JPH02184599A - Production of ferroelectric thin film - Google Patents

Production of ferroelectric thin film

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Publication number
JPH02184599A
JPH02184599A JP259889A JP259889A JPH02184599A JP H02184599 A JPH02184599 A JP H02184599A JP 259889 A JP259889 A JP 259889A JP 259889 A JP259889 A JP 259889A JP H02184599 A JPH02184599 A JP H02184599A
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Japan
Prior art keywords
thin film
single crystal
substrate
zno
plane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP259889A
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Japanese (ja)
Other versions
JP2710973B2 (en
Inventor
Hironori Matsunaga
松永 宏典
Yasunari Okamoto
康成 岡本
Kimitaka Ono
公隆 大野
Yoshiharu Nakajima
義晴 中嶋
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Sharp Corp
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Sharp Corp
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Abstract

PURPOSE:To obtain the title high purity thin film having single ferroelectric domain structure by using as substrate ZnO single crystal (0001)-plane. CONSTITUTION:In a Rf-excited (at 100-250W) oxygen plasma atmosphere, Li(oxide), Nb(oxide) and Ta(oxide) as Li, Nb and Ta sources, respectively, are put to temperature regulation, using a Knudsen cell, electron beam heater, etc., so as to each independently obtain a specified evaporation level, followed by simultaneous deposition on a ZnO single crystal (0001) plane subjected to heteroepi growth on either ZnO (0001)-plane single crystal substrate or one of the respective substrate surface of sapphire (0001)-, Si(111)-, GaP(111)-, GaAs(111)-, CdTe(111)- and ZnS(111)-planes kept at 400-800 deg.C through heating, thus obtaining the objective LiNb1-xTaxO3 (0<=x<=1) single crystal thin film in a single ferroelectric domain state.

Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明は1強銹電体薄膜の製造方法に関し、更に詳しく
は高純度かつ単一強誘電性分域構造を有するL I N
b 1−X Ta)(Ox (0’X<1 )単結晶薄
膜の製造方法に関するものである。
[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a method for producing a ferroelectric thin film, and more specifically, to a method for manufacturing a ferroelectric thin film having high purity and a single ferroelectric domain structure.
The present invention relates to a method for producing a b 1-X Ta)(Ox (0'X<1) single crystal thin film.

〈従来の技術〉 t、iNb、−xraxo、coGx<1)a、その優
れた多くの特性を利用して様々のデバイスへの応用開発
に利用されている。例えば、電気機械結合係数が大きい
事を利用した表面弾性波(SAW)デバイス、電気光学
効果、非線形光学効果等を利用した光導波路・光スィッ
チ・光変調機・光結合機・波長変換器等の光IC用基板
材料、外場の変化に敏感に対応する屈折率変化を利用し
た光ICセンサー、更にはFe等の不純物ドープにより
生じる光損傷効果を利用した光メモリーや8次元ホログ
ラム材料等、各1の応用開発分野で用いられている。
<Prior Art> t, iNb, -xraxo, coGx<1)a, has been utilized in the development of applications to various devices by taking advantage of its many excellent properties. For example, surface acoustic wave (SAW) devices that utilize a large electromechanical coupling coefficient, optical waveguides, optical switches, optical modulators, optical couplers, wavelength converters, etc. that utilize electro-optical effects, nonlinear optical effects, etc. Substrate materials for optical ICs, optical IC sensors that utilize refractive index changes that respond sensitively to changes in external fields, optical memories that utilize the optical damage effect caused by impurity doping such as Fe, and eight-dimensional hologram materials, etc. It is used in the applied development field of 1.

従来、この様なLiNb1−xTa)(Oi (0≦X
≦l)は、一般に引き上げ法により作製されたバルク単
結晶から特定の結晶面を持−たウェハーを切り出して使
用している。しかし、デバイス開発における高集積化・
多機能化・低コスト化等の要請から単結晶薄膜作製技術
の検討がなされて勇た結果、スパッタリング法、イオン
ブレーティング法、液相エピタキシャル法、CVD法、
ゾルゲル法等により、サファイヤCR面、2面)、水晶
02面)、酸化マグネシウムMg0(txt)面等の単
結晶基板上へ、ペテロエピタキシャル結晶成長が可能と
なってきた。
Conventionally, such LiNb1-xTa)(Oi (0≦X
≦l) is generally used by cutting out a wafer having a specific crystal plane from a bulk single crystal produced by a pulling method. However, high integration and
Due to the demand for multi-functionality and cost reduction, single-crystal thin film production technologies have been studied and as a result, sputtering method, ion blating method, liquid phase epitaxial method, CVD method, etc.
By the sol-gel method, etc., it has become possible to grow epitaxial crystals on single crystal substrates such as sapphire CR plane, 2 plane), crystal 02 plane), magnesium oxide Mg0 (txt) plane, etc.

一方、 LiNb1−xTaxO3(0≦X≦1)は、
結晶学的に、空間群R8cに属し1強誘電軸のC軸方向
に大きな異方性を持つ物質であり、デバイス開発に於い
ては単一強誘電性分域を持った薄膜である事が望ましい
On the other hand, LiNb1-xTaxO3 (0≦X≦1) is
Crystallographically, it is a material that belongs to the space group R8c and has large anisotropy in the C-axis direction of one ferroelectric axis.In device development, it is important to form a thin film with a single ferroelectric domain. desirable.

しかしながら、上記各4基板材料は、結晶学的に等方性
であり、これらを基板とL7て用いた場合単一強誘電性
分域構造を持つ様にする為には、薄膜作製後にポーリン
グ処理を施す必要がある。
However, each of the above four substrate materials is crystallographically isotropic, and in order to have a single ferroelectric domain structure when used as a substrate and L7, it is necessary to perform poling treatment after thin film fabrication. It is necessary to apply

〈発明が解決しようとする課題〉 以上述べた様に、LiNb1−XTaXo3cO≦X≦
1)薄膜作製の場合、用いる基板材料によっては、作製
後のポーリング処理が必要となり、膜作製の効率性に欠
ける。この様な問題を解決するには、基板材料としてヘ
テロエピタキシャル成長が可能な程度の格子不整合を持
ち、かつ結晶学的に異方性(極性)の大きい材料を用い
る事が有効であると考えられる。しかしながら、これま
での所この様な都合の良い基板材料についての報告は無
い。
<Problem to be solved by the invention> As stated above, LiNb1-XTaXo3cO≦X≦
1) In the case of thin film fabrication, depending on the substrate material used, a poling process is required after fabrication, resulting in a lack of efficiency in film fabrication. To solve these problems, it is thought to be effective to use a material with lattice mismatch to the extent that heteroepitaxial growth is possible and a material with high crystallographic anisotropy (polarity) as the substrate material. . However, so far there have been no reports on such convenient substrate materials.

く課題を解決する為の手段〉 そこで、本発明者らは、上記問題点を解決する為に表面
弾性波デバイスとして広く用いられている圧電性結晶の
酸化亜鉛ZnOの圧電方向に垂直な面、すなわち(00
01)面を基板として用いてLiNb1−XTaXo3
(0≦X≦1)薄IA’に作製する事によって、膜作製
後、改めてポーリング処理する事なしに強誘電軸方向に
配向し7たLit(bl−zTaz03 (0≦X≦1
)単一分域(0001)面単結晶薄膜が作製出来る事を
見い出し、た。
Means for Solving the Problems> Therefore, in order to solve the above problems, the present inventors developed a surface perpendicular to the piezoelectric direction of zinc oxide ZnO, a piezoelectric crystal widely used as a surface acoustic wave device. That is, (00
01) LiNb1-XTaXo3 using the surface as a substrate
(0≦X≦1) By producing a thin IA', Lit (bl-zTaz03 (0≦X≦1
) It was discovered that single-domain (0001) plane single crystal thin films can be produced.

ここでZnO欠、空間群P6Bm’lC@し、C軸方向
に異方性(極性)を持った圧電性結晶である。
Here, it is a piezoelectric crystal that lacks ZnO, has a space group P6Bm'lC@, and has anisotropy (polarity) in the C-axis direction.

又、ZnOはサファイヤ等の各種基板上に容易とへテロ
エピタキシャル結晶成長させる事が出来る。
Further, ZnO can be easily grown as a heteroepitaxial crystal on various substrates such as sapphire.

LiNb03(0001)面とZn0(0001)百と
の格子不整合は、約8.8−である。
The lattice mismatch between the LiNb03 (0001) plane and the Zn0 (0001) plane is approximately 8.8-.

本発明によれが、Rf励起(100〜250W)の酸素
ガスプラズマ雰囲気中でLi源として金属Li又はその
酸化物、Nb源として金[Nb又はその酸化物、Ta源
として金属、Ta又はその酸化物をクヌードセンセル、
電子ビーム加熱装置等により各々独立に所定の蒸発量が
得られる様に加熱温度を調節した後、所定の温度に加熱
保持したZn0(0001)面単結晶基板又は各種基板
上にヘテロエピタキシャル成長すせたZ’n0(000
1)面薄膜眼結晶基板上に同時蒸着する事によ1て、高
純度でかつ強誘電軸方向に配向したLrNb1−XTa
z03 (0≦X≦1)#A−強誘電性社域(δ001
)面単結晶薄膜をポーリング処理すること需しに得る事
ができる。
According to the present invention, metal Li or its oxide is used as the Li source, gold [Nb or its oxide] is used as the Nb source, metal, Ta or its oxide is used as the Ta source in an oxygen gas plasma atmosphere with Rf excitation (100 to 250 W), Knudsensel things,
After adjusting the heating temperature so that a predetermined amount of evaporation could be obtained independently using an electron beam heating device, etc., heteroepitaxial growth was performed on a Zn0 (0001) plane single crystal substrate or various substrates heated and maintained at a predetermined temperature. Z'n0(000
1) LrNb1-XTa with high purity and oriented in the ferroelectric axis direction by simultaneous vapor deposition on a planar thin film ophthalmic crystal substrate
z03 (0≦X≦1) #A-Ferroelectric area (δ001
) surface single crystal thin film can be obtained by poling treatment.

尚、本発明における蒸V源料を加熱する装置としては、
上記のクヌードセンセル、電子ビーム加熱装置に限らず
蒸着原料を所定温度まで加熱出来るものであれば如何な
る機構の加熱装置でもよい。
In addition, the device for heating the vaporized V source material in the present invention includes:
The heating device is not limited to the above-mentioned Knudsen cell or electron beam heating device, but any heating device that can heat the vapor deposition raw material to a predetermined temperature may be used.

く作 用〉 本発明によれば、酸素ガスプラズマ雰囲気中で薄膜の構
成元素に対応した原料元素以外の不純物の介在無しに、
各構成元素成分の蒸発量を独立に制御し基板上に多成分
同時蒸着する事から、原料の変更なしに異なる組成X)
の高純度のLiNJ−XTa)(03(0≦X≦1)薄
膜を得る事ができる。
Effect> According to the present invention, in an oxygen gas plasma atmosphere, without the presence of impurities other than the raw material elements corresponding to the constituent elements of the thin film,
Since the evaporation amount of each constituent element component is controlled independently and multiple components are simultaneously deposited on the substrate, different compositions can be obtained without changing the raw materials.
A high purity LiNJ-XTa) (03 (0≦X≦1) thin film can be obtained.

更に、基板として酸化亜鉛Zn0(0001)面単結晶
を用いる事によ1て、単一強誘電分域状態のLtNbl
−)(Tax03 (0≦X≦1)単結晶薄膜を膜厚制
御性良く製造する事が可能となる。
Furthermore, by using a zinc oxide Zn0 (0001) plane single crystal as a substrate, LtNbl in a single ferroelectric domain state can be obtained.
-)(Tax03 (0≦X≦1) It becomes possible to manufacture a single crystal thin film with good film thickness controllability.

〈実施例〉 以下、本発明の実施例について説明する。尚、これによ
って本発明は限定されるものではない。
<Examples> Examples of the present invention will be described below. However, the present invention is not limited thereby.

実施例1゜ 電子ビーム加熱装置(244)、クヌードセンセル(1
機)及び高周波プラズマ発生用ワーキングコイルを内部
に装備した真空チャンバーにおいてまず真空チャンバー
内を1x10“”Torr tで真空排気した後、酸素
ガスを2 X 10  Torrまで導入し高周波プラ
ズマ〔周波数13.56MH2)を発生させた。この時
のRfパワーば200Wとした。次に電子ビーム加熱装
置により亜鉛Zn(純度4N)を加熱し、400℃に加
熱保持したサファイヤ(0001)面上に蒸着し、Zn
O薄膜を作製した。
Example 1゜Electron beam heating device (244), Knudsen cell (1
In a vacuum chamber equipped with a working coil for high-frequency plasma generation (machine) and a working coil for high-frequency plasma generation, the inside of the vacuum chamber was first evacuated at 1 x 10 Torr, and then oxygen gas was introduced to 2 x 10 Torr to generate high-frequency plasma [frequency 13.56 MH2]. ) occurred. The Rf power at this time was 200W. Next, zinc Zn (purity 4N) was heated using an electron beam heating device and deposited on the sapphire (0001) surface heated and maintained at 400°C.
An O thin film was prepared.

得られたZnO薄膜について、RHE E D及びX線
回折により、(0001)面の単結晶薄膜である事を確
認し、更に、20チHNO,液によるエツチングにより
薄膜表面がcocol)亜鉛面になっている事を確認し
た。
The resulting ZnO thin film was confirmed to be a (0001) single-crystal thin film by RHEED and X-ray diffraction, and was further etched with a 20-inch HNO solution to make the thin film surface a cocol) zinc surface. I confirmed that it is.

次に、このZnO薄膜を基板として、LiNbx  x
Ta)(03(0≦X≦1)薄膜の作製を行った。上記
真空チャンバー内11X10−”Torr’!で真空排
気した後酸素ガスを2 X 10” Torrまで導入
し高周波プラズマに発生させた。この時の、Rfパワー
は200Wとした。次に、電子ビーム加熱装置により金
属Nb(純度4N)、及び金属Ta(純度4N)を、ク
ヌードセンセルにより金属Li(純度4N)を各々独立
に所定の蒸発量となる様に加熱温度を設定した後、70
0℃に加熱保持した上記ラフ1イヤ上のZnO基板に同
時蒸着した。この場合、電子ビーム加熱のエミッション
電流は、Nb源150mA、Ta源50mAとし、クヌ
ードセンセルの加熱温度は550’Cに設定した。約1
時間の蒸着により膜厚aooo人の透明薄膜が得られた
Next, using this ZnO thin film as a substrate, LiNbx x
A thin film of Ta) (0≦X≦1) was prepared.The vacuum chamber was evacuated at 11×10-” Torr’!, and then oxygen gas was introduced to 2×10” Torr to generate high-frequency plasma. At this time, the Rf power was 200 W. Next, metal Nb (purity 4N) and metal Ta (purity 4N) were separately heated using an electron beam heating device, and metal Li (purity 4N) was heated using a Knudsen cell. After setting the heating temperature so that the predetermined amount of evaporation is achieved,
Co-evaporation was performed on the ZnO substrate on the rough 1 layer heated and maintained at 0°C. In this case, the emission current for electron beam heating was set to 150 mA from the Nb source and 50 mA from the Ta source, and the heating temperature of the Knudsen cell was set to 550'C. Approximately 1
By time evaporation, a transparent thin film with a film thickness of 100 mm was obtained.

作製した薄膜について二次イオン質量分析計(SIMS
)による深さ方向組成分析を行ったところ、膜中全体に
わたり均一で1組成的には、IiNb(1g ’rao
l o、である事、更にはZnO層との界面における元
素の拡散は極めて少ないことが確認された。次に、X線
回折パターンの測定を行ったところ1図に示す様に、サ
ファイヤ、ZnO1L iNbg、g Ta(1,10
3の(0001)面反射のみが観測され、LiNbo、
gTao、lOsもZnO上に、ヘテロエピタキシャル
単結晶成長している事が確認された。更に、フッ硝酸を
用いてエツチング法により分域構造の有無の確認を行)
たが、多分域構造を示すようなエッチピット等は観察さ
れなかった。
The prepared thin film was analyzed using a secondary ion mass spectrometer (SIMS).
), it was found that IiNb (1g'rao
It was also confirmed that the diffusion of elements at the interface with the ZnO layer was extremely small. Next, we measured the X-ray diffraction pattern, and as shown in Figure 1, we found that sapphire, ZnO1L iNbg, g Ta (1,10
Only the (0001) plane reflection of 3 was observed, and LiNbo,
It was confirmed that gTao and lOs were also grown as heteroepitaxial single crystals on ZnO. Furthermore, the presence or absence of a domain structure was confirmed by etching using fluoronitric acid)
However, no etch pits or the like indicating a multi-regional structure were observed.

以上の実験結果は、L + N b 1−X T a 
X Os(O≦X≦1)単結晶薄膜がZnO薄膜単結晶
上にヘテロエピタキシャル成長可能であることを示すと
共に、バルクZnO単結晶基板上への成長も可能である
ことをも示している。
The above experimental results are L + N b 1-X T a
This shows that an X Os (O≦X≦1) single crystal thin film can be heteroepitaxially grown on a ZnO thin film single crystal, and also that it can be grown on a bulk ZnO single crystal substrate.

実施例2゜ 本実施例1において、ZnO薄膜を作製する為の基板材
料として5i(ill)語用結晶をもちいた。Si基板
上へのZnO薄膜の形成条件は実施例1と同じである。
Example 2 In Example 1, a 5i (ill) crystal was used as the substrate material for producing the ZnO thin film. The conditions for forming the ZnO thin film on the Si substrate are the same as in Example 1.

得られたZnO’lll膜の結晶性および極性の評価を
、RHEED、X線回折法、20’L HNOs液によ
るエツチングにより行った。
The crystallinity and polarity of the obtained ZnO'll film were evaluated by RHEED, X-ray diffraction, and etching with a 20'L HNOs solution.

その結果、このZnO薄膜は(0001)面配向した単
結晶薄膜である事が判明した。次に、このZnO単結晶
薄膜上へのL iN b 1−XTa xo s(0≦
X≦1)薄膜の作製を実施例1と同じ成膜条件により行
また。得られた薄膜の組成および結晶性をSIMS、X
線回折法により評価した所、組成的にはL i’Nbo
e Tao工O1の単結晶薄膜であることが解認できた
As a result, it was found that this ZnO thin film was a single crystal thin film with (0001) plane orientation. Next, L iN b 1-XTaxos (0≦
X≦1) The thin film was produced under the same film forming conditions as in Example 1. The composition and crystallinity of the obtained thin film were determined by SIMS,
As evaluated by line diffraction method, the composition is L i'Nbo
e It was confirmed that it was a single crystal thin film of Tao O1.

以上の結果St (111)基板上へのLiNb1−x
Taxos (0≦X≦1)の直接成長では、格子不整
合が約28チと非常に大きくヘテロエピタキシャル成長
が困離であるが、中聞層としてZnO薄at挿入するこ
とによってLiN1g−XTaxO3(0≦X≦1)単
結晶薄膜を格子不整合の大きい基板上へも作製できるこ
とを示している。尚。
As a result of the above, LiNb1-x on the St (111) substrate
In the direct growth of Taxos (0≦X≦1), the lattice mismatch is very large, about 28 degrees, making heteroepitaxial growth difficult. However, by inserting a thin layer of ZnO as a middle layer, LiN1g-XTaxO3 (0≦ X≦1) This shows that a single crystal thin film can be produced even on a substrate with a large lattice mismatch. still.

LiNb0.とZnOの(0001)面の格子不整合は
約8チで、Si基板上へ直接成膜するよりも有利である
ことが分かる。
LiNb0. It can be seen that the lattice mismatch between the (0001) plane of ZnO and ZnO is about 8 degrees, which is more advantageous than forming a film directly on a Si substrate.

以上の実施例によりこれまで用いられていたサファイヤ
等の高価な基板材料でなくてもLiNb1−zTaxo
s (0≦X≦1)単結晶薄膜を作製できることが示さ
れた。尚% Z n O単結晶薄膜を作製するだめの基
板材料としては、上記のサファイヤ、Siに限るもので
は無い。即ち、ZnO薄膜単結晶をヘテロエピタキシャ
ル成長させる事が可能であると報告されている基板材料
GaP(111)、GaAs(111)、CdTe(1
11)、ZnS(111を用いて上記と同様な成膜実験
を行ったところ、これらの基板を用いても結晶性の良好
なLiNb1−XTaxO3(0≦X≦1)単結晶薄膜
が得られる事が確認された。
According to the above embodiments, LiNb1-zTaxo
It was shown that s (0≦X≦1) single crystal thin film can be produced. Note that the substrate material for producing the ZnO single crystal thin film is not limited to the above-mentioned sapphire and Si. That is, substrate materials GaP (111), GaAs (111), and CdTe (1
11) When we performed a film formation experiment similar to the above using ZnS (111), we found that a LiNb1-XTaxO3 (0≦X≦1) single crystal thin film with good crystallinity could be obtained using these substrates. was confirmed.

〈発明の効果〉 本発明により、成膜後のポーリング処理なしにLiNb
1−)(TaxO3(0QXQ1 )の単一強誘電性分
域構造を有した単結晶薄膜を得ることが可能となる。ま
た、Si等の安価な基板材料を用いてLiNb1−XT
aXo3 (0≦X≦1)単結晶薄膜を作製することも
可能となる。従って、各種デバイス開発に供する為の、
LiNb1−XTaXo3(O≦X≦1)単結晶薄膜の
作成において、効率化と低コスト化が図れる。
<Effects of the Invention> According to the present invention, LiNb can be formed without poling treatment after film formation.
1-) It becomes possible to obtain a single crystal thin film with a single ferroelectric domain structure of (TaxO3(0QXQ1).Also, it is possible to obtain a single crystal thin film having a single ferroelectric domain structure of (TaxO3(0QXQ1).
It is also possible to produce an aXo3 (0≦X≦1) single crystal thin film. Therefore, for use in various device development,
In the production of a LiNb1-XTaXo3 (O≦X≦1) single crystal thin film, efficiency and cost reduction can be achieved.

【図面の簡単な説明】[Brief explanation of the drawing]

善i図は本発明による一実施例で得られた薄膜のX線回
折パターンを示す因である。
The X-ray diagram shows an X-ray diffraction pattern of a thin film obtained in an example according to the present invention.

Claims (2)

【特許請求の範囲】[Claims] 1.酸素ガスプラズマ雰囲気中で、Li源として金属L
i又はその酸化物、Nb源として金属Nb又はその酸化
物、Ta源として金属Ta又はその酸化物を各々独立に
加熱温度を調節することにより蒸発量を制御し、基板上
に同時蒸着させる際、基板温度を400乃至800℃に
保ち、基板として酸化亜鉛単結晶(0001)面を用い
てなることを特徴とする強誘電体薄膜の製造方法。
1. In an oxygen gas plasma atmosphere, metal L is used as a Li source.
i or its oxide, metal Nb or its oxide as the Nb source, metal Ta or its oxide as the Ta source, and the amount of evaporation is controlled by independently adjusting the heating temperature, and when simultaneously depositing on the substrate, A method for producing a ferroelectric thin film, characterized in that the substrate temperature is maintained at 400 to 800° C. and a zinc oxide single crystal (0001) plane is used as the substrate.
2.請求項第1項記載の基板は、サファイヤ(0001
)、Si(111)、GaP(111)、GaAs(1
11)、CdTe(111)、ZnS(111)面のい
ずれわの基板面上にヘテロエピタキシャル成長させた酸
化亜鉛単結晶(0001)面であることを特徴とする強
誘電体薄膜の製造方法。
2. The substrate according to claim 1 is made of sapphire (0001
), Si(111), GaP(111), GaAs(1
11) A method for manufacturing a ferroelectric thin film, characterized in that the film is a zinc oxide single crystal (0001) surface that is heteroepitaxially grown on either a CdTe (111) or ZnS (111) surface.
JP259889A 1989-01-09 1989-01-09 Manufacturing method of ferroelectric thin film Expired - Fee Related JP2710973B2 (en)

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JP259889A JP2710973B2 (en) 1989-01-09 1989-01-09 Manufacturing method of ferroelectric thin film

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Application Number Priority Date Filing Date Title
JP259889A JP2710973B2 (en) 1989-01-09 1989-01-09 Manufacturing method of ferroelectric thin film

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JPH02184599A true JPH02184599A (en) 1990-07-19
JP2710973B2 JP2710973B2 (en) 1998-02-10

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Country Link
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5347157A (en) * 1992-12-17 1994-09-13 Eastman Kodak Company Multilayer structure having a (111)-oriented buffer layer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5347157A (en) * 1992-12-17 1994-09-13 Eastman Kodak Company Multilayer structure having a (111)-oriented buffer layer

Also Published As

Publication number Publication date
JP2710973B2 (en) 1998-02-10

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