JPH0217836U - - Google Patents
Info
- Publication number
- JPH0217836U JPH0217836U JP9638188U JP9638188U JPH0217836U JP H0217836 U JPH0217836 U JP H0217836U JP 9638188 U JP9638188 U JP 9638188U JP 9638188 U JP9638188 U JP 9638188U JP H0217836 U JPH0217836 U JP H0217836U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- feed claw
- conveying device
- change
- bonding process
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000000078 claw Anatomy 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
Description
第１図は本考案実施例のアーム先端の偏心ピン
部分の断面図、第２図は第１図のＡ方向矢視図、
第３図は第１図の偏心ピンの斜視図、第４図は第
１図のＢ方向矢視図、第５図は本考案実施例のリ
ードフレーム搬送装置の斜視図、第６図は品種の
異なるリードフレームのタイバー位置の違いを示
す図である。
図中、１１はダイスボンダーフレーム送り部、
１２はリードフレーム、１３はリードフレーム搬
送装置、１４はアーム、１４ａは溝、１４ｂは孔
、１５は偏心ピン、１５ａは頭部、１５ｂは軸部
、１５ｃは送り爪部、１５ｄは切り欠き面、１６
は固定ボルト、を示す。
Fig. 1 is a sectional view of the eccentric pin portion at the tip of the arm of the embodiment of the present invention, Fig. 2 is a view taken in the direction of arrow A in Fig. 1,
3 is a perspective view of the eccentric pin shown in FIG. 1, FIG. 4 is a view taken in the direction of arrow B in FIG. FIG. 3 is a diagram showing differences in tie bar positions of different lead frames. In the figure, 11 is a die bonder frame feeding section;
12 is a lead frame, 13 is a lead frame transfer device, 14 is an arm, 14a is a groove, 14b is a hole, 15 is an eccentric pin, 15a is a head, 15b is a shaft portion, 15c is a feeding claw portion, and 15d is a notch surface , 16
indicates a fixing bolt.
Claims (1)
グ工程に使用される装置で、リードフレームを送
り爪部１５ｃにより搬送するリードフレーム搬送
装置において、 前記送り爪部１５ｃを１８０°回転して取り付
けることで、この送り爪部１５ｃの位置がリード
フレームの品種変更に応じた量だけ変更される構
成の偏心ピン１５を具備してなることを特徴とす
るリードフレーム搬送装置。[Claims for Utility Model Registration] In a lead frame conveying device that is used in a die bonding process and a wire bonding process and conveys a lead frame by a feed claw part 15c, the feed claw part 15c is rotated by 180 degrees and attached. Accordingly, the lead frame conveying device is characterized in that it is equipped with an eccentric pin 15 configured to change the position of the feed claw portion 15c by an amount corresponding to a change in the type of lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9638188U JPH0217836U (en) | 1988-07-22 | 1988-07-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9638188U JPH0217836U (en) | 1988-07-22 | 1988-07-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0217836U true JPH0217836U (en) | 1990-02-06 |
Family
ID=31321272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9638188U Pending JPH0217836U (en) | 1988-07-22 | 1988-07-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0217836U (en) |
-
1988
- 1988-07-22 JP JP9638188U patent/JPH0217836U/ja active Pending
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