JPH0217872U - - Google Patents
Info
- Publication number
- JPH0217872U JPH0217872U JP9685788U JP9685788U JPH0217872U JP H0217872 U JPH0217872 U JP H0217872U JP 9685788 U JP9685788 U JP 9685788U JP 9685788 U JP9685788 U JP 9685788U JP H0217872 U JPH0217872 U JP H0217872U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- flexible printed
- copper foil
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims 2
- 230000002950 deficient Effects 0.000 claims 2
- 230000007547 defect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の一実施例のフレキシブルプリ
ント配線基板の平面図、第２図ａ，ｂ，ｃは本考
案の使用例を示す平面図および第２図ａのＡＡ′
線、ＢＢ′線のそれぞれの断面図、第３図〜第５
図は何れも本考案の他の実施例の平面図、第６図
は従来のフレキシブルプリント配線基板のプリン
ト配線基板へのハンダ付け接続状態を示す平面図
、第７図は従来一般に使用されているプリント配
線基板への接続方法を示す平面図である。
１，６…フレキシブルプリント配線基板、１ａ
…ベースフイルム、１ｂ〜１ｅ…銅箔部、２，２
ｃ，２ｄ…欠損部、２ａ，２ｂ…辺、３…プリン
ト配線基板、３ａ…銅箔部、４…ハンダ、５，５
ａ…欠損孔、６ａ…銅箔部、７…一つの辺、８…
絶縁被覆電線。
FIG. 1 is a plan view of a flexible printed wiring board according to an embodiment of the present invention, and FIGS. 2 a, b, and c are plan views showing an example of use of the present invention, and AA' in FIG.
Cross-sectional views of lines BB' and BB', Figures 3 to 5
The figures are all plan views of other embodiments of the present invention, Fig. 6 is a plan view showing a conventional flexible printed wiring board connected to the printed wiring board by soldering, and Fig. 7 is a plan view of a commonly used conventional flexible printed wiring board. FIG. 3 is a plan view showing a method of connecting to a printed wiring board. 1, 6...Flexible printed wiring board, 1a
...Base film, 1b to 1e...Copper foil part, 2,2
c, 2d... Missing part, 2a, 2b... Side, 3... Printed wiring board, 3a... Copper foil part, 4... Solder, 5, 5
a... Defect hole, 6a... Copper foil part, 7... One side, 8...
Insulated wire.
Claims (1)
たハンダ付け銅箔部を含むことを特徴とするフレ
キシブルプリント配線基板。 (2) 少なくとも２つの辺が掛るように欠損孔を
設けたハンダ付け銅箔部を含むことを特徴とする
フレキシブルプリント配線基板。[Claims for Utility Model Registration] (1) A flexible printed wiring board characterized by including a soldered copper foil portion provided with a defective portion having at least two sides. (2) A flexible printed wiring board characterized in that it includes a soldered copper foil portion with a defective hole so that at least two sides thereof are covered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9685788U JPH0217872U (en) | 1988-07-20 | 1988-07-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9685788U JPH0217872U (en) | 1988-07-20 | 1988-07-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0217872U true JPH0217872U (en) | 1990-02-06 |
Family
ID=31321985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9685788U Pending JPH0217872U (en) | 1988-07-20 | 1988-07-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0217872U (en) |
-
1988
- 1988-07-20 JP JP9685788U patent/JPH0217872U/ja active Pending
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