JPH02194352A - Inspection device for surface of transparent substrate - Google Patents

Inspection device for surface of transparent substrate

Info

Publication number
JPH02194352A
JPH02194352A JP1450289A JP1450289A JPH02194352A JP H02194352 A JPH02194352 A JP H02194352A JP 1450289 A JP1450289 A JP 1450289A JP 1450289 A JP1450289 A JP 1450289A JP H02194352 A JPH02194352 A JP H02194352A
Authority
JP
Japan
Prior art keywords
scattered light
light
substrate
scattered
transparent substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1450289A
Other languages
Japanese (ja)
Inventor
Tokio Oodo
大戸 時喜雄
Yasushi Zaitsu
財津 靖史
Hiroshi Hoshikawa
星川 寛
Keisuke Sugimoto
啓介 杉本
Yasuaki Nanba
難波 泰明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP1450289A priority Critical patent/JPH02194352A/en
Publication of JPH02194352A publication Critical patent/JPH02194352A/en
Pending legal-status Critical Current

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  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

PURPOSE:To inspect the surface of a substrate without being affected by a defect or foreign matter on the reverse surface of the substrate by cutting off scattered light by a light shield plate which is arranged on the object-point side of the condenser lens of a scattered light photodetection part or a slit arranged at the image point. CONSTITUTION:A light beam 11 which is emitted by a laser oscillator 10 is converged by a scanning lens 14 to irradiate the surface 16a of the transparent substrate as a sample at a low angle. The scattered light 17 generated by the foreign matter or defect on the surface 16a is photodetected by a scattered light photodetection part 21 and converted into an electric signal, which is a scattered light signal 30 corresponding to the quantity of photodetection. Further, the sample 16 is moved by a moving mechanism 25 in a direction P perpendicular to the scanning direction of the beam 11. Then the scattered light which is transmitted through the sample 16 and generated by the foreign matter or defect on the reverse surface 16b is cut off by the light shield plate 50 arranged on the object point side of the condenser lens 18 or the slit arranged at the image point of the lens 18. Therefore, the inspection is affected by neither the foreign matter nor defect on the reverse surface 16b.

Description

【発明の詳細な説明】[Detailed description of the invention] 【産業上の利用分野】[Industrial application field]

本発明は、液晶表示板や半導体プロセスのホトマスクに
用いられるガラス基板等の透明基板表面を光ビームで走
査し1表面上の欠陥や付着異物によって生じる散乱光を
検出することによって表面状態を検査する透明基板表面
検査装置に関する。
The present invention inspects the surface condition by scanning the surface of a transparent substrate such as a glass substrate used for a liquid crystal display board or a photomask for semiconductor processing with a light beam and detecting scattered light caused by defects or attached foreign matter on the surface. The present invention relates to a transparent substrate surface inspection device.

【従来の技術】[Conventional technology]

従来、固体表面上の欠陥および付着異物を検出する装置
としては、半導体プロセスで用いられるウェハを対象と
したウェハ表面異物検出装置、クロム膜、酸化クロム膜
、レジスト塗布等各種膜イ]マスクブランクスを対象と
したマスク検査装置がある。これら装置は、いずれも1
/−ザーを光源とした散乱光検出方式を採用している。 第7図に上述したマスク検査装置の検出部の光学系を示
す。レーザビーム1を走査レンズ2でマスク表面9a上
にフォーカスし、さらに図示したように紙面垂直方向に
走査する。マスク表面9a上に異物があれば散乱光4が
発生するため、これを側方散乱光検出部3で受光する。 また、マスク9にピンホールがあれば、マスク下部に設
けられたミラー5と透過光受光部6によって透過光7と
回折光8を受光する。なお、前述したウェハ表面検査装
置の検出部は、基本的には上述の透過光検出機構(5,
6)を除いたものに相当する。 いずれにせよ、これら従来技術による検査装置は不透明
鏡面(あるいはパターン付)基板を検査対象とするもの
である。
Conventionally, devices for detecting defects and attached foreign matter on solid surfaces include wafer surface foreign matter detection devices for wafers used in semiconductor processes, various films such as chrome films, chromium oxide films, resist coatings, and mask blanks. There is a mask inspection device targeted for this purpose. These devices are all 1
A scattered light detection method using a /- laser as a light source is adopted. FIG. 7 shows the optical system of the detection section of the mask inspection apparatus described above. Laser beam 1 is focused onto mask surface 9a by scanning lens 2, and further scanned in a direction perpendicular to the plane of the paper as shown. If there is any foreign matter on the mask surface 9a, scattered light 4 is generated, which is received by the side scattered light detector 3. Further, if the mask 9 has a pinhole, the transmitted light 7 and the diffracted light 8 are received by the mirror 5 and the transmitted light receiving section 6 provided at the lower part of the mask. Note that the detection section of the wafer surface inspection apparatus described above is basically the transmitted light detection mechanism (5,
6) is excluded. In any case, these conventional inspection devices are intended to inspect opaque mirror-surfaced (or patterned) substrates.

【発明が解決しようとする課題】[Problem to be solved by the invention]

これらの装置を用いて透明な基板を検査しようとすると
、基板の表に付着した異物と裏に付着した異物の区別が
できない。なぜならば、基板の表面にフォーカスされた
レーザビームは表面の異物によって散乱されるとともに
基板を透過して裏面に達し、裏面に付着した異物によっ
ても散乱される。裏面からの散乱光は基板を透過して散
乱光受光部3で検出される。 本発明は上記の点に鑑みてなされたものであって、透明
基板の裏面に付着した異物や欠陥によって影響されるこ
となく、基板表面のみを検査できるような透明基板表面
検査装置を提供することを目的とする。
When attempting to inspect a transparent substrate using these devices, it is impossible to distinguish between foreign matter attached to the front side of the substrate and foreign matter attached to the back side of the substrate. This is because a laser beam focused on the front surface of the substrate is scattered by foreign objects on the front surface, passes through the substrate, reaches the back surface, and is also scattered by foreign objects attached to the back surface. Scattered light from the back surface passes through the substrate and is detected by the scattered light receiver 3. The present invention has been made in view of the above points, and an object of the present invention is to provide a transparent substrate surface inspection device that can inspect only the surface of the substrate without being affected by foreign matter or defects attached to the back surface of the transparent substrate. With the goal.

【課題を解決するだめの手段】[Means to solve the problem]

上記目的を達成するために、本発明においては、透明基
板表面検査装置を、透明な基板の表面に低角度で光ビー
ムを照射し基板表面トに光スボ・ン]・を形成する投光
手段と、基板表面北の光スポ・ントを移動させる移動手
段と、光スポットが形成された基板表面の欠陥や異物等
の散乱中心によって光ビームが散乱されて生じる散乱光
を受光してその受光量に応じた電気信号を出力する散乱
光受光手段と、基板を透過した光ビームが基板裏面の欠
陥や異物等の散乱中心によって散乱されて生じる散乱光
の散乱光受光部への到達を阻止する散乱光阻止手段と、
から構成した。 そうして、本発明によれば、散乱光阻止手段を、散乱光
受光手段の集光レンズの物点側に配置された遮光板、あ
るいは、散乱光受光手段の集光レンズの像点に配置され
たスリットとする。
In order to achieve the above object, the present invention provides a transparent substrate surface inspection apparatus with a light projecting means that irradiates a light beam onto the surface of a transparent substrate at a low angle to form a light bubble on the surface of the substrate. , a moving means for moving the light spot north of the substrate surface, and a method for receiving scattered light generated when the light beam is scattered by a scattering center such as a defect or foreign object on the substrate surface on which the light spot is formed, and detecting the amount of received light. Scattered light receiver that outputs an electric signal according to the current value, and a scatterer that prevents the scattered light generated when the light beam transmitted through the substrate is scattered by a scattering center such as a defect or foreign object on the back side of the substrate from reaching the scattered light receiver. light blocking means;
It was composed of According to the present invention, the scattered light blocking means is arranged on the light blocking plate disposed on the object point side of the condensing lens of the scattered light receiving means or at the image point of the condensing lens of the scattered light receiving means. slit.

【作 用】[For use]

光ビームを基板表面に平行に近い低角度で照射すること
により、基板表面と裏面とにおける光ビームの通過位置
が大きく引き離される。そうして、それぞれの光ビーム
の通過位置に存在する欠陥や異物等の散乱中心からの散
乱光のうち、基板裏面からの散乱光は、散乱光阻止手段
、例えば、散乱光受光手段の集光レンズの物点側に配置
された遮光板、あるいは散乱光受光手段の集光レンズの
像点に配置されたスリット、によって阻止されて、散乱
光受光手段には入射せず、基板裏面の欠陥や異物に影響
されることなく、基板表面の欠陥や異物の有無等基板表
面の検査が可能となる。
By irradiating the light beam at a low angle close to parallel to the substrate surface, the passage positions of the light beam on the front surface and the back surface of the substrate are greatly separated. Among the scattered light from scattering centers such as defects and foreign objects existing at the passing positions of the respective light beams, the scattered light from the back surface of the substrate is collected by the scattered light blocking means, for example, the scattered light receiving means. It is blocked by a light-shielding plate placed on the object point side of the lens or a slit placed at the image point of the condensing lens of the scattered light receiving means, and does not enter the scattered light receiving means, causing defects on the back side of the substrate and It is possible to inspect the substrate surface for defects and foreign matter without being affected by foreign matter.

【実施例】【Example】

第1図は本発明の一実施例を説明するための概要説明図
で、同図(A)は正面図、同図(B)はは側面図である
。第1図において、レーザ発振器10より出射された光
ビーム11は偏向器12によって偏向・走査されミラー
13によって反射され、走査レンズ14に入射し収束さ
れる。収束された光ビームはミラー15で反射され、試
料である透明な基板16の表面16aに対して低角度で
照射される。基板表面16a上の異物または欠陥によっ
て生じた散乱光17は、集光レンズ18、ライトガイド
19および光電変換素子20よりなる散乱光受光部21
によって受光されて、電気信号に変換される。本実施例
においては、散乱光受光部21は基盤16の」二方向、
ミラー15からこの基板16へ入射する光ビームに対し
てほぼ垂直方向において、基板表面16δからの側方散
乱光を受光するように配置されている。また、基板表面
16aでの正反射光22はライトガイド23によって受
光され、光電変換素子24によって電気信号に変換され
、この電気信号は試料の有無および試料領域の検知のた
めの信号31として供される。 また、試料16をレーザビームの走査方向に対して直角
の方向Pに移動させる移動機構25が設けられている。 散乱光受光部21より出力される散乱光信号30および
試料領域信号31の処理回路のブロック図を第2図に示
す。散乱光信号30は、そのパルス波高を識別するため
に複数個の閾電圧の異なる比較器40aないし40nよ
りなる波高弁別回路40に入力され、その結果がデコー
ド回路41を介してI10ボート42に出力される。ま
た、同時に試料領域信号31の立上りからのクロック4
3の発生するパルス数をカウンタ44により積算し、積
算値をI10ボート42に出力する。なお、試料領域信
号31は、第1図(B)の光電変換素子24において得
られたアナログ電気信号を、図外の適宜の手段によって
2値化して得られたものである。CP U45は、散乱
光信号30の波高データと、試料内の位置データとを、
I10ボート42を介して、メモリー46内のしかるべ
きアドレスへ格納する。また、CPU45は、試料領域
信号31の立下がりによって、カウンタ44の内容をリ
セットし、次の試料領域信号31の立上りまで待機する
。試料領域信号31の立上りが、光ビームの走査周期以
上待っても現れない場合は、測定終了とみなし、CPU
45は、メモリー46に格納したパルス波高データと位
置データを整理してI10ポート47を介して表示器4
8にマツプおよびパルス波高毎の異物と欠陥の数として
表示する。なお49は、比較器40a〜40nの閾電圧
の設定等、データの外部からの入力に用いられるキーボ
ードである。 第3図は本発明の一実施例における散乱光阻止手段とそ
の配置の一例を説明するための説明図である。レーザ光
線11が試料16の表面16aの点S1を照射すると、
正反射光22a、透過光22bを生じる。 さらに試料内部に入射した光ビームR1の試料の33点
、34点、S5点−−−−−−における反射によって多
重反射光R2,R3・・−・−を生じる。ここで、点S
1およびS2に異物または欠陥のような散乱中心が存在
すると、それぞれの点を中心に散乱光が生じ1点S1か
らは図中斜線を施して示したASIB、点S2からはA
32Bの集光立体角で集光レンズ18に入射する。そこ
で、遮光板50を図示の位置に設ければ、点S2からの
散乱光17bは遮断され、点S1からの散乱光17aの
みが集光レンズ18に到達することになる。また、S3
,34.S5のような多重反射光の反射点で発生する散
乱光も遮断される。 第4図は、ホストマスク用ガラス基板を測定して得たア
ナログ信号波形を示し、同図(A)は遮光板50を設け
なかった場合を、同図(B)は遮光板50を設けた場合
をそれぞれ示している。ガラス基板の表面と裏面とに第
5図に示すように半分ずつ径10.28μmのポリスチ
レンラテックス標準粒子60を付着させである、第4図
に示した信号波形領域A、Bおよび点E、Fは第5図の
領域A、 Bおよび点E、  Fにそれぞれ対応してい
る。第4図(A)に示した信号には表面の粒子に対応す
るパルスとともに、裏面の粒子に対応するパルスが含ま
れているが、同図(B)においては、表面の粒子による
信号の高さは変化せずに、裏面の粒子に対応するB領域
の信号が消えていることがわかる。 このことから、第3図の光学系は透明基板の表面のみを
検査していることが確認できる。 第6図は、散乱光阻止手段とその配置の他の例を説明す
るための説明図である。第6図が第3図と異なる点は、
散乱光受光手段の集光レンズ18により短焦点のものを
用い、受光した散乱光を結像させてからライトガイドへ
入射させていることである。この場合も、第1実施例で
用いた遮光板50を設ける方法が適用できるが、本実施
例では、点S1からの散乱光の像点Sl’にスリット状
の空間フィルター52を設け、点S2からの散乱光に対
応する像を分離する。この空間フィルター52の効果を
確認するために、第1実施例について行ったのと同様の
実験を行なったところ、第4図の信号波形と同じ結果が
得られた。 以上、本発明を2つの実施例を用いて説明したが、試料
表面の広い領域にわたって検査を行う場合ムこ、上記の
ように試料を固定して光ヒー1、を振らセる以外にも、
照射ビームを固定して試料のみをXY移動、または回転
させる場合にも本発明が有効であるごとは明かである。 また、本発明は、特に透明基板を測定するだめの装置を
開示したものであるが、不透明鏡面試料の検査にも適用
できることば言うまでもない。
FIG. 1 is a schematic explanatory diagram for explaining one embodiment of the present invention, in which FIG. 1A is a front view and FIG. 1B is a side view. In FIG. 1, a light beam 11 emitted from a laser oscillator 10 is deflected and scanned by a deflector 12, reflected by a mirror 13, and incident on a scanning lens 14 where it is converged. The focused light beam is reflected by the mirror 15 and irradiated at a low angle onto the surface 16a of the transparent substrate 16, which is the sample. Scattered light 17 generated by foreign matter or defects on the substrate surface 16a is collected by a scattered light receiving section 21 consisting of a condensing lens 18, a light guide 19, and a photoelectric conversion element 20.
It receives light and converts it into an electrical signal. In this embodiment, the scattered light receiving section 21 is arranged in two directions of the base 16;
It is arranged to receive side scattered light from the substrate surface 16δ in a direction substantially perpendicular to the light beam incident on the substrate 16 from the mirror 15. Further, the specularly reflected light 22 from the substrate surface 16a is received by the light guide 23 and converted into an electrical signal by the photoelectric conversion element 24, and this electrical signal is provided as a signal 31 for detecting the presence or absence of a sample and the sample area. Ru. Further, a moving mechanism 25 is provided that moves the sample 16 in a direction P perpendicular to the scanning direction of the laser beam. A block diagram of a processing circuit for the scattered light signal 30 and sample area signal 31 output from the scattered light receiver 21 is shown in FIG. The scattered light signal 30 is input to a pulse height discrimination circuit 40 consisting of a plurality of comparators 40a to 40n with different threshold voltages in order to identify the pulse height, and the result is outputted to the I10 boat 42 via a decoding circuit 41. be done. At the same time, the clock 4 from the rising edge of the sample area signal 31
A counter 44 integrates the number of pulses generated at 3, and outputs the integrated value to the I10 boat 42. The sample area signal 31 is obtained by binarizing the analog electrical signal obtained by the photoelectric conversion element 24 in FIG. 1(B) by an appropriate means not shown. The CPU 45 receives wave height data of the scattered light signal 30 and position data within the sample.
via the I10 port 42 to the appropriate address in memory 46. Further, the CPU 45 resets the contents of the counter 44 when the sample area signal 31 falls, and waits until the next rise of the sample area signal 31. If the rising edge of the sample area signal 31 does not appear even after waiting longer than the scanning period of the light beam, it is assumed that the measurement has ended, and the CPU
45 organizes the pulse height data and position data stored in the memory 46 and sends them to the display 4 via the I10 port 47.
8 shows the number of foreign objects and defects for each map and pulse height. Note that 49 is a keyboard used for inputting data from the outside, such as setting threshold voltages of the comparators 40a to 40n. FIG. 3 is an explanatory diagram for explaining an example of a scattered light blocking means and its arrangement in an embodiment of the present invention. When the laser beam 11 irradiates the point S1 on the surface 16a of the sample 16,
Specularly reflected light 22a and transmitted light 22b are generated. Furthermore, multiple reflection lights R2, R3, etc. are generated by reflection of the light beam R1 that has entered the sample at points 33, 34, and S5 of the sample. Here, point S
If there is a scattering center such as a foreign object or a defect at points 1 and S2, scattered light will be generated around each point.
The light enters the condenser lens 18 at a condensing solid angle of 32B. Therefore, if the light shielding plate 50 is provided at the illustrated position, the scattered light 17b from the point S2 will be blocked, and only the scattered light 17a from the point S1 will reach the condenser lens 18. Also, S3
, 34. Scattered light generated at a reflection point of multiple reflected light such as S5 is also blocked. FIG. 4 shows analog signal waveforms obtained by measuring the host mask glass substrate, in which (A) shows the case where the light shielding plate 50 is not provided, and (B) shows the case where the light shielding plate 50 is provided. Each case is shown. As shown in FIG. 5, half of the polystyrene latex standard particles 60 with a diameter of 10.28 μm are attached to the front and back surfaces of the glass substrate, and the signal waveform regions A and B and points E and F shown in FIG. 4 are obtained. correspond to areas A and B and points E and F in FIG. 5, respectively. The signal shown in Figure 4 (A) includes pulses corresponding to the particles on the front side as well as pulses corresponding to the particles on the back side, but in Figure 4 (B), the signal height due to the particles on the front side is It can be seen that the signal in the B region corresponding to the particles on the back side disappears without any change in the intensity. From this, it can be confirmed that the optical system shown in FIG. 3 inspects only the surface of the transparent substrate. FIG. 6 is an explanatory diagram for explaining another example of the scattered light blocking means and its arrangement. The difference between Figure 6 and Figure 3 is that
A short focusing lens 18 of the scattered light receiving means is used to form an image of the received scattered light and then make it enter the light guide. In this case as well, the method of providing the light shielding plate 50 used in the first embodiment can be applied, but in this embodiment, a slit-shaped spatial filter 52 is provided at the image point Sl' of the scattered light from the point S1, and a slit-shaped spatial filter 52 is provided at the image point Sl' of the scattered light from the point S1 Separate the images corresponding to the scattered light from the In order to confirm the effect of this spatial filter 52, an experiment similar to that of the first embodiment was conducted, and the same result as the signal waveform shown in FIG. 4 was obtained. The present invention has been described above using two embodiments, but when inspecting a wide area of the sample surface, it is difficult to inspect the sample surface in addition to fixing the sample and applying the optical heater 1 as described above.
It is clear that the present invention is also effective when the irradiation beam is fixed and only the sample is moved in the XY direction or rotated. Furthermore, although the present invention discloses an apparatus specifically for measuring transparent substrates, it goes without saying that it can also be applied to inspecting opaque mirror samples.

【発明の効果】【Effect of the invention】

以−1−説明したよ・)に、本発明によれば、光ビーノ
、を基板表面に平行に近い低角度で照射して、基板表面
と裏面とにおける光ビームの通過位置を大きく引き離し
、それぞれの光ビームの通過位置からの散乱光のうち、
基板裏面からの散乱光を散乱光阻止手段、例えば、散乱
光受光手段の集光し・ンズの物点側に配置された遮光板
、あるいは散乱光受光下段の集光レンズの像点に配置さ
れたスリット、によって阻止して、散乱光受光手段に入
ηt Lないようにし7たので、基板裏面の欠陥や異物
に影響されることなく、欠陥や異物の有無等基板表面の
検査が可能になる。
As explained above (1), according to the present invention, the optical beam is irradiated at a low angle close to parallel to the substrate surface, and the passing positions of the light beam on the front and back surfaces of the substrate are greatly separated. Of the scattered light from the passing position of the light beam,
Scattered light from the back surface of the substrate is blocked by a scattered light blocking means, for example, a light blocking plate placed on the object point side of the condensing lens of the scattered light receiving means, or a light blocking plate placed at the image point of the condensing lens at the lower stage of the scattered light receiving means. Since the scattered light is prevented from entering the light receiving means by the slit, it is possible to inspect the surface of the board for defects and foreign matter without being affected by defects and foreign matter on the back side of the board. .

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例を説明するだめの概要説明図
で、同図(A)は正面図、同図(丁3)は側面図、第2
図は第1図の散乱光信号30および試料領域信号31の
処理回路のブロック回路図、第3図は第1図における散
乱光阻止手段とその配置の一例を説明を説明するための
説明図、第4図はホトマスク用ガラス基板を測定してえ
たアブ−ログ信号波形を示す波形図で、同図(A)は散
乱光阻止手段を設けなかった場合の波形図、同図(B)
は散乱光阻止手段を設けた場合の波形図、第5図は、第
4図の波形図を測定するために用いたホトマスク用ガラ
ス基板の説明図、第6図は散乱光till止手段止子段
配置の他の例を説明するだめの説明図、第7図は従来技
術を説明するだめの概要説明図である。 II   光ビーム、I2   偏向器、13,1.5
  ミラ、16   試料、16a  −試料裏面、1
7.17a、 17b敗乱光、18− 集光レンズ、1
9.23 −ライトガイド、20.24−−−−光電変
換素子、211Pi乱光】 2 受光部、25   試料移動機構、40−波高弁別回路
、41 − デコード回路、42.47−110  ポ
ート、43 − りo 、7り、45   CPIJ 
、46   メモリ、50− 遮光板、52−  スリ
ット。
Fig. 1 is a schematic explanatory diagram for explaining one embodiment of the present invention, in which Fig. 1A is a front view, Fig. 3 is a side view, and Fig.
The figure is a block circuit diagram of a processing circuit for the scattered light signal 30 and sample area signal 31 in FIG. 1, and FIG. 3 is an explanatory diagram for explaining an example of the scattered light blocking means and its arrangement in FIG. 1. Figure 4 is a waveform diagram showing the AB-log signal waveform obtained by measuring a glass substrate for a photomask. Figure 4 (A) is a waveform diagram when no scattered light blocking means is provided, and Figure 4 (B)
5 is an explanatory diagram of the photomask glass substrate used to measure the waveform diagram in FIG. 4, and FIG. 6 is a waveform diagram when a scattered light blocking means is provided. FIG. 7 is an explanatory diagram for explaining another example of the stage arrangement, and FIG. 7 is a schematic explanatory diagram for explaining the prior art. II light beam, I2 deflector, 13, 1.5
Mira, 16 Sample, 16a - Back side of sample, 1
7.17a, 17b scattered light, 18- condensing lens, 1
9.23 - Light guide, 20.24 ---- Photoelectric conversion element, 211Pi scattered light] 2 Light receiving section, 25 Sample moving mechanism, 40 - Wave height discrimination circuit, 41 - Decoding circuit, 42. 47 - 110 Port, 43 - Rio, 7ri, 45 CPIJ
, 46 memory, 50- light shielding plate, 52- slit.

Claims (1)

【特許請求の範囲】 1)透明な基板の表面に低角度で光ビームを照射し、前
記基板表面上に光スポットを形成する投光手段と、 前記基板表面上の前記光スポットを移動させる移動手段
と、 前記光スポットが形成された前記基板表面の散乱中心に
よって前記光ビームが散乱されて生じる散乱光を受光し
て、その受光量に応じた電気信号を出力する散乱光受光
手段と、 前記基板を透過した光ビームが前記基板の裏面の散乱中
心によって散乱されて生じる散乱光の前記散乱光受光部
への到達を阻止する散乱光阻止手段と、 を備えたことを特徴とする透明基板表面検査装置。 2)特許請求範囲第1項に記載の透明基板表面検査装置
において、 散乱光阻止手段は、散乱光受光手段の集光レンズの物点
側に配置された遮光板であることを特徴とする透明基板
表面検査装置。 3)特許請求の範囲第1項に記載の透明基板表面検査装
置において、 散乱光阻止手段は、散乱光受光手段の集光レンズの像点
に配置されたスリットであることを特徴とする透明基板
表面検査装置。
[Scope of Claims] 1) Light projecting means for irradiating a light beam at a low angle onto the surface of a transparent substrate to form a light spot on the surface of the substrate; and movement for moving the light spot on the surface of the substrate. means; a scattered light receiving means for receiving scattered light generated when the light beam is scattered by a scattering center on the surface of the substrate on which the light spot is formed, and outputting an electric signal according to the amount of the received light; A transparent substrate surface comprising: a scattered light blocking means for blocking scattered light generated when a light beam transmitted through the substrate is scattered by a scattering center on the back surface of the substrate from reaching the scattered light receiving section. Inspection equipment. 2) In the transparent substrate surface inspection apparatus according to claim 1, the scattered light blocking means is a light shielding plate disposed on the object point side of the condensing lens of the scattered light receiving means. Board surface inspection equipment. 3) The transparent substrate surface inspection device according to claim 1, wherein the scattered light blocking means is a slit arranged at the image point of the condensing lens of the scattered light receiving means. Surface inspection equipment.
JP1450289A 1989-01-24 1989-01-24 Inspection device for surface of transparent substrate Pending JPH02194352A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1450289A JPH02194352A (en) 1989-01-24 1989-01-24 Inspection device for surface of transparent substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1450289A JPH02194352A (en) 1989-01-24 1989-01-24 Inspection device for surface of transparent substrate

Publications (1)

Publication Number Publication Date
JPH02194352A true JPH02194352A (en) 1990-07-31

Family

ID=11862836

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1450289A Pending JPH02194352A (en) 1989-01-24 1989-01-24 Inspection device for surface of transparent substrate

Country Status (1)

Country Link
JP (1) JPH02194352A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100243627A1 (en) * 2009-03-25 2010-09-30 Samsung Mobile Display Co., Ltd. Substrate cutting apparatus and method of cutting substrate using the same
CN110220915A (en) * 2019-06-21 2019-09-10 银河水滴科技(北京)有限公司 Glass detection machine

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5643539A (en) * 1979-09-19 1981-04-22 Hitachi Ltd Defect inspection device of face plate
JPS59152626A (en) * 1983-02-21 1984-08-31 Hitachi Ltd Device for detecting foreign matter
JPS63285451A (en) * 1987-05-19 1988-11-22 Fuji Electric Co Ltd Optical surface inspecting device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5643539A (en) * 1979-09-19 1981-04-22 Hitachi Ltd Defect inspection device of face plate
JPS59152626A (en) * 1983-02-21 1984-08-31 Hitachi Ltd Device for detecting foreign matter
JPS63285451A (en) * 1987-05-19 1988-11-22 Fuji Electric Co Ltd Optical surface inspecting device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100243627A1 (en) * 2009-03-25 2010-09-30 Samsung Mobile Display Co., Ltd. Substrate cutting apparatus and method of cutting substrate using the same
US8445814B2 (en) * 2009-03-25 2013-05-21 Samsung Display Co., Ltd. Substrate cutting apparatus and method of cutting substrate using the same
CN110220915A (en) * 2019-06-21 2019-09-10 银河水滴科技(北京)有限公司 Glass detection machine

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