JPH02190495A - Stripe plating device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an improvement in an apparatus for manufacturing striped plating strips using a plating solution injection method.

[Conventional technology] Electronic component materials such as lead frames for ICs are required to have high reliability, and their bonding surfaces and electrical contacts are plated with expensive precious metals such as gold. It is common practice to bend the solder plating to facilitate bonding.

Stripe plating was developed to plate such precious metals, solder, etc. to the minimum necessary range, and to save materials and reduce costs.

The above-mentioned conventional stripe plating involves leaving only the surface to be plated of the strip to be plated, blocking all other surfaces with resist agent or masking tape, and immersing this in a plating solution.
Generally, plating was carried out by stirring and spraying an electrolytic solution onto the surface to be plated.

However, in this conventional method, since areas other than the surface to be plated are masked with masking tape, a large amount of masking tape is required compared to the size of the plating surface, which is unavoidably expensive. If a large amount of material is carried out, and if all surfaces other than the surface to be plated are masked are passed through the plating tank or guide rolls, breakage may occur due to cracks at the edges of the slits of the wave-rejecting plating strips. Plating solution penetrated through the torn area and caused displacement plating, which could lead to poor appearance.

Therefore, the inventors previously proposed a plating device as shown in FIG.

That is, the plating strip 20 is held in a longitudinal direction while keeping its wide side vertical and being pressed by the presser roll 2, and the plating strip 20 is
Leaving the plating surface 21 partially masked using masking tape 22 in a separate masking process, and then removing the plating solution tank 4.
The plating solution 30 stored in the plating solution 30 is forcibly circulated by the pump 5 as shown by the arrow in the figure, and after being temporarily stored in the auxiliary tank 6, the pressurized plating solution is applied from the nozzle 3 to the surface to be plated. Inject on 21. The outer periphery of the nozzle 3 is provided with a mantle 1 that forms an opening surface having a width that is narrower than the width of the masking tape 22 of the strip to be plated and that causes the inner surface of the masking tape 22 to protrude somewhat inward. A recovery lower ′ is formed between the mantle 1 and the nozzle 3 , and a suction pump 8 is connected to the top of the plating solution tank 4 .
The plating solution 30 is evacuated and the inside of the plating solution tank 4 is made negative pressure, so that the plating solution sprayed onto the surface to be plated 21 is sucked by the recovery lower, and the excess plating solution 30 is sucked into the plating solution tank 4. It will be collected. The auxiliary tank 6' is provided for stabilizing the pressure for spraying the plating solution and for installing the anode material 10, and contains the pressurized plating solution 30.
is temporarily stored under pressure in the auxiliary tank 6' and is injected through the nozzle 3.

11 is a portion for dividing the inside of the plating solution W44 to improve the efficiency of suction and recovery of the plating solution. I'Al.

[Problems to be Solved by the Invention] The previously proposed apparatus described above can perform excellent stripe plating, and has already been put into practical use and has been well received. However, in the above apparatus, a soluble electrode is used. In this case, there is a problem in that it is not easy to replenish and replace electrodes. That is, the auxiliary tank is built into the plating liquid tank, and when it is attempted to replenish or replace the electrodes, it takes a very long time.

The purpose of the present invention is to solve the problems of the prior art described above,
The present invention aims to provide a novel stripe plating device that can greatly simplify and speed up the replenishment and replacement of electrodes.

[Means for Solving the Problems] In the present invention, an auxiliary tank for temporarily storing the plating solution sprayed from the nozzle is installed so as to be openable and closable independently of the plating solution tank.

[Operation] If the auxiliary tank is configured to be able to be opened and closed independently, the electrodes therein can be replenished or replaced much more easily and quickly than in previously proposed devices.

[Example] The present invention will be described below with reference to the drawings.

FIG. 1 is an explanatory cross-sectional view showing how stripe plating is performed using the plating apparatus according to the present invention, and FIG. 2 is a cross-sectional view taken along line AA in FIG. 1, and FIG. The same reference numerals indicate substantially the same configurations.

Reference numeral 20 denotes a plated strip that runs in the longitudinal direction while keeping the wide surface vertical as in FIG. 3, and 22 is a masking tape that is partially masked leaving the plated surface 21, and is partially masked in a separate masking process. It is something that will be done.

The plating solution 30 stored in the plating solution tank 4 is forced to circulate as shown by the arrow in the figure using the pump 5 and piping 5a, and after being temporarily stored in the auxiliary tank 6, the unpressurized plating solution is passed through the nozzle. 3 onto the surface to be plated 21.

As shown in FIG. 3, in the conventional example, the auxiliary tank 6'' was built inside the plating liquid tank 4, but in the present invention, it is installed independently from the plating liquid tank 4. For example, it is constructed so that it can be opened and closed independently with a sealable opening/closing!! 9 using a gasket.

With this configuration that can be opened and closed independently, the anode material 10 serving as the electrode can be easily replenished or replaced by simply opening the opening/closing lid 9, eliminating the complicated work required in the conventional example. This eliminates the need for consumable electrodes, allows simple and quick work to be carried out in a short time, and makes it very easy to perform plating using consumable electrodes. However, there is no problem in using electrodes other than consumable electrodes, and it goes without saying that even in this case, advantages such as ease of attachment and detachment can be achieved.

The width of the outer surface of the nozzle 3 is narrower than the width of the masking tape 22 of the strip to be plated, and the width of the masking tape 1 is similar to the conventional example.
A mantle 1 is provided which forms an opening surface having a width such that the inner surface of the plating material 22 protrudes somewhat inward, and below the mantle 1, a collection lower for collecting the plating solution after being sprayed communicates with the plating solution tank. The plating solution WI4 is evacuated by a suction pump 8 at the upper part of the plating solution tank 4, and the inside of the plating solution WI4 is made negative pressure, so that the plating solution sprayed onto the surface to be plated 21 is sucked by the collection lower. The surplus plating solution 30 is sucked and collected into the plating solution tank 4.

If the auxiliary tank 6 is not installed inside the plating solution tank 4 but is constructed as a separate and independent structure, the plating solution tank itself can be downsized and the entire tank can be made compact.

[Effects of the Invention] As described above, according to the plating apparatus according to the present invention, since the auxiliary tank is installed so that it can be opened and closed independently of the plating solution tank, replenishment and replacement of electrodes can be done almost easily by opening the lid. This can be done with a single touch, and enables plating using a consumable electrode method that is effective in maintaining the plating solution at 4 degrees Celsius. This facilitates plating solution management, improves the quality of the plating layer, and contributes to overall cost savings. The significance of what you get is great.

[Brief explanation of the drawing]

Fig. 1 is an explanatory cross-sectional view showing how stripe plating is performed using the apparatus according to the present invention, and Fig. 2 is an A-A in Fig. 1.
3 is an explanatory cross-sectional view showing how stripe plating is performed using a conventional plating apparatus. 1: Mantle, 3: Nozzle, 4: Plating solution tank, 5: Supply pump, 6: Auxiliary tank, 7: Collection port, 8: Suction pump, 9: Opening/closing lid, 10: Anode material, 20: Plating strip, 21: Surface to be plated, 22: Masking tape, 30: Plating solution.

Claims (1)

[Claims] (1) A nozzle that sprays the plating solution in the plating solution tank toward the plating surface, a jacket that partitions the periphery of the nozzle and forms a plating opening surface, and a negative pressure inside the plating tank that sprays the plating solution. In a device having a suction means for recovering the plating solution into the plating tank, an auxiliary tank for temporarily storing the plating solution sprayed from the nozzle is provided independently, and the auxiliary tank can be opened and closed independently from the plating solution tank. Stripe plating equipment consisting of: