JPH021670U - - Google Patents

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Publication number
JPH021670U
JPH021670U JP7908988U JP7908988U JPH021670U JP H021670 U JPH021670 U JP H021670U JP 7908988 U JP7908988 U JP 7908988U JP 7908988 U JP7908988 U JP 7908988U JP H021670 U JPH021670 U JP H021670U
Authority
JP
Japan
Prior art keywords
electronic components
lead wires
adhesive tape
mount
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7908988U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7908988U priority Critical patent/JPH021670U/ja
Publication of JPH021670U publication Critical patent/JPH021670U/ja
Pending legal-status Critical Current

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  • Packages (AREA)
  • Packaging Frangible Articles (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、この考案の実施例による電子部品の
テーピング構造を示す正面図、第２図はこの考案
の実施例で使用する接着テープを示す正面図であ
る。 １……電子部品、２……台紙、３……接着テー
プ、４……リード線、５……送り孔、６……接着
面。 FIG. 1 is a front view showing a taping structure for an electronic component according to an embodiment of this invention, and FIG. 2 is a front view showing an adhesive tape used in an embodiment of this invention. DESCRIPTION OF SYMBOLS 1... Electronic component, 2... Mounting paper, 3... Adhesive tape, 4... Lead wire, 5... Spread hole, 6... Adhesive surface.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 帯状の台紙に、同一端面に複数のリード線を備
えた多数の電子部品を等間隔で配置するとともに
、リード線を台紙の長手方向に対してほぼ直角に
載置し、両端付近にのみ接着面を有する接着テー
プを台紙に貼着して、接着テープ両端の接着面の
間に送り孔を設けたことを特徴とする電子部品の
テーピング構造。 A large number of electronic components with multiple lead wires on the same end surface are arranged at equal intervals on a strip-shaped mount, and the lead wires are placed almost perpendicular to the longitudinal direction of the mount, with adhesive surfaces only near both ends. 1. A taping structure for electronic components, characterized in that an adhesive tape having the following properties is adhered to a backing paper, and a feed hole is provided between the adhesive surfaces at both ends of the adhesive tape.
JP7908988U 1988-06-15 1988-06-15 Pending JPH021670U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7908988U JPH021670U (en) 1988-06-15 1988-06-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7908988U JPH021670U (en) 1988-06-15 1988-06-15

Publications (1)

Publication Number Publication Date
JPH021670U true JPH021670U (en) 1990-01-08

Family

ID=31303976

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7908988U Pending JPH021670U (en) 1988-06-15 1988-06-15

Country Status (1)

Country Link
JP (1) JPH021670U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5547119U (en) * 1978-09-22 1980-03-27
JPS5886798A (en) * 1981-11-19 1983-05-24 株式会社村田製作所 Electronic part series

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5547119U (en) * 1978-09-22 1980-03-27
JPS5886798A (en) * 1981-11-19 1983-05-24 株式会社村田製作所 Electronic part series

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