JPH0219627B2 - - Google Patents

Info

Publication number
JPH0219627B2
JPH0219627B2 JP59192506A JP19250684A JPH0219627B2 JP H0219627 B2 JPH0219627 B2 JP H0219627B2 JP 59192506 A JP59192506 A JP 59192506A JP 19250684 A JP19250684 A JP 19250684A JP H0219627 B2 JPH0219627 B2 JP H0219627B2
Authority
JP
Japan
Prior art keywords
lead frame
resin
tab
mold
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59192506A
Other languages
Japanese (ja)
Other versions
JPS6084852A (en
Inventor
Yoshiaki Wakashima
Hideo Inayoshi
Kunihiko Nishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59192506A priority Critical patent/JPS6084852A/en
Publication of JPS6084852A publication Critical patent/JPS6084852A/en
Publication of JPH0219627B2 publication Critical patent/JPH0219627B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【発明の詳細な説明】 この発明は、レジンモールドICの製造方法に
関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a resin molded IC.

従来提案されているレジンモールドIC用リー
ドフレームとしては、レジンモールドパツケージ
の辺にほぼ平行になるようにタブ吊りリードを設
けたものがあるが、このようなリードフレームを
用いてレジンモールドICを製造する場合、タブ
の安定性が悪いため、モールド金型にレジンを注
入する際にタブがレジンに押し流されてタブ位置
が変動し、コネクタワイヤが断線する等の不都合
があつた。 Previously proposed lead frames for resin molded ICs include those in which tab suspension leads are provided almost parallel to the sides of the resin mold package, but it is difficult to manufacture resin molded ICs using such lead frames. In this case, the stability of the tab was poor, and when resin was injected into the mold, the tab was swept away by the resin, causing the tab position to fluctuate, resulting in inconveniences such as disconnection of the connector wire.

この発明の目的は、このような不都合のない改
良されたレジンモールドICの製造方法を提供す
ることにある。 An object of the present invention is to provide an improved method for manufacturing a resin molded IC that is free from such inconveniences.

以下、添付図面に示す実施例について詳述す
る。 Hereinafter, embodiments shown in the accompanying drawings will be described in detail.

第１図はこの発明において用いられるIC用リ
ードフレームで、第２図はこの発明に従つて製造
されたレジンモールドICをそれぞれ示すもので
ある。１０はリードフレーム、１２Ａ，１２Ｂは
リードフレーム１０の外枠部、１４はリードフレ
ーム１０の、ICチツプ（半導体ペレツト）を固
定すべきタブ、１６Ａ〜１６Ｄはレジンモールド
パツケージ２２の対角線方向にタブ１４を吊るタ
ブ吊りリード、１８はボンデイングワイヤ（コネ
クタワイヤ）接続されるべきリード、２０はレジ
ンダム部である。 FIG. 1 shows an IC lead frame used in the present invention, and FIG. 2 shows a resin molded IC manufactured according to the present invention. 10 is a lead frame, 12A and 12B are outer frame parts of the lead frame 10, 14 are tabs of the lead frame 10 to which IC chips (semiconductor pellets) are to be fixed, and 16A to 16D are tabs 14 in the diagonal direction of the resin mold package 22. 18 is a lead to which a bonding wire (connector wire) is to be connected, and 20 is a resin dam part.

第１図に示すリードフレーム１０を用いて第２
図に示すようなレジンモールドICを製作するに
あたつては、タブ１４上にICチツプを固定し且
つチツプ上の各電極をボンデイングワイヤを介し
て各リードに接続してからリードフレーム１０を
モールド金型の上型と下型との間にはさむように
セツトする。このとき、レジンダム部２０が上下
の型の間でモールド用レジンが外方へ流出するの
を防止する役目をする。モールド用レジンは破線
Ａで示すレジン注入口からａ方行にモールドキヤ
ビテイ内に注入され、レジンダム部２０に取囲ま
れたキヤビテイ内部分（タブ１４．インナーリー
ド部、図示しないICチツプ、コネクタワイヤな
ど）を被覆する。注入したレジンを硬化させてか
らモールド金型からモールド品を取出し、外枠部
１２Ａ，１２Ｂからパツケージ部２２を切断分離
する。このとき、レジンダム部２０などの不要部
も切断除去される。この結果、第２図に示すよう
に、パツケージ２２からリード１８が突出した形
のレジンモールドICが得られる。 Using the lead frame 10 shown in FIG.
When manufacturing a resin molded IC as shown in the figure, the IC chip is fixed on the tab 14, each electrode on the chip is connected to each lead via a bonding wire, and then the lead frame 10 is molded. Set it between the upper and lower molds. At this time, the resin dam part 20 serves to prevent the molding resin from flowing out between the upper and lower molds. The resin for the mold is injected into the mold cavity from the resin injection port shown by the broken line A in the direction a, and the inside of the cavity surrounded by the resin dam part 20 (tab 14, inner lead part, IC chip (not shown), connector wire) is injected into the mold cavity in the direction a. etc.). After the injected resin is cured, the molded product is removed from the mold, and the package portion 22 is cut and separated from the outer frame portions 12A, 12B. At this time, unnecessary parts such as the resin dam part 20 are also cut and removed. As a result, a resin molded IC is obtained in which the leads 18 protrude from the package 22, as shown in FIG.

上記したこの発明によれば、タブ吊りリード１
６Ａ〜１６Ｄがパツケージ２２の対角線方向すな
わち、４角形のタブの角部から、その角部を規定
するタブの２辺に対して鈍角をなす方向に伸びる
線上に沿つて設けられているため、タブ１４の安
定性がすこぶる良好で、レジン注入時に流入レジ
ンによるタブ１４の変位を最小にすることがで
き、従つて、コネクタワイヤの断線事故等を未然
に防止することができる。その上、タブ１４の安
定性がよいためICチツプを取付けるダイボンデ
イング作業等がやりやすいこと、タブ吊りをパツ
ケージの角部のみで行なうためリード本数を多く
とれることなどの付加効果もある。 According to the invention described above, the tab suspension lead 1
6A to 16D are provided along the diagonal direction of the package 22, that is, along a line extending from the corner of the square tab in a direction forming an obtuse angle to the two sides of the tab that define the corner. The stability of the tab 14 is very good, and the displacement of the tab 14 due to the inflowing resin during resin injection can be minimized, thereby making it possible to prevent accidents such as disconnection of the connector wire. In addition, the stability of the tab 14 is good, making it easy to perform die bonding work for attaching an IC chip, and since the tab is hung only at the corners of the package cage, the number of leads can be increased.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、この発明において用いられるIC用
リードフレームを示す平面図、第２図は、この発
明に従つて製造されたレジンモールドICを示す
平面図である。 １０……リードフレーム、１２Ａ，１２Ｂ……
外枠部、１４……タブ、１６Ａ〜１６Ｄ……タブ
吊りリード、１８……リード、２０……レジンダ
ム部、２２……レジンモールドパツケージ。 FIG. 1 is a plan view showing an IC lead frame used in the present invention, and FIG. 2 is a plan view showing a resin molded IC manufactured according to the present invention. 10... Lead frame, 12A, 12B...
Outer frame portion, 14...Tab, 16A to 16D...Tab suspension lead, 18...Lead, 20...Resin dam part, 22...Resin mold package.

Claims (1)

【特許請求の範囲】 １ ICチツプ支持用の４角形のタブと、このタ
ブに一端が近接して設けられたボンデイングワイ
ヤ接続用の複数のリードと、これらリードを支持
するダム部と、前記４角形のタブから前記ダム部
の角部近傍に延在する前記タブ支持用のタブ吊り
リードとを有するリードフレームを準備する工
程、前記リードフレームのタブ上にICチツプを
固定する工程、前記ICチツプの電極と前記リー
ドフレームの複数のリードとをボンデイングワイ
ヤで接続する工程、前記ICチツプが固定された
リードフレームのタブ吊りリードがモールド金型
のキヤビテイの角部に実質的に位置するように前
記リードフレームをモールド金型によつてはさむ
工程、前記モールド金型内にレジンを注入する工
程、前記モールド金型から前記リードフレームを
取り出し前記ダム部を切断する工程を有すること
を特徴とするレジンモールドICの製造方法。 ２ 前記モールド金型内にレジンを注入する工程
は、モールドパツケージのコーナー部近傍に設け
られたレジン注入部からレジンが注入されること
を特徴とする特許請求の範囲第１項記載のレジン
モールドICの製造方法。[Scope of Claims] 1. A rectangular tab for supporting an IC chip, a plurality of leads for connecting bonding wires whose ends are provided close to this tab, a dam portion for supporting these leads, and a dam portion for supporting these leads; a step of preparing a lead frame having a tab suspension lead for supporting the tab extending from a square tab to near a corner of the dam portion; a step of fixing an IC chip on the tab of the lead frame; and a plurality of leads of the lead frame with bonding wires, the step of connecting the electrodes of the lead frame with the plurality of leads of the lead frame, and the step of connecting the electrodes of the IC chip to the plurality of leads of the lead frame so that the tab suspension leads of the lead frame to which the IC chip is fixed are substantially located at the corners of the cavity of the mold. A resin mold comprising the steps of sandwiching a lead frame between molds, injecting resin into the mold, and taking out the lead frame from the mold and cutting the dam part. IC manufacturing method. 2. The resin mold IC according to claim 1, wherein in the step of injecting the resin into the mold, the resin is injected from a resin injection part provided near a corner of the mold package. manufacturing method.
JP59192506A 1984-09-17 1984-09-17 Manufacture of resin-molded ic Granted JPS6084852A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59192506A JPS6084852A (en) 1984-09-17 1984-09-17 Manufacture of resin-molded ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59192506A JPS6084852A (en) 1984-09-17 1984-09-17 Manufacture of resin-molded ic

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP57097668A Division JPS6034268B2 (en) 1982-06-09 1982-06-09 IC lead frame

Publications (2)

Publication Number Publication Date
JPS6084852A JPS6084852A (en) 1985-05-14
JPH0219627B2 true JPH0219627B2 (en) 1990-05-02

Family

ID=16292422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59192506A Granted JPS6084852A (en) 1984-09-17 1984-09-17 Manufacture of resin-molded ic

Country Status (1)

Country Link
JP (1) JPS6084852A (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5797668A (en) * 1980-12-10 1982-06-17 Mitsubishi Electric Corp Semiconductor device
JPS6034268B2 (en) * 1982-06-09 1985-08-07 株式会社日立製作所 IC lead frame

Also Published As

Publication number Publication date
JPS6084852A (en) 1985-05-14

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