JPH0217868U - - Google Patents
Info
- Publication number
- JPH0217868U JPH0217868U JP9565588U JP9565588U JPH0217868U JP H0217868 U JPH0217868 U JP H0217868U JP 9565588 U JP9565588 U JP 9565588U JP 9565588 U JP9565588 U JP 9565588U JP H0217868 U JPH0217868 U JP H0217868U
- Authority
- JP
- Japan
- Prior art keywords
- film base
- view
- circuit board
- printed circuit
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 2
- 229920006267 polyester film Polymers 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Description
図面は本考案の実施例が示され、第１図はフレ
キシブルプリント基板の第１実施例平面図、第２
図は第１図の断面側面図、第３図は第２実施例平
面図、第４図は第３図の断面側面図、第５図は第
３実施例平面図、第６図は第５図の断面側面図、
第７図は第１実施例の変形例平面図、第８図以下
は従来例で、第８図はフレキシブルプリント基板
の平面図、第９図、第１０図は断面側面図である
。
１…ベース、２，５，６，７…他の回路と半田
付にて接続される部分、３…その他の部分。
The drawings show an embodiment of the present invention, and FIG. 1 is a plan view of the first embodiment of the flexible printed circuit board, and FIG.
The figures are a sectional side view of Fig. 1, Fig. 3 is a plan view of the second embodiment, Fig. 4 is a sectional side view of Fig. 3, Fig. 5 is a plan view of the third embodiment, and Fig. 6 is a plan view of the second embodiment. Cross-sectional side view of the figure,
FIG. 7 is a plan view of a modification of the first embodiment, and FIG. 8 and the following are conventional examples. FIG. 8 is a plan view of the flexible printed circuit board, and FIGS. 9 and 10 are cross-sectional side views. 1... Base, 2, 5, 6, 7... Parts connected to other circuits by soldering, 3... Other parts.
Claims (1)
イミドフイルムのベースを用い、その他の部分は
ポリエステルフイルムをベースとして用いた事を
特徴とするフレキシブルプリント基板。 A flexible printed circuit board characterized by using a polyimide film base only for the part that is connected to other circuits by soldering, and using a polyester film base for the other parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9565588U JPH0217868U (en) | 1988-07-21 | 1988-07-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9565588U JPH0217868U (en) | 1988-07-21 | 1988-07-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0217868U true JPH0217868U (en) | 1990-02-06 |
Family
ID=31320349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9565588U Pending JPH0217868U (en) | 1988-07-21 | 1988-07-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0217868U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58118189A (en) * | 1981-12-30 | 1983-07-14 | 日東電工株式会社 | Method of producing printed circuit board |
| JPS6149494A (en) * | 1984-08-17 | 1986-03-11 | ソニー株式会社 | Flexible circuit board |
-
1988
- 1988-07-21 JP JP9565588U patent/JPH0217868U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58118189A (en) * | 1981-12-30 | 1983-07-14 | 日東電工株式会社 | Method of producing printed circuit board |
| JPS6149494A (en) * | 1984-08-17 | 1986-03-11 | ソニー株式会社 | Flexible circuit board |