215899U JP 9376588 U JP9376588 U JP 9376588U JP 9376588 U JP9376588 U JP 9376588U JP H0215899 U JPH0215899 U JP H0215899U
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- punching
- die
- cutting
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004080 punching Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims 2
- 230000001105 regulatory effect Effects 0.000 claims 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Description
図面は本考案の一実施例を示すもので、第１図
は第２図の―線に沿う矢視図、第２図は上型
の下面図、第３図は上型の昇降部の要部の断面図
、第４図は打ち抜き用刃物によつて打ち抜かれた
パターンの平面図、第５図は打ち抜き後、切り込
みが入れられたパターンの平面図である。
１……上型、２……支持部、３……昇降部、４
……支持ボルト、５……圧縮ばね、６……ポンチ
（打ち抜き用刃物）、７……貫通孔、８……溝、
９……トムソン刃（切り込み用刃物）、１１……
下型、１２……上面部材、１３……ダイ、２０…
…フレキシブルプリント基板、２１，２２……広
幅部、２３……細幅部、２４〜２７……貫通孔。
The drawings show one embodiment of the present invention, and FIG. 1 is a view taken along the line - in FIG. 2, FIG. 2 is a bottom view of the upper mold, and FIG. FIG. 4 is a plan view of a pattern punched out with a punching knife, and FIG. 5 is a plan view of a pattern with incisions made after punching. 1...Upper mold, 2...Supporting part, 3...Elevating part, 4
... Support bolt, 5 ... Compression spring, 6 ... Punch (punching knife), 7 ... Through hole, 8 ... Groove,
9...Thomson blade (cutting tool), 11...
Lower mold, 12... Upper surface member, 13... Die, 20...
...Flexible printed circuit board, 21, 22...Wide width part, 23...Narrow width part, 24-27...Through hole.
Claims (1)
ことにより前記シートから所定の平面形状のフレ
キシブルプリント基板を打ち抜く型において、被
加工物に接近する方向および離間する方向へ移動
可能に設けられた上型の下面に、前記被加工物に
貫通孔を形成する打ち抜き用刃物と、前記被加工
物を貫通しない切り込みをフレキシブル基板の輪
郭に沿つて形成する切り込み用刃物とを設けてな
り、前記切り込み用刃物は、前記打ち抜き用刃物
から前記上型の下面に沿つて一方向へ所定距離だ
け離れた位置に、前記打ち抜き用刃物より前方に
先端部を突出させてかつ突出方向と反対方向への
移動を弾性部材により規制して設けられるととも
に、前記所定距離の平行移動によつて前記貫通孔
に少なくとも一部が重なり得る切断線を有するこ
とを特徴とするフレキシブル基板用打ち抜き型。 In a die that punches a flexible printed circuit board of a predetermined planar shape from the sheet by moving in a direction intersecting a sheet-shaped workpiece, a top plate is provided so as to be movable in a direction toward and away from the workpiece. A punching blade for forming a through hole in the workpiece and a cutting blade for forming a cut along the contour of the flexible substrate that does not penetrate the workpiece are provided on the lower surface of the mold, The cutting tool has a distal end protruding forward from the punching tool at a position a predetermined distance away from the punching tool in one direction along the lower surface of the upper die, and is configured to move in a direction opposite to the projecting direction. A punching die for a flexible substrate, characterized in that the cutting line is regulated by an elastic member and has a cutting line that can at least partially overlap the through hole by parallel movement of the predetermined distance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9376588U JPH0215899U (en) | 1988-07-15 | 1988-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9376588U JPH0215899U (en) | 1988-07-15 | 1988-07-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0215899U true JPH0215899U (en) | 1990-01-31 |
Family
ID=31318239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9376588U Pending JPH0215899U (en) | 1988-07-15 | 1988-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0215899U (en) |
-
1988
- 1988-07-15 JP JP9376588U patent/JPH0215899U/ja active Pending
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