JPH02166152A - Liquid epoxy resin composition for semiconductor sealing - Google Patents
Liquid epoxy resin composition for semiconductor sealingInfo
- Publication number
- JPH02166152A JPH02166152A JP32085988A JP32085988A JPH02166152A JP H02166152 A JPH02166152 A JP H02166152A JP 32085988 A JP32085988 A JP 32085988A JP 32085988 A JP32085988 A JP 32085988A JP H02166152 A JPH02166152 A JP H02166152A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- formulas
- weight
- parts
- liquid epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 17
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 title claims abstract description 15
- 239000004065 semiconductor Substances 0.000 title claims description 8
- 238000007789 sealing Methods 0.000 title description 6
- 239000003822 epoxy resin Substances 0.000 claims abstract description 25
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 25
- 239000000945 filler Substances 0.000 claims abstract description 16
- 239000007787 solid Substances 0.000 claims abstract description 11
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 claims abstract description 10
- 239000000126 substance Substances 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 7
- 239000000377 silicon dioxide Substances 0.000 abstract description 3
- 239000002245 particle Substances 0.000 abstract description 2
- 150000001875 compounds Chemical class 0.000 abstract 2
- 238000000034 method Methods 0.000 description 9
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 5
- 239000003063 flame retardant Substances 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 238000009472 formulation Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000002689 soil Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- 241000721047 Danaus plexippus Species 0.000 description 1
- 208000019651 NDE1-related microhydranencephaly Diseases 0.000 description 1
- 241000946381 Timon Species 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、低粘度、低熱膨張係数の高信頼性を有する難
燃性の半導体対土用液状エポキシ樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a highly reliable flame-retardant liquid epoxy resin composition for use in semiconductors and soils, having a low viscosity and a low coefficient of thermal expansion.
（従来の技術）
有機系、無機系絶縁基板及び金属系絶縁基板にＬＳＩチ
ップを搭載した構造体、例えばピングリフトアレイ、リ
ードレスナツプキャリア或いは基板にＬＳＩチップを直
付するチップオンボード等の樹脂封止材には液状エポキ
シ樹脂が用いられ、その封止方法はドリッピング法、キ
ャスティング法、ボッティング法により行われている。(Prior art) Structures in which LSI chips are mounted on organic or inorganic insulating substrates or metal insulating substrates, such as pin lift arrays, leadless snap carriers, or chip-on-boards in which LSI chips are directly attached to substrates. A liquid epoxy resin is used as the resin sealant, and the sealing method is a dripping method, a casting method, or a botting method.
こうした封止方法による封止作業性は、封止材の粘度に
大きく影響される。即ち、ボイドレス、良好な流動性（
拡がり性）などには低粘度な封止材が好適である。それ
には充填剤の充填量の減少が効果的である。The sealing workability of such a sealing method is greatly influenced by the viscosity of the sealing material. i.e. voidless, good fluidity (
A low-viscosity sealing material is suitable for such reasons as spreading properties. For this purpose, reducing the amount of filler is effective.
しかし、一方でＬＳＩチップは高集積化、高密度化と相
まって大型化が図られている。このため信頼性試験の一
環である熱衝撃試験による封止剤のクラックの発生がこ
れまで以上に問題となってきている。加えて、難燃化の
要求も強くなってきている。However, on the other hand, LSI chips are becoming larger as they become more highly integrated and densely packed. For this reason, the occurrence of cracks in sealants during thermal shock tests, which are part of reliability tests, has become more of a problem than ever. In addition, demands for flame retardancy are becoming stronger.
こうした問題点の対策としては、封止材をＬＳＩチップ
や基板の熱膨張係数に合わせることが必要であり、それ
には充填剤の高率充填が必須である。しかし、そのため
に封止材の粘度は上昇し封止作業性が低下する結果とな
る。また、難燃化の処方の一つとしては臭素化エポキシ
樹脂の添加が効果的であるが、添加する樹脂の外観が固
形のため、これも粘度上昇の原因となる。As a countermeasure for these problems, it is necessary to match the sealing material to the thermal expansion coefficient of the LSI chip or the substrate, which requires high-rate filling with filler. However, this results in an increase in the viscosity of the sealing material and a decrease in sealing workability. Furthermore, although the addition of a brominated epoxy resin is effective as one of the flame retardant formulations, since the added resin has a solid appearance, this also causes an increase in viscosity.
従って、低粘度、低熱膨張係数の高信頼性を有する難燃
性の半導体対土用液状エポキシ樹脂組成物の開発が課題
となっている。Therefore, it has become a challenge to develop a flame-retardant liquid epoxy resin composition for semiconductors and soil that has low viscosity, low coefficient of thermal expansion, and high reliability.
低粘度で且つ低熱膨張係数の液状エポキシ樹脂封止材は
、低粘度なエポキシ樹脂、硬化剤が検討されているが、
一定の限界がある。Low viscosity epoxy resins and curing agents are being considered for liquid epoxy resin encapsulants with low viscosity and low coefficient of thermal expansion.
There are certain limits.
本発明は新たな観点でこうした問題点を解決しようとす
るもので、低粘度、低膨張係数の高信頼性を有する難燃
性の半導体封止用液状エポキシ樹脂組成物を提供するこ
とを目的とする。The present invention attempts to solve these problems from a new perspective, and aims to provide a flame-retardant liquid epoxy resin composition for semiconductor encapsulation that has low viscosity, low expansion coefficient, and high reliability. do.
本発明者らは、前記課題を解決するために鋭意研究を行
った結果、特定の種類のエポキシ樹脂を組み合わせ、こ
れに特定に形状の充填剤を配合することにより前記目的
が達成されることを見出し本発明を完成するに至った。As a result of intensive research to solve the above problem, the present inventors have found that the above object can be achieved by combining a specific type of epoxy resin and adding a filler of a specific shape to the epoxy resin. Heading: The present invention has been completed.
すなわち、本発明は液状エポキシ樹脂に、固形臭素化エ
ポキシ樹脂、環状脂肪族エポキシ樹脂及び球形充填剤を
配合してなることを特徴とする半導体封止用液状エポキ
シ樹脂組成物を提供するものである。That is, the present invention provides a liquid epoxy resin composition for semiconductor encapsulation, which comprises a liquid epoxy resin mixed with a solid brominated epoxy resin, a cycloaliphatic epoxy resin, and a spherical filler. .
本発明においては、低粘度化の課題に対しては球形充填
剤を用いることで解決を図った。すなわち、従来の角形
・不定形充填剤を球形にすることで細密充填を可能とし
たもので、球形充填剤としては平均粒径２０〜４０ミク
ロン・比表面積０．５〜１．０ｒｒｆ／ｇが好ましく用
いられる。ここで、比表面積は液体窒素の温度における
窒素ガスの吸着を用いたＢｒｕｎａｕｅｒ、 Ｅｍｅｔ
ｔ及びＴｅ１ｌｏｒにより堤案されたＢＥＡＴ法により
測定する。In the present invention, the problem of lowering the viscosity was solved by using a spherical filler. In other words, by making the conventional prismatic/amorphous filler into a spherical shape, it is possible to achieve close packing.The spherical filler has an average particle diameter of 20 to 40 microns and a specific surface area of 0.5 to 1.0 rrf/g. Preferably used. Here, the specific surface area is determined by Brunauer and Emet using adsorption of nitrogen gas at the temperature of liquid nitrogen.
It is measured by the BEAT method proposed by Tsutsumi et al.
球形充填剤は、全エポキシ樹脂１００重量部に対して４
００〜７００重量部配合され置部充填量が７００重量部
を超えると高粘度による封止作業性が悪くなり、４００
重量部未満では熱膨張係数の上昇に伴う熱衝撃試験によ
るクラックの発生などの問題を生ずることがある。The spherical filler is 4 parts by weight based on 100 parts by weight of the total epoxy resin.
If 00 to 700 parts by weight are mixed and the filling amount exceeds 700 parts by weight, sealing workability will deteriorate due to high viscosity.
If the amount is less than 1 part by weight, problems such as the occurrence of cracks in thermal shock tests may occur due to an increase in the coefficient of thermal expansion.
液状エポキシ樹脂としてはとくに限定はないが、例えば
ビスフェノールＡ型エポキシ樹脂が好適に用いられる。Although there are no particular limitations on the liquid epoxy resin, for example, bisphenol A type epoxy resin is preferably used.
また、難燃化には次に示すような固形臭素化エポキシ樹
脂（１）及び（２）が好ましく用いられる。Further, solid brominated epoxy resins (1) and (2) shown below are preferably used for flame retardation.
また、液状化には次に示すような環状脂肪族エポキシ樹
脂（３）、（４）及び（５）が好ましく用いられる。Further, for liquefaction, the following cycloaliphatic epoxy resins (3), (4) and (5) are preferably used.
Ｈ３
固形臭素化エポキシ樹脂は熱的特性（２次転移温度）、
耐湿性を高めるために、また、環状脂肪族エポキシ樹脂
は固形臭素化エポキシ樹脂による粘度上昇の緩和・抑制
と組成系全体の低粘度化を図るために配合されている。H3 Solid brominated epoxy resin has thermal properties (secondary transition temperature),
In order to improve moisture resistance, the cycloaliphatic epoxy resin is blended to alleviate and suppress the increase in viscosity caused by the solid brominated epoxy resin and to lower the viscosity of the entire composition system.
固形臭素化エポキシ樹脂、環状脂肪族エポキシ樹脂はエ
ポキシ樹脂全量に対してそれぞれ１０〜３０．２０〜４
０重量％配合される。Solid brominated epoxy resin and cycloaliphatic epoxy resin each have a content of 10 to 30 and 20 to 4 based on the total amount of epoxy resin.
0% by weight is added.
上記エポキシ樹脂に用いられる硬化剤としては、酸無水
物が好適である０例えば無水テトラヒドロフタル酸、無
水メチルテトラヒドロフタル酸、無水メチルエンドメチ
レンテトラヒドロフタル酸が好ましい０球形充填剤はシ
リカ、アルミナが効果的であるが、好ましくはシリカで
ある。その他、硬化促進剤、着色剤、カップリング剤な
どを適宜配合する事が出来る。かかる組成物は、らい清
機、ニーダ−、ボールミルなどを用いて混合し、目的と
する半導体封止用液状樹脂組成物とする。As the curing agent used in the above epoxy resin, acid anhydrides are preferred.For example, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and methylendomethylenetetrahydrophthalic anhydride are preferred.As for the spherical filler, silica and alumina are effective. However, silica is preferred. In addition, curing accelerators, colorants, coupling agents, and the like can be appropriately blended. Such a composition is mixed using a rinsing machine, a kneader, a ball mill, etc. to obtain the desired liquid resin composition for semiconductor encapsulation.
本発明においては、球形充填剤１．固形臭素化エポキシ
樹脂及び環状脂肪族エポキシ樹脂を使用した結果、低粘
度化が図れ、熱的特性（２次転移温度）、耐湿性も向上
するとか出来た。In the present invention, the spherical filler 1. As a result of using a solid brominated epoxy resin and a cycloaliphatic epoxy resin, it was possible to lower the viscosity and improve thermal properties (secondary transition temperature) and moisture resistance.
以下実施例に基づき本発明を説明する。 The present invention will be explained below based on Examples.
実施例１
ＥＳＢ−４００（臭素化エポキシ樹脂・住友化学工業株
式会社製商品名）１５０重量部、ＥＲＬ−４２０６（環
状脂肪施工、ボキシ樹脂・ユニオンカーバイド日本株式
会社製商品名）２００重量部をフラスコなどを用いて１
００°Ｃ／６０分間加熱混融した後、室温に冷却する。Example 1 150 parts by weight of ESB-400 (brominated epoxy resin, trade name manufactured by Sumitomo Chemical Industries, Ltd.) and 200 parts by weight of ERL-4206 (cyclic fat construction, boxy resin, trade name manufactured by Union Carbide Japan Co., Ltd.) were placed in a flask. 1 using etc.
After heating and melting at 00°C for 60 minutes, the mixture is cooled to room temperature.
この混融樹脂を５０重量部、エピコート８２Ｂ （ビス
フェノールＡ型エポキシ樹脂・油化シェルエポキシ株式
会社製商品名）５０重量部、ＭＨＡＣ−ＨＲ（無水メチ
ルエンドメチレンテトラヒドロフタル酸・日立化成工業
株式会社製商品名）９０重量部、キュアゾール２４ＥＭ
Ｉ（イミダゾール・四国化成工業株式会社製商品名）１
．５重量部、ＫＢＭ−４０３（カップリング剤・信越化
学工業株式会社製商品名）５．０重量部、ＰＡＴＯＸ−
Ｈ（三酸化７７チモン・日本精鉱株式会社製商品名）５
．０重量部、モナーク＃８００（着色剤・キャブラック
株式会社製商品名）０．８重量部、５Ｅ−３０（充填剤
・徳山曹達株式会社製商品名）４８０重量部をらい潰機
により、４０分間混合し試験に供した。50 parts by weight of this mixed resin, 50 parts by weight of Epikote 82B (bisphenol A type epoxy resin, trade name manufactured by Yuka Shell Epoxy Co., Ltd.), MHAC-HR (methylendomethylenetetrahydrophthalic anhydride, manufactured by Hitachi Chemical Co., Ltd.) Product name) 90 parts by weight, Curesol 24EM
I (imidazole, product name manufactured by Shikoku Kasei Kogyo Co., Ltd.) 1
．． 5 parts by weight, KBM-403 (coupling agent, trade name manufactured by Shin-Etsu Chemical Co., Ltd.) 5.0 parts by weight, PATOX-
H (Timon trioxide 77, trade name manufactured by Nippon Senko Co., Ltd.) 5
．． 0 parts by weight, 0.8 parts by weight of Monarch #800 (coloring agent, trade name manufactured by Cabrac Co., Ltd.), and 480 parts by weight of 5E-30 (filler, trade name manufactured by Tokuyama Soda Co., Ltd.) were mixed into 40 parts by weight using a crusher. The mixture was mixed for a minute and then tested.
実施例２
ＳＥ−３０，７００重量部とした以外は実施例１と同様
の配合及び方法で材料を作成し試験に供した。Example 2 A material was prepared and tested using the same formulation and method as in Example 1, except that SE-30,700 parts by weight was used.
比較例１
ＲＤ−８（充填剤：角形・０ｕ森株式会社製商品名４８
０重量部とした以外は実施例１と同様の配合及び方法で
材料を作成し試験に供した。Comparative Example 1 RD-8 (filler: square, product name 48 manufactured by 0u Mori Co., Ltd.
A material was prepared using the same formulation and method as in Example 1, except that the amount was 0 parts by weight, and was subjected to a test.
比較例２
ＢＲＯＣ（臭素化エイキシ樹脂：液状・日本火薬株式会
社製商品名）３０重量部、ＥＲＬ−４２０６，２０重量
部とした以外は実施例１と同様の配合及び方法で材料を
作成し試験に供した。Comparative Example 2 A material was prepared and tested using the same formulation and method as in Example 1, except that 30 parts by weight of BROC (brominated epoxy resin: liquid, trade name manufactured by Nippon Kapaku Co., Ltd.) and 20 parts by weight of ERL-4206 were used. Served.
以下余白
〔発明の効果〕
本発明により低粘度、低熱膨張係数の高信頼性を有する
難燃性液状エポキシ樹脂組成物を得ることができた。Margins below [Effects of the Invention] According to the present invention, a highly reliable flame-retardant liquid epoxy resin composition with low viscosity and low coefficient of thermal expansion could be obtained.
Claims (1)
状脂肪族エポキシ樹脂及び球形充填剤を配合してなるこ
とを特徴とする半導体封止用液状エポキシ樹脂組成物。 ２、固形臭素化エポキシ樹脂が下記（１）及び（２）式
で表される臭素化エポキシ樹脂から選ばられるエポキシ
樹脂であり、環状脂肪族エポキシ樹脂が下記（３）、（
４）及び（５）式で表される環状脂肪族エポキシ樹脂か
ら選ばれるエポキシ樹脂であり、球形充填剤が、全エポ
キシ樹脂１００重量部に対して４００〜７００重量部配
合されている請求項１記載の半導体封止用液状エポキシ
樹脂組成物。 （１）▲数式、化学式、表等があります▼ （２）▲数式、化学式、表等があります▼ （３）▲数式、化学式、表等があります▼ （４）▲数式、化学式、表等があります▼ （５）▲数式、化学式、表等があります▼[Scope of Claims] 1. A liquid epoxy resin composition for semiconductor encapsulation, comprising a liquid epoxy resin, a solid brominated epoxy resin, a cycloaliphatic epoxy resin, and a spherical filler. 2. The solid brominated epoxy resin is an epoxy resin selected from the brominated epoxy resins represented by the following formulas (1) and (2), and the cycloaliphatic epoxy resin is the epoxy resin represented by the following formulas (3) and (
Claim 1: The epoxy resin is selected from cycloaliphatic epoxy resins represented by formulas 4) and (5), and the spherical filler is blended in an amount of 400 to 700 parts by weight based on 100 parts by weight of the total epoxy resin. The liquid epoxy resin composition for semiconductor encapsulation described above. (1) ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (2) ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (3) ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (4) ▲ Numerical formulas, chemical formulas, tables, etc. Yes ▼ (5) ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32085988A JPH02166152A (en) | 1988-12-20 | 1988-12-20 | Liquid epoxy resin composition for semiconductor sealing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32085988A JPH02166152A (en) | 1988-12-20 | 1988-12-20 | Liquid epoxy resin composition for semiconductor sealing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02166152A true JPH02166152A (en) | 1990-06-26 |
Family
ID=18126051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32085988A Pending JPH02166152A (en) | 1988-12-20 | 1988-12-20 | Liquid epoxy resin composition for semiconductor sealing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02166152A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02209949A (en) * | 1989-02-09 | 1990-08-21 | Shin Etsu Chem Co Ltd | Epoxy resin composition and cured product for semiconductor encapsulation |
| JPH05222270A (en) * | 1992-02-07 | 1993-08-31 | Shin Etsu Chem Co Ltd | Liquid epoxy resin composition and cured product |
-
1988
- 1988-12-20 JP JP32085988A patent/JPH02166152A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02209949A (en) * | 1989-02-09 | 1990-08-21 | Shin Etsu Chem Co Ltd | Epoxy resin composition and cured product for semiconductor encapsulation |
| JPH05222270A (en) * | 1992-02-07 | 1993-08-31 | Shin Etsu Chem Co Ltd | Liquid epoxy resin composition and cured product |
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