JPH0216403U - - Google Patents
Info
- Publication number
- JPH0216403U JPH0216403U JP9445188U JP9445188U JPH0216403U JP H0216403 U JPH0216403 U JP H0216403U JP 9445188 U JP9445188 U JP 9445188U JP 9445188 U JP9445188 U JP 9445188U JP H0216403 U JPH0216403 U JP H0216403U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- land
- circuit board
- printed circuit
- conductive pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Magnetic Heads (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図乃至第７図は本考案に係る磁気ヘツド構
体の実施例を説明するためのもので、第１図はダ
ブルアジマスヘツド用の磁気ヘツド構体を示す斜
視図、第２図は第１図の平面図、第３図は切込み
溝形成前のランド部の予備半田を示す傾斜図、第
４図は切込み溝形成後のランド部の予備半田を示
す斜視図、第５図は線材のランド部への半田接続
状態を示す部分拡大平面図、第６図はランド部の
予備半田に形成する切込み溝の変形例を示す断面
図、第７図は第２図の切込み溝の方向を変更した
例を示す平面図である。第８図は磁気ヘツド構体
の具体例を示す斜視図、第９図は第８図ヘツドの
平面図、第１０図は線材のランド部への半田接続
要領を説明するための磁気ヘツド構体の平面図、
第１１図は線材のランド部への半田接続が不均一
である磁気ヘツド構体を示す部分拡大平面図であ
る。
１……ヘツドベース、２，３……コアチツプ、
４……プリント基板、５ａ，５ｂ，６ａ，６ｂ…
…導電パターン、７ａ，７ｂ，８ａ，８ｂ……ラ
ンド部、９，１０……線材、１５ａ，１５ｂ，１
６ａ，１６ｂ……予備半田、１８ａ，１８ｂ，１
９ａ，１９ｂ……切込み溝。
1 to 7 are for explaining an embodiment of the magnetic head structure according to the present invention, FIG. 1 is a perspective view showing the magnetic head structure for a double azimuth head, and FIG. 2 is a view similar to that shown in FIG. FIG. 3 is a perspective view showing preliminary soldering on the land before the cut grooves are formed, FIG. 4 is a perspective view showing preliminary soldering on the land after the cut grooves are formed, and FIG. 5 is the land on the wire rod. FIG. 6 is a cross-sectional view showing a modification of the cut groove formed in the preliminary solder of the land portion, and FIG. 7 is an example in which the direction of the cut groove in FIG. 2 is changed. FIG. FIG. 8 is a perspective view showing a specific example of the magnetic head structure, FIG. 9 is a plan view of the head shown in FIG. figure,
FIG. 11 is a partially enlarged plan view showing a magnetic head assembly in which the solder connection of the wire to the land portion is uneven. 1... Head base, 2, 3... Core chip,
4...Printed circuit board, 5a, 5b, 6a, 6b...
... Conductive pattern, 7a, 7b, 8a, 8b... Land portion, 9, 10... Wire rod, 15a, 15b, 1
6a, 16b...Preliminary solder, 18a, 18b, 1
9a, 19b... Cut groove.
Claims (1)
ツドベース基部にプリント基板を夫々貼着固定し
、上記コアチツプに巻装した線材を導出してプリ
ント基板上の導電パターンのランド部に半田接続
したものにおいて、 上記導電パターンのランド部に盛り上がり形状
の予備半田を形成し、この予備半田に線材を嵌入
させてその位置及び方向を規制する切込み溝を設
けたことを特徴とする磁気ヘツド構体。[Claims for Utility Model Registration] A core chip is attached and fixed to the tip of the head base, a printed circuit board is fixed to the base of the head base, and the wire wound around the core chip is led out and attached to the land of the conductive pattern on the printed circuit board. A magnetic head connected by solder, characterized in that pre-solder in the shape of a bulge is formed on the land portion of the conductive pattern, and a cut groove is provided for inserting a wire into the pre-solder to regulate its position and direction. Structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9445188U JPH0216403U (en) | 1988-07-15 | 1988-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9445188U JPH0216403U (en) | 1988-07-15 | 1988-07-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0216403U true JPH0216403U (en) | 1990-02-01 |
Family
ID=31318975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9445188U Pending JPH0216403U (en) | 1988-07-15 | 1988-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0216403U (en) |
-
1988
- 1988-07-15 JP JP9445188U patent/JPH0216403U/ja active Pending