JPH0217488Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to an apparatus for manufacturing electronic components such as axial lead type electronic components, such as semiconductor elements in which lead portions protrude coaxially from a resin mold body. In particular, the present invention relates to an axial lead type electronic component manufacturing apparatus that performs a plurality of manufacturing steps on a rotating drum.

[Conventional technology]

When the lead part of an axial lead type semiconductor element having a resin mold body is molded into a predetermined shape during the manufacturing process, and then the change in electrical characteristics due to mechanical stress applied to the semiconductor pellet due to molding is to be inspected. Conventionally, a device configured as shown in FIG. 1, for example, has been used. The outline of this device will be explained based on the drawings.

Figure 1a is a schematic side view of the main parts of the above device, Figure 1b is
1 is a front view of the same, and in these figures, a plurality of holes for receiving lead portions 3, 3 of an axial lead type semiconductor element 2 are arranged at equal intervals on the outer periphery of a pair of disks 1, 1 arranged opposite to each other. Notch 4
A rotating drum 5 is provided. This rotating drum 5 is configured to be rotated intermittently at a predetermined speed by a drive source (not shown). A pair of guide plates 6, 6 are provided near the outer periphery of the rotating drum 5.
are provided, and the lead portions 3 of the semiconductor element 2 are configured to slide and pass through the gap formed between them.

A cutting device 9 for the lead portions 3, 3, which is provided with an upper blade 7 and a lower blade 8 along the outer periphery of the rotary drum 5, and forming of the lead portions 3, 3 by shifting the cutting device and its position on the outer periphery. The forming device 12 includes an upper bending die 10 and a lower bending die 11 for performing the forming process. Furthermore, the rotating drum 5
A shutter 13 is provided close to the upper outer periphery of the
The semiconductor elements 2 are continuously supplied to the cutout portion 4 of the rotating drum 5 via the shutter 13 . Then, the semiconductor element 2 supplied to the notch 4 by free fall is conveyed directly below the cutting device 9 by the intermittent rotation of the rotary drum 5, and is transferred to the lead portion 3 by the cutting device 9. 3 is cut to a predetermined length. Next, the semiconductor element 2 is formed into a predetermined shape by the forming device 12 by intermittent rotation of the rotating drum 5, and then formed downward along the gap formed between the outer periphery of the rotating drum 5 and the guide plate 6. The semiconductor element 2 moves to a vertically downward position and falls freely, and this freely fallen semiconductor element 2 is received by the receiving box 14. The received semiconductor element 2 after completion of forming is transferred to the next process together with the receiving box 14. In the next step, the lead portion 3 of the semiconductor element 2,
Since mechanical stress is applied to the internal semiconductor pellet through the lead portions 3, 3 during forming of the semiconductor pellet 3, changes in electrical characteristics are inspected.

[The problem that the idea aims to solve]

In the conventional axial lead type electronic component manufacturing equipment, as described above, the semiconductor elements 2 after forming are stored in the receiving box 14 in a disordered state without considering the direction, so that the semiconductor elements 2 are disposed in the next process. There are problems that need to be solved, such as poor workability when testing the electrical characteristics of the device, and the difficulty of automating this type of testing process.

[Purpose of invention]

The present invention was made to solve the above-mentioned problems, and it is possible to prevent the axial lead type electronic components after forming on the first rotating drum from freely falling into the receiving box in a disorderly manner. It is possible to receive the axial lead type electronic components as they are on the second rotating drum in the same state and subsequently perform the electrical characteristic inspection of the axial lead type electronic components, thereby automating the manufacturing and processing process of axial lead type electronic components and improving work efficiency. The purpose of the present invention is to provide an apparatus for manufacturing axial lead type electronic components that can achieve the following.

[Means for Solving the Problems] The axial lead type electronic component manufacturing apparatus of the present invention includes a cutting device and forming device that cuts the lead portion of an axial lead type electronic component into a predetermined size and forms it into a predetermined shape. A second rotating drum is provided adjacent to and vertically below the first rotating drum on which the device is provided on the outer periphery, and the electrical characteristics of the axial lead type electronic component are inspected on the second rotating drum. An inspection device is installed on the outer periphery to ensure that the

[Effect]

The axial lead type electronic component manufacturing apparatus of the present invention cuts the lead part of the axial lead type electronic component to a predetermined size using a cutting device on a first rotating drum, and then forms it into a predetermined shape using a forming device. Thereafter, it is transferred in the same state to a second rotating drum, and the electrical characteristics of the axial lead type electronic component are automatically inspected on this second rotating drum by an inspection device.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 2 is a schematic side view of the main parts of the manufacturing apparatus for axial lead type electronic components according to the present invention, and FIG. 3 is a front view showing the main part configuration of the inspection device installed on the second rotating drum in the above-mentioned manufacturing apparatus. It is a diagram.

In FIG. 2, the first rotating drum 20 has two opposing disks 21, 21, although only one side is shown in the figure. Multiple notches 2 at equal intervals on the outer circumference
2 is formed. This first rotating drum 20
For example, arrow m is driven by a drive source such as a pulse motor.
It is configured to rotate intermittently at a predetermined rotation angle in the direction. Two guide plates 23, 23 (only one side shown) close to the outer periphery of the first rotating drum 20
are arranged to have a gap 24, and this gap 2
4 is an axial lead type electronic component, in this embodiment, a lead portion 26 of a resin molded semiconductor element 25.
is configured to pass through.

Positioning of the resin molded semiconductor element 25 in the width direction is performed by arranging mutually opposing guide plates 23, 23 at both ends of the mold body.

A cutting device 29 having an upper blade 27 and a lower blade 28 close to the outer periphery of the first rotating drum 20, and a forming device 29 having an upper bending mold 30 and a lower bending mold 31 shifted from the cutting device 29 on the outer periphery. Device 3
2 is provided. A shutter 33 is provided at a position upstream of the cutting device 29 and close to the outer periphery of the first rotating drum 20.
The resin-molded semiconductor elements 25 are supplied one by one to the notch 22 of the first rotating drum 20 through the first rotary drum 20 .

A pair of pins 34, 34 protrude horizontally near the lower ends of the guide plates 21, 21, and this pin 3
4 and 34, the lead portion 26 of the resin molded semiconductor element 25 abuts against the resin molded semiconductor element 25, and its posture is regulated to be horizontal.

A second rotary drum 35 is provided at a position vertically below the first rotary drum 20 and in close proximity to the first rotary drum 20 . The second rotating drum 35 has a notch 22 similar to that of the first rotating drum 20, and this rotating drum 35
is configured to rotate intermittently in the direction of arrow n at a predetermined rotation angle in synchronization with the first rotating drum 20.

An inspection device 36 for inspecting the electrical characteristics of the resin molded semiconductor element 25 is provided along the outer periphery of the second rotating drum 35 and in front of it in the rotational direction. This inspection device 36 is the third
As shown in the figure, a resin molded semiconductor element 25
It has measurement terminals 37, 37 that come into contact with the lead portion 26 of the resin molded semiconductor element 25, and is configured to be able to test the electrical characteristics of the resin-molded semiconductor element 25. The structure is such that a control signal is sent to control the shutter 39 of the storage box 38 shown in FIG. 2 for sorting.

A notch 22 is provided on the outer periphery of the second rotating drum 35.
It has a clamping device 41 in which a pair of claws 40, 40 are arranged opposite to each other, and the clamping device 41 holds the mold main body of the resin-molded semiconductor element 25 on the second rotating drum 35 in a vertically upper position. It is configured to be held in place and released in a vertically downward position.

In the axial lead type electronic component manufacturing apparatus configured as described above, the resin molded semiconductor element 25 whose polarity is aligned in one direction is transferred from the shutter 33 to the notch 22 of the first rotating drum 20.
is supplied at the A position shown in the figure. The supplied resin molded semiconductor element 25 is transported to position B where a cutting device 27 is provided by the intermittent rotation of the first rotating drum 20, and the cutting device 27 leads the resin molded semiconductor element 25. Part 26
is cut to a predetermined size. Next, C on the outer periphery
The lead portion 26 is rotated to the C position, and the forming device 32 forms the lead portion 26 into a predetermined shape. The resin-molded semiconductor element 25 after forming is transported to the D position of the first rotating drum 20 with the lead part 26 facing vertically downward due to the weight of the lead part 26 itself.

In this D position, the lead part 26 is regulated by the pins 34, 34, and the lead part 26 is guided between the first rotating drum 20 and the second rotating drum 35 in a horizontal state. The lead portion 26 of the resin molded semiconductor element 25 is delivered to the cutout portion 22 of the rotating drum 35 .

The resin-molded semiconductor element 25 transferred to the second rotating drum 35 has its mold main body portion held by the holding device 41, and is moved to the F position on the outer periphery by rotation of the second rotating drum 35 in the direction of arrow n. transported to. In this F position, the inspection device 36
The measurement terminals 37, 37 of the resin-molded semiconductor element 25 are brought into contact with the lead parts 26, 26 as shown in FIG. 3, and the electrical characteristics of the resin-molded semiconductor element 25 are tested. The inspection device 36 includes non-defective products with predetermined electrical characteristics,
Set standard values for selecting defective products,
The information inputted through the measurement terminals 37, 37 is compared with the reference value, and a signal for determining whether the product is good or defective is output. This discrimination signal is used as a control signal to change the direction of the shutter 39 of the storage box 38.
When the input is made, the direction of the shutter 39 is changed as shown by the chain line in FIG. 2, and good products and defective products are automatically sorted into the storage box 38.

The structure of the shutter 39 described above is as follows:
Various structures can be considered, and the structure is not limited to the one shown. In addition, in the above embodiment, the second
The cutout 22 is provided on the outer periphery of the rotating drum 35 so that the lead portion 26 of the resin molded semiconductor element 25 is held by the holding device 41, so the cutout 22 is not necessarily necessary.

Further, although the operation timings of the cutting device 29 and forming device 32 in the first rotating drum 20 are not specifically described in detail, they can be easily realized using existing sensors, sequence control, and the like.

Furthermore, cutting on the first rotating drum 20,
It may be possible to perform other processing steps such as marking processing instead of forming processing, or it may be possible to perform other processing steps in addition to these processing steps. Similarly, the processing on the second rotating drum is not limited to the inspection of electrical characteristics, but can be changed to, for example, visual inspection or other processing steps, and other processing steps may be added in the same manner as described above.

Further, the electronic components to be processed are not limited to resin molded semiconductor elements, but can be widely applied to axial lead type electronic components.

[Effect of idea]

Since the present invention is configured as described above, it is possible to transfer the axial lead type electronic component onto the second rotating drum in the same posture as the conveying condition on the first rotating drum, and this second rotating drum The electrical characteristics of the axial lead type electronic component held on the outer periphery of the drum with aligned polarities can be easily tested using the testing device. Therefore, unlike the conventional method, which is processed on the first rotating drum and then stored in a disorganized manner in a receiving box, this has the advantage of automating the electrical characteristic testing process and enabling highly efficient testing. be.

[Brief explanation of the drawing]

Fig. 1 shows a conventional manufacturing apparatus for axial lead type electronic components, and Fig. 1a is a schematic side view of the main parts;
Figure b is a front view of the same, Figure 2 is a schematic side view of the main parts of an axial lead type electronic component manufacturing apparatus showing an embodiment of the present invention, and Figure 3 is an axial lead type electronic component manufacturing apparatus according to the present invention. FIG. 3 is a front view showing a part of the inspection device provided on the second rotating drum side in the parts manufacturing apparatus. 20...First rotating drum, 21...Disc, 2
2... Notch portion, 23... Guide plate, 25... Resin molded semiconductor element, 26... Lead portion, 29...
...Cutting device, 32... Forming device, 35...
...Second rotating drum, 36...Inspection device, 39...
... Shutter, 41... Clamping device.

Claims (1)

[Scope of utility model registration request] It has a plurality of notches for receiving the leads of the axial lead type electronic component at equal intervals on the outer periphery of two discs facing each other, and rotates intermittently at a predetermined rotation angle. a first rotary drum having a cutting device for cutting the lead portion of the axial lead type electronic component held in the notch portion into a predetermined size and a forming device for forming a predetermined form on the outer periphery; a pair of molded resin molded parts provided in a semicircular shape along the outer periphery of the rotating drum, which guide the axial lead type electronic component downward by regulating the resin mold body of the axial lead type electronic component supplied to the notch; An axial-lead type electronic component manufacturing apparatus comprising a guide plate, which is provided close to the vertically downward side of the first rotating drum, and is guided by the guide plate so as to be guided vertically downwardly of the first rotating drum. a clamping device that receives and holds a lead portion of the axial lead type electronic component that has fallen from the notch in the vicinity, and that rotates intermittently in synchronization with the rotation of the first rotating drum; In addition, a second rotating drum is provided on the outer periphery of which a testing device for testing the electrical characteristics of the axial lead type electronic component held by the holding device is provided. Manufacturing equipment for lead-type electronic components.