JPH0217849U - - Google Patents
Info
- Publication number
- JPH0217849U JPH0217849U JP1988096282U JP9628288U JPH0217849U JP H0217849 U JPH0217849 U JP H0217849U JP 1988096282 U JP1988096282 U JP 1988096282U JP 9628288 U JP9628288 U JP 9628288U JP H0217849 U JPH0217849 U JP H0217849U
- Authority
- JP
- Japan
- Prior art keywords
- resin sealing
- semiconductor device
- sealing part
- semiconductor chip
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例及びそれらを収納す
るトレーの断面模式図、第２図は従来の半導体装
置の一例及びそれらを収納するトレーの断面模式
図である。
１……トレー上段凸部、２……トレー下段凸部
、３……樹脂封止部、４……外部リード、５……
凹部。
FIG. 1 is a schematic cross-sectional view of an embodiment of the present invention and a tray that stores them, and FIG. 2 is a schematic cross-sectional view of an example of a conventional semiconductor device and a tray that stores them. 1...Tray upper protrusion, 2...Tray lower protrusion, 3...Resin sealing part, 4...External lead, 5...
recess.
Claims (1)
のリードの内部を含んで封止する樹脂封止部を有
する半導体装置において、前記樹脂封止部の上面
及び下面に収納用トレーの凸部を挿入する凹部を
設けたことを特徴とする半導体装置。 In a semiconductor device having a resin sealing part that includes and seals the inside of a semiconductor chip and a plurality of leads connected to the semiconductor chip, a recess into which a convex part of a storage tray is inserted into the upper and lower surfaces of the resin sealing part. A semiconductor device characterized by being provided with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988096282U JPH0217849U (en) | 1988-07-19 | 1988-07-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988096282U JPH0217849U (en) | 1988-07-19 | 1988-07-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0217849U true JPH0217849U (en) | 1990-02-06 |
Family
ID=31321150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988096282U Pending JPH0217849U (en) | 1988-07-19 | 1988-07-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0217849U (en) |
-
1988
- 1988-07-19 JP JP1988096282U patent/JPH0217849U/ja active Pending
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