JPH02194200A - Additive for plating bath - Google Patents

Additive for plating bath

Info

Publication number
JPH02194200A
JPH02194200A JP1108989A JP1108989A JPH02194200A JP H02194200 A JPH02194200 A JP H02194200A JP 1108989 A JP1108989 A JP 1108989A JP 1108989 A JP1108989 A JP 1108989A JP H02194200 A JPH02194200 A JP H02194200A
Authority
JP
Japan
Prior art keywords
additive
plating
pva
film
gelatin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1108989A
Other languages
Japanese (ja)
Inventor
Hiroaki Takayama
高山 紘明
Takeshi Okada
健 岡田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eagle Industry Co Ltd
Original Assignee
Eagle Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eagle Industry Co Ltd filed Critical Eagle Industry Co Ltd
Priority to JP1108989A priority Critical patent/JPH02194200A/en
Publication of JPH02194200A publication Critical patent/JPH02194200A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating And Plating Baths Therefor (AREA)

Abstract

PURPOSE:To improve the compatibility of the body of an additive with a plating soln. and to stabilize a plating film formed with the plating soln. by dissolving the body of the additive to be added to an electroplating bath in an aq. soln. of PVA. CONSTITUTION:The body of an additive is dissolved in an aq. soln. of PVA to obtain this additive for a plating bath. Gelatin or glue is used as the body of the additive. The PVA fulfills the function of a surfactant, improves the compatibility of the body of the additive with a plating soln. and keeps the body of the additive in a uniform state. Since a coating film of PVA is formed, a plating film is protected.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、電気めっきのめっき浴に添加される添加剤に
関する。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an additive added to a plating bath for electroplating.

(従来の技術) 従来から金属の電気めっき処理は、めっき対象金属を陰
極とし、めっき膜として生成されるべき金属を陽極とし
てめっき浴中に浸漬し、陽極と陰極間に電圧を加えるこ
とにより成される。すなわち、陽極金属がめつき浴中に
溶解して金属イオンとなり;陰極側のめっき対象金属表
面に金属イオンが析出してめっき膜が生成される。
(Prior art) Conventionally, electroplating of metals has been carried out by immersing the metal in a plating bath with the metal to be plated as the cathode and the metal to be formed as a plating film as the anode, and applying a voltage between the anode and the cathode. be done. That is, the anode metal dissolves in the plating bath and becomes metal ions; the metal ions precipitate on the surface of the metal to be plated on the cathode side, forming a plating film.

めっき浴の主成分としては、通常めっきする金属の塩を
硫酸塩、塩化物、シアン化物等の形で用い、めうき膜と
して微細で均一なめっきを得るための添加剤が添加され
る。この添加剤として、従来からにかわやゼラチン等の
有機物が用いられていた。
The main components of the plating bath are usually salts of the metal to be plated in the form of sulfates, chlorides, cyanides, etc., and additives are added to obtain fine and uniform plating as a plating film. Conventionally, organic substances such as glue and gelatin have been used as this additive.

(発明が解決しようとする課題) しかしながら上記した従来技術の場合には、めっき浴の
温度変化、PH変化によりゼラチン等が凝集してめっき
浴として使用できなくなることがあった。これは、にか
わやゼラチンが一種の誘導タンパク質であるために、微
量であれば水に溶けるが不安定でゾル状に成り易い性質
を有するからである。特に温水であれば低濃度(1%以
下)で溶解するが、めっき液の温度低下、PHの変動等
により白濁状になり易く、この場合にはめっきが不可能
となってしまう。
(Problems to be Solved by the Invention) However, in the case of the above-mentioned prior art, gelatin and the like may aggregate due to changes in the temperature and pH of the plating bath, making it impossible to use the bath as a plating bath. This is because glue and gelatin are a type of induced protein, and although they are soluble in water in trace amounts, they are unstable and tend to form a sol. Particularly in hot water, it dissolves at a low concentration (1% or less), but it tends to become cloudy due to a drop in the temperature of the plating solution, fluctuations in pH, etc., and in this case, plating becomes impossible.

本発明は上記し・た従来技術の課題を解決するためにな
されたもので、その目的とするところは、めっき膜を安
定して電析させ得るめっき浴添加剤を提供することにあ
る。
The present invention was made to solve the problems of the prior art described above, and its purpose is to provide a plating bath additive that can stably electrodeposit a plating film.

(課題を解決するための手段) 上記目的を達成するために、本発明のめっき浴添加剤は
、添加剤本体をポリビニルアルコールの水溶液に溶解さ
せたものから構成した。
(Means for Solving the Problems) In order to achieve the above object, the plating bath additive of the present invention is composed of an additive main body dissolved in an aqueous solution of polyvinyl alcohol.

添加剤本体はゼラチンまたはにかわであることが望まし
い。
Preferably, the additive body is gelatin or glue.

(作 用) 而して、ポリビニルアルコールの水溶液中にゼラチンや
にかわ等の添加剤本体を溶解することで、ポリビニルア
ルコールが界面活性剤的機能を果し、添加剤本体とめっ
き液との相溶性が良くなり、添加剤本体がめつき液中に
均一状態に保持される。
(Function) By dissolving the additive body such as gelatin or glue in an aqueous solution of polyvinyl alcohol, the polyvinyl alcohol functions as a surfactant and improves the compatibility between the additive body and the plating solution. The additive body is maintained in a uniform state in the plating solution.

さらに、生成されためっき膜表面にポリビニルアルコー
ルの皮膜が生成され、めっき膜が外部環境から保護され
る。
Furthermore, a polyvinyl alcohol film is formed on the surface of the formed plating film, thereby protecting the plating film from the external environment.

(実施例) 以下に本発明を図示の実施例に基づいて説明する。第1
図には本発明の一実施例に係るめっき浴添加剤をめっき
液に添加する状態を示している。
(Example) The present invention will be explained below based on the illustrated example. 1st
The figure shows a state in which a plating bath additive according to an embodiment of the present invention is added to a plating solution.

すなわち、ポリビニルアルコール(以下PVAという)
の水溶液1中に所定量の添加剤本体としてのゼラチン2
を溶解して添加剤3を製造する。
That is, polyvinyl alcohol (hereinafter referred to as PVA)
A predetermined amount of gelatin 2 as an additive body in an aqueous solution 1 of
Additive 3 is produced by dissolving.

添加剤本体としては、ゼラチンの他に、にかわ。In addition to gelatin, the main additives include glue.

アラビヤゴム、デキストリン、でんぷん等の有機物、あ
るいは珪酸ソーダ等の無機物等を用いることができる。
Organic substances such as gum arabic, dextrin, and starch, or inorganic substances such as sodium silicate, etc. can be used.

PVA水溶液1は、この実施例では50%の濃度のもの
が用いられ、たとえば第2図に示す工程を経て作られる
。まず、第2図(a)に示すように、PVA4を純水5
に少量づつ添加し、いわゆる「ままこ」が生じないよう
に純水中に均一に分散させる= 次に、PVA4が均一に水を含んで分散したら、第2図
(ロ)に示すように70〜100°Cに昇温させる。そ
して、そのまま一定時間経過すると、第2図(C)に示
すようにPVA4は水中に完全に溶解されてPVA水溶
液1ができる。
The PVA aqueous solution 1 used in this example has a concentration of 50%, and is prepared, for example, through the steps shown in FIG. First, as shown in Fig. 2(a), PVA4 was mixed with 55% pure water.
Add it little by little and disperse it uniformly in pure water to avoid so-called "mamako" = Next, when PVA4 is evenly dispersed with water, it will be 70% as shown in Figure 2 (b). Raise the temperature to ~100°C. Then, after a certain period of time has passed, PVA 4 is completely dissolved in water to form a PVA aqueous solution 1, as shown in FIG. 2(C).

この実施例では、PVA水溶液1 100dにゼラチン
2を10g溶解して添加剤3とし、この添加剤3をめっ
き液に30〜50g/J!の割合で添加した。
In this example, 10 g of gelatin 2 was dissolved in 100 d of PVA aqueous solution 1 to obtain additive 3, and this additive 3 was added to the plating solution at a rate of 30 to 50 g/J! It was added at a ratio of

添加剤3はめっき液の使用回数(電解量)によって消費
されるので、適宜添加しなければならない、添加剤3の
必要添加量は、ハルセル試験を利用するようにすればよ
い。
Since the additive 3 is consumed depending on the number of times the plating solution is used (the amount of electrolysis), the required amount of the additive 3 must be added as appropriate by using the Hull cell test.

めっき浴としては種々のめっき浴に適用可能で、あるが
、この実施例では鉛めっき浴、特にホウフッ化鉛めっき
浴に添加する場合について説明する。
Although it can be applied to various plating baths, in this example, the case where it is added to a lead plating bath, particularly a lead borofluoride plating bath will be explained.

めっき液としては、鉛の硫酸塩や塩化物、シアン化物等
が用いられるが、この実施例では鉛濃度が100〜18
0g/j!のホウフッ化水素酸10〜40g、l!が用
いられている。そして、第3図に示すように、めっき液
6中に、めっき対象金属7を陰極とし、めっきすべき金
属8を陽極として浸漬し、この陰極と陽極間に電圧を加
える。めっき液6の温度としては30〜40 ’Cとし
、陰極電流密度を0.5〜3A/drrfの条件下でめ
っきを行なった。
Lead sulfate, chloride, cyanide, etc. are used as the plating solution, but in this example, the lead concentration was 100 to 18
0g/j! of 10-40 g of fluoroboric acid, l! is used. Then, as shown in FIG. 3, the metal to be plated 7 is used as a cathode and the metal 8 to be plated is used as an anode and immersed in a plating solution 6, and a voltage is applied between the cathode and the anode. The temperature of the plating solution 6 was 30 to 40'C, and plating was performed under the conditions of a cathode current density of 0.5 to 3 A/drrf.

このような添加剤を用いたことにより、PVAが界面活
性剤として機能し、ゼラチンとめっき液6との相溶性が
向上してゼラチンがめつき液中に均一に分散する。そし
て、めっき液としてのホウフッ化水素液に温度変化やP
H1変化が生じたとしても、ゼラチン等は凝集するよう
なことは無く安定した状態に保持され、むらの無い均一
なめっき膜を生成することができた。
By using such an additive, PVA functions as a surfactant, improving the compatibility between gelatin and the plating solution 6, and dispersing gelatin uniformly in the plating solution. Then, temperature changes and P
Even if the H1 change occurred, gelatin etc. did not aggregate and was maintained in a stable state, making it possible to produce a uniform plating film without unevenness.

さらに、PVAは優れたフィルム形成能°および接着性
に優れているので、めっき液6中にPVA水溶液が混入
することにより、第4図に示すようにめっき処理後のめ
っき膜9表面にフィルム状に薄(残留してPVA皮膜1
0が生成される。このPVA皮膜10の水分を揮発させ
ることにより強固な保護皮膜となる。PVA皮膜10の
生成は、たとえばめっき処理後、めっき液6からめつき
製品を引き上げた後に熱風乾燥させ、めっき膜9表面に
付着したPVAから水分を揮発させることにより行なう
、このPVA皮膜10は透明でめっき膜9表面の色調は
PVA皮膜10を通じて外部から目視可能である。そし
て、PVA皮膜10によってめっき膜9表面が環境から
保護され、めっき膜9表面の変色シミの発生度合が低下
するという効果も得られた。
Furthermore, since PVA has excellent film-forming ability and excellent adhesion, when the PVA aqueous solution is mixed into the plating solution 6, a film-like layer is formed on the surface of the plating film 9 after plating, as shown in FIG. thin (remaining PVA film 1)
0 is generated. By volatilizing the moisture in this PVA film 10, it becomes a strong protective film. The PVA film 10 is generated by, for example, removing the plated product from the plating solution 6 after plating and drying it with hot air to evaporate water from the PVA attached to the surface of the plating film 9. This PVA film 10 is transparent. The color tone of the surface of the plating film 9 is visible from the outside through the PVA film 10. Furthermore, the PVA film 10 protected the surface of the plating film 9 from the environment, and the effect of reducing the degree of discoloration and staining on the surface of the plating film 9 was also obtained.

(発明の効果) 本発明は、以上の構成および作用を有するもので、ポリ
ビニルアルコール水溶液にゼラチンを溶解してめっき浴
添加剤としたので、ゼラチン等とめっき液との間の相溶
性が良くなり、めっき膜を安定して生成することができ
、生産能率の向上を図ることができる。
(Effects of the Invention) The present invention has the above-described structure and operation, and since gelatin is dissolved in an aqueous polyvinyl alcohol solution and used as a plating bath additive, the compatibility between gelatin, etc. and the plating solution is improved. , a plating film can be stably produced, and production efficiency can be improved.

また、生成されためっき膜表面にポリビニルアルコール
の皮膜が生成され、めっき膜の変色等を防止することが
できめっき膜の品質向上を図ることができる。
In addition, a polyvinyl alcohol film is formed on the surface of the formed plating film, which can prevent discoloration of the plating film and improve the quality of the plating film.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図(a)、■)は本発明の一実施例に係るめっき浴
添加剤の製造工程の一例を示す工程図、第2図(a)乃
至(C)は第1図の添加剤の製造に用いるPVA水溶液
の製造工程の一例を示す工程図、第3図はめっき溶の基
本的構成を示す断面図、第4図は生成されためっき膜の
概略断面図である。 符  号  の  説  明 1・・・PVA水溶液 2・・・ゼラチン(添加剤本体
)3・・・添加剤 4・・・PVA(ポリビニルアルコール)6・・・めっ
き液   9・・・めっき膜10・・・PVA皮膜
Figures 1 (a) and (■) are process diagrams showing an example of the manufacturing process of a plating bath additive according to an embodiment of the present invention, and Figures 2 (a) to (C) are FIG. 3 is a sectional view showing the basic structure of the plating solution, and FIG. 4 is a schematic sectional view of the produced plating film. Explanation of symbols 1... PVA aqueous solution 2... Gelatin (additive main body) 3... Additive 4... PVA (polyvinyl alcohol) 6... Plating solution 9... Plating film 10.・PVA film

Claims (2)

【特許請求の範囲】[Claims] (1)添加剤本体をポリビニルアルコールの水溶液に溶
解したことを特徴とするめっき浴添加剤。
(1) A plating bath additive characterized in that the additive itself is dissolved in an aqueous solution of polyvinyl alcohol.
(2)添加剤本体はゼラチンまたはにかわである請求項
1に記載のめっき浴添加剤。
(2) The plating bath additive according to claim 1, wherein the main body of the additive is gelatin or glue.
JP1108989A 1989-01-20 1989-01-20 Additive for plating bath Pending JPH02194200A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1108989A JPH02194200A (en) 1989-01-20 1989-01-20 Additive for plating bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1108989A JPH02194200A (en) 1989-01-20 1989-01-20 Additive for plating bath

Publications (1)

Publication Number Publication Date
JPH02194200A true JPH02194200A (en) 1990-07-31

Family

ID=11768260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1108989A Pending JPH02194200A (en) 1989-01-20 1989-01-20 Additive for plating bath

Country Status (1)

Country Link
JP (1) JPH02194200A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013040371A (en) * 2011-08-15 2013-02-28 Pan Pacific Copper Co Ltd Apparatus and method of producing metal

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5429977A (en) * 1977-08-10 1979-03-06 Hitachi Ltd Detection system for position
JPS5611756A (en) * 1979-07-10 1981-02-05 San Ei Chem Ind Ltd Frozen food
JPS59596A (en) * 1982-06-24 1984-01-05 Mitsubishi Electric Corp In-line pump apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5429977A (en) * 1977-08-10 1979-03-06 Hitachi Ltd Detection system for position
JPS5611756A (en) * 1979-07-10 1981-02-05 San Ei Chem Ind Ltd Frozen food
JPS59596A (en) * 1982-06-24 1984-01-05 Mitsubishi Electric Corp In-line pump apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013040371A (en) * 2011-08-15 2013-02-28 Pan Pacific Copper Co Ltd Apparatus and method of producing metal

Similar Documents

Publication Publication Date Title
US5215646A (en) Low profile copper foil and process and apparatus for making bondable metal foils
US9976223B2 (en) Nickel and/or chromium plated member and method for manufacturing the same
CN102758230B (en) Gold electroplating solution and gold electroplating method
CN112111761B (en) Electrolyte of high-elongation electrolytic copper foil and application thereof
CN101260549B (en) Non-preplating type non-cyanide silver-plating electroplate liquid
JP2012504701A (en) Method for depositing a palladium-rhodium layer with improved whiteness
JPH0270084A (en) Gold plating bath and gold plating method
CN106591897A (en) Cyanide-free ionic-liquid copper-plating solution and copper plating process
CN111020643B (en) Double-sided smooth copper foil and preparation method and device thereof
JPS647153B2 (en)
Portela et al. Nicotinic acid as brightener agent in copper electrodeposition
CN204585986U (en) Nickel plating-chromium parts
US11255021B2 (en) Aqueous formulation for creating a layer of gold and silver
JP2005520048A5 (en)
DE2618638B2 (en) Electroplating bath and process for the deposition of coatings from tin-containing alloys
CN107653464A (en) A kind of anode activation agent for non-cyanide silver coating and preparation method thereof
JP3282875B2 (en) Palladium plating solution and palladium plating method using the plating solution
JPS5858296A (en) Method for plating stainless steel blank with gold
JPS6253598B2 (en)
JPH0748681A (en) Plating method using both electroless plating and electroplating
JPH03120390A (en) Low stress nickel plating bath
CN109652830A (en) A kind of cobalt-manganese-phosphorus magnetism electroplate liquid and preparation method thereof
CN107604394A (en) A kind of silver-colored electroplate liquid
JPH0860395A (en) Palladium plating solution
JPS5944400B2 (en) Flow anodizing treatment method for aluminum or its alloy