JPH02167743A - ポリノルボルネン積層体 - Google Patents

ポリノルボルネン積層体

Info

Publication number
JPH02167743A
JPH02167743A JP1202729A JP20272989A JPH02167743A JP H02167743 A JPH02167743 A JP H02167743A JP 1202729 A JP1202729 A JP 1202729A JP 20272989 A JP20272989 A JP 20272989A JP H02167743 A JPH02167743 A JP H02167743A
Authority
JP
Japan
Prior art keywords
polynorbornene
wiring board
polymer
copper
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1202729A
Other languages
English (en)
Japanese (ja)
Inventor
George M Benedikt
ジョージ　マーティン　ベネディクト
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Goodrich Corp
Original Assignee
BF Goodrich Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BF Goodrich Corp filed Critical BF Goodrich Corp
Publication of JPH02167743A publication Critical patent/JPH02167743A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/24—Layered products comprising a layer of synthetic resin characterised by the use of special additives using solvents or swelling agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0036—Heat treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/08—Impregnating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C08G61/04—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
    • C08G61/06—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds
    • C08G61/08—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds of carbocyclic compounds containing one or more carbon-to-carbon double bonds in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
    • C08J5/08—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/02—Coating on the layer surface on fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2365/00—Characterised by the use of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12542—More than one such component
    • Y10T428/12549—Adjacent to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3382—Including a free metal or alloy constituent
    • Y10T442/3415—Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the woven fabric]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/60—Nonwoven fabric [i.e., nonwoven strand or fiber material]
    • Y10T442/654—Including a free metal or alloy constituent
    • Y10T442/656—Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the nonwoven fabric]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP1202729A 1988-08-04 1989-08-04 ポリノルボルネン積層体 Pending JPH02167743A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US228034 1988-08-04
US07/228,034 US4910077A (en) 1988-08-04 1988-08-04 Polynorbornene laminates and method of making the same

Publications (1)

Publication Number Publication Date
JPH02167743A true JPH02167743A (ja) 1990-06-28

Family

ID=22855487

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1202729A Pending JPH02167743A (ja) 1988-08-04 1989-08-04 ポリノルボルネン積層体

Country Status (5)

Country Link
US (1) US4910077A (de)
EP (1) EP0353766A3 (de)
JP (1) JPH02167743A (de)
CN (1) CN1022746C (de)
CA (1) CA1293434C (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998005715A1 (en) * 1996-08-07 1998-02-12 Nippon Zeon Co., Ltd. Cross-linking polymer composition
JP2010111881A (ja) * 2003-01-31 2010-05-20 Nippon Zeon Co Ltd 環状オレフィン系樹脂フィルムおよび環状オレフィン系ポリマーシートまたはフィルムの製造方法
JP2016017089A (ja) * 2014-07-04 2016-02-01 三井化学株式会社 硬化性樹脂組成物、添加剤用組成物およびその用途
JPWO2019142570A1 (ja) * 2018-01-17 2021-01-28 京セラ株式会社 有機絶縁体、金属張積層板および配線基板

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5274026A (en) * 1988-09-23 1993-12-28 The B. F. Goodrich Company Curable polycycloolefin resin solutions, their use in making printed circuit boards and the boards so made
CA2005690A1 (en) * 1988-12-23 1990-06-23 George M. Benedikt Polynorbornene prepreg laminated to conductive surface
US4923734A (en) * 1988-12-23 1990-05-08 The B. F. Goodrich Company Laminates of polynorbornene and polyolefins derived from C2 -C4 monomers
US5071701A (en) * 1989-11-22 1991-12-10 B. F. Goodrich Corporation Copolymer for use in preparing prepregs, printed circuit wiring boards prepared from such prepregs and processes for preparing such printed circuit wiring boards
JP3284558B2 (ja) * 1991-03-29 2002-05-20 日本ゼオン株式会社 熱可塑性飽和ノルボルネン系樹脂シート及びその製造方法
US5153986A (en) * 1991-07-17 1992-10-13 International Business Machines Method for fabricating metal core layers for a multi-layer circuit board
US5289630A (en) * 1991-07-22 1994-03-01 Macdermid, Incorporated Process for fabricating multilayer printed circuits
JP2721632B2 (ja) * 1992-02-25 1998-03-04 松下電工株式会社 回路板の銅回路の処理方法
DE4233021A1 (de) * 1992-10-01 1994-04-07 Huels Chemische Werke Ag Organosilanpolykondensate
DE4240784A1 (de) * 1992-12-04 1994-06-09 Hoechst Ag Glasfaserverstärktes Cycloolefinpolymer-Material und Verfahren zu seiner Herstellung
JP2734345B2 (ja) * 1993-08-24 1998-03-30 新神戸電機株式会社 積層板用ガラス繊維不織布の製造法および積層板の製造法
US5614324A (en) * 1995-07-24 1997-03-25 Gould Electronics Inc. Multi-layer structures containing a silane adhesion promoting layer
JP3197213B2 (ja) * 1996-05-29 2001-08-13 松下電器産業株式会社 プリント配線板およびその製造方法
EP0889107A3 (de) * 1997-07-03 1999-03-24 Ciba SC Holding AG Klebstoff aus Basis von Cycloolefin
DE69820245T2 (de) * 1998-07-24 2004-11-25 Nikko Materials Usa Inc., Chandler Verfahren zur Herstellung einer Metallfolie mit verbesserten Hafteigenschaften an Substraten
MY139405A (en) * 1998-09-28 2009-09-30 Ibiden Co Ltd Printed circuit board and method for its production
WO2003018213A2 (en) * 2001-08-22 2003-03-06 World Properties Inc. Silanated copper foils, method of making, and use thereof
US7132736B2 (en) * 2001-10-31 2006-11-07 Georgia Tech Research Corporation Devices having compliant wafer-level packages with pillars and methods of fabrication
CN100376386C (zh) 2001-11-01 2008-03-26 荒川化学工业株式会社 聚酰亚胺-金属层压体和聚酰胺酰亚胺-金属层压体
WO2004114732A1 (en) * 2003-06-19 2004-12-29 World Properties, Inc. Material including a liquid crystalline polymer and a polyhedral oligomeric silsesquioxane (poss) filler
CN1914961A (zh) * 2004-01-20 2007-02-14 环球产权公司 电路材料、电路、多层电路及其制造方法
DE102004025767A1 (de) 2004-05-26 2005-12-22 Degussa Ag Stabile Lösungen von N-substituierten Aminopolysiloxanen, deren Herstellung und Verwendung
US7364672B2 (en) * 2004-12-06 2008-04-29 Arlon, Inc. Low loss prepregs, compositions useful for the preparation thereof and uses therefor
US20080009211A1 (en) * 2006-07-07 2008-01-10 Matthew Raymond Himes Assemblies useful for the preparation of electronic components and methods for making same
US20080188153A1 (en) * 2007-02-06 2008-08-07 Innegrity, Llc Method of Forming a Low Dielectric Loss Composite Material
JP5138267B2 (ja) * 2007-04-18 2013-02-06 日立化成工業株式会社 プリプレグ、それを用いた多層基配線板及び電子部品
JP2009043914A (ja) * 2007-08-08 2009-02-26 Ishida Yukio 配線板の製造法および配線板
CN101917826B (zh) * 2010-08-03 2013-08-21 东莞市仁吉电子材料有限公司 印刷电路板基板中,增加导电体与非导电高分子介电层之间结合力的方法
CN106626580B (zh) * 2015-10-28 2019-12-24 财团法人工业技术研究院 复合积层板
EP3473633B8 (de) 2017-10-18 2019-12-18 Evonik Operations GmbH Eine farblose, 3-(n-vinylbenzyl-2-aminoethyl)aminopropyltrimethoxysilanhydrochlorid und methanol enthaltenden zusammensetzung, ein verfahren zu deren herstellung und deren verwendung
DE102018208691A1 (de) 2018-01-31 2019-08-01 Evonik Degussa Gmbh Spezielle Zusammensetzung organofunktioneller Alkoxysilane und deren Verwendung
EP3611236B1 (de) 2018-08-17 2020-09-30 Evonik Operations GmbH Eine wässrige, lagerstabile zusammensetzung, die n-benzyl-substituierte n-(2-aminoethyl)-3-aminopropylsiloxan-hydrochloride enthält, verfahren zu deren herstellung und deren verwendung
EP3708569B1 (de) 2019-03-11 2024-06-12 Evonik Operations GmbH Ein voc freies, wässriges und lagerstabiles n-vinylbenzylaminalkyl-funktionelles siloxanol und verfahren zu dessen herstellung
CN113840726B (zh) * 2019-05-23 2025-07-04 罗杰斯公司 低损耗复合材料层和用于形成其的组合物
CN111002644B (zh) * 2019-12-20 2022-02-22 江门市德众泰工程塑胶科技有限公司 一种低介电、高剥离强度的覆铜板的制备方法

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US3360349A (en) * 1965-04-01 1967-12-26 Sperry Rand Corp Copper layer bonded to a non-conductive layer by means of a copper alloy
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US3558423A (en) * 1967-10-16 1971-01-26 Electronized Chem Corp Low loss electrical printed circuit board comprising polyolefin,fiberglass and metallic foil
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998005715A1 (en) * 1996-08-07 1998-02-12 Nippon Zeon Co., Ltd. Cross-linking polymer composition
JPWO9805715A1 (de) * 1996-08-07 1998-02-12
JP2010111881A (ja) * 2003-01-31 2010-05-20 Nippon Zeon Co Ltd 環状オレフィン系樹脂フィルムおよび環状オレフィン系ポリマーシートまたはフィルムの製造方法
JP2016017089A (ja) * 2014-07-04 2016-02-01 三井化学株式会社 硬化性樹脂組成物、添加剤用組成物およびその用途
JPWO2019142570A1 (ja) * 2018-01-17 2021-01-28 京セラ株式会社 有機絶縁体、金属張積層板および配線基板

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CA1293434C (en) 1991-12-24
CN1039994A (zh) 1990-02-28
EP0353766A3 (de) 1991-11-06
US4910077A (en) 1990-03-20
CN1022746C (zh) 1993-11-17
EP0353766A2 (de) 1990-02-07

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