JPH02196956A - Electrochemical type sensor and production thereof - Google Patents

Electrochemical type sensor and production thereof

Info

Publication number
JPH02196956A
JPH02196956A JP1018604A JP1860489A JPH02196956A JP H02196956 A JPH02196956 A JP H02196956A JP 1018604 A JP1018604 A JP 1018604A JP 1860489 A JP1860489 A JP 1860489A JP H02196956 A JPH02196956 A JP H02196956A
Authority
JP
Japan
Prior art keywords
substrate
electrode
parts
insulating substrate
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1018604A
Other languages
Japanese (ja)
Other versions
JP2659133B2 (en
Inventor
Hitoshi Kanekawa
仁士 金川
Keiji Kakinote
柿手 啓治
Koichi Aizawa
浩一 相澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
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Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP1018604A priority Critical patent/JP2659133B2/en
Publication of JPH02196956A publication Critical patent/JPH02196956A/en
Application granted granted Critical
Publication of JP2659133B2 publication Critical patent/JP2659133B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PURPOSE:To improve the strength of the rugged parts of the sensor by forming the root parts of the rugged parts of an insulating substrate to an arc shape with which stress concentration hardly arises. CONSTITUTION:Projecting parts 11 constituting many slender plate shapes are arrayed and provided in two rows on the surface of the insulating substrate 10 formed by coating the surface of a conductive substrate 13 consisting of silicon, etc., of the sensor with an insulating layer 14 consisting of silicon dioxide, etc. A working electrode 20 and a counter electrode 30 are formed on the respective projecting part arrays. A reference electrode 40 is formed to the flat part between the working electrode 20 and the counter electrode 30. The electrodes of the working electrode 20..., etc., are formed of electrode materials, such as platinum and gold. The surface of the insulating substrate 10 is coated with the electrolyte layer 50 consisting of a high- polymer solid electrolyte, etc. and the projecting parts 11 are partly exposed to the upper part of the electrolyte layer 50. The respective electrodes 20... are partly extended to the outside of the electrolyte layer 50 to constitute terminal parts 22, 32, 42 for connection to external circuits. The stress concentration in the root parts of the rugged parts of the insulating substrate 10 is decreased in this way and the strength of the rugged pats is improved.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、電気化学式センサおよびその製造方法に関
し、詳しくは、電解反応を利用し、−酸化炭素、アルコ
ール等のガスや蒸気を検知する検知器やバイオセンサ等
として使用される電気化学式センサと、このような電気
化学式センサを製造する方法に関するものである。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an electrochemical sensor and a method for manufacturing the same, and more particularly, to a sensor that uses electrolytic reactions to detect gases and vapors such as carbon oxide and alcohol. The present invention relates to an electrochemical sensor used as a device, a biosensor, etc., and a method for manufacturing such an electrochemical sensor.

〔従来の技術〕[Conventional technology]

種々のガス成分、例えば水素、酸素、−酸化炭素等を検
知する電気化学式センサは既知であり、種々の刊行物に
詳細に記載されている。電気化学式ガスセンサは、一般
には、作用電極と言われる感知電極と対極、参照電極の
3つの電極が電解質中に設けられてあり、感知すべきガ
ス成分を作用電極と接触させ、電子の交換によって該成
分を酸化もしくは還元し、このときに作用極と対極との
間を流れる電流によって、ガス成分の存在および濃度を
検出するようになっている。
Electrochemical sensors for detecting various gas components, such as hydrogen, oxygen, carbon oxides, etc., are known and are described in detail in various publications. Electrochemical gas sensors generally have three electrodes in an electrolyte: a sensing electrode called a working electrode, a counter electrode, and a reference electrode.The gas component to be sensed is brought into contact with the working electrode, and the gas component is detected by the exchange of electrons. The gas component is oxidized or reduced, and the presence and concentration of the gas component is detected by the current flowing between the working electrode and the counter electrode.

このような電気化学式センサは、高感度かつ低消費電力
であるという利点がある。しかし、従来の電気化学式セ
ンサは、液体の酸電解質を使用し、各電極はガス透過膜
を介して検知すべきガスと接する構造であるため、液体
電解質の経時変化、液漏れ、材料腐食等の問題があった
。そのため、検出部を小型化し難<、感度または出力が
経時的に低下し、寿命が短いという重大な難点が生じて
いた。
Such electrochemical sensors have the advantages of high sensitivity and low power consumption. However, conventional electrochemical sensors use a liquid acid electrolyte and have a structure in which each electrode is in contact with the gas to be detected through a gas permeable membrane, so there are problems such as changes in the liquid electrolyte over time, leakage, and material corrosion. There was a problem. Therefore, there have been serious problems in that it is difficult to miniaturize the detection section, the sensitivity or output decreases over time, and the lifespan is short.

上記のような難点を解決する方法として、米国特許第4
.22−7.984号明細書、同第4,265.714
号明細書には、固体ポリマー電解質を用いた電気化学式
センサが提案されている。その構造は、固体電解質膜の
片面側に作用極と参照極を配置し、対極は、上記作用極
と対向させて電解質膜の反対面側に配置している。
As a method to solve the above-mentioned difficulties, U.S. Patent No. 4
.. No. 22-7.984, No. 4,265.714
The patent proposes an electrochemical sensor using a solid polymer electrolyte. In its structure, a working electrode and a reference electrode are arranged on one side of a solid electrolyte membrane, and a counter electrode is arranged on the opposite side of the electrolyte membrane, facing the working electrode.

しかし、上記先行技術では、固体電解質を有する可撓性
フィルム上に電極を接着する必要があるとともに、ガス
透過性固体ポリマー電解質の膨潤による体積変化によっ
て電極の剥離が生じ、感度、出力が低下するという問題
があった。
However, in the above-mentioned prior art, it is necessary to adhere the electrode onto a flexible film containing a solid electrolyte, and the volume change due to swelling of the gas-permeable solid polymer electrolyte causes the electrode to peel off, resulting in a decrease in sensitivity and output. There was a problem.

上記のような問題を解決するために、プレーナ型の電気
化学式センサが提案された。その構造は、セラミック、
ガラス等の強固な絶縁基板の1面に、蒸着、スパッタ等
の手段で作用極、対極および参照極を形成し、その上に
ガス透過性固体電解質を塗布した構造を有している。
In order to solve the above problems, a planar electrochemical sensor has been proposed. Its structure is ceramic,
It has a structure in which a working electrode, a counter electrode, and a reference electrode are formed on one surface of a strong insulating substrate such as glass by means such as vapor deposition or sputtering, and a gas permeable solid electrolyte is applied thereon.

さらに、上記のようなプレーナ型電気化学式センサにお
いて、電気化学反応を効率良く行わせて、センサの出力
や感度を向上させることを目的として、作用極および対
極を三次元凹凸構造としたものがある。
Furthermore, in the planar electrochemical sensors mentioned above, there are some in which the working electrode and the counter electrode have a three-dimensional uneven structure in order to efficiently carry out electrochemical reactions and improve the output and sensitivity of the sensor. .

第4図および第5図には、このような三次元凹凸構造を
備えた電気化学式センサの構造を示している。このセン
サは、絶縁基板10の平坦な表面に多数の凸部11を形
成し、この凸部11を覆うように作用極20および対極
30を形成することによって、作用極20および対極3
0を三次元凹凸構造としている。参照極40は作用極2
0と対極30の間で凸部11のない平坦な部分に設けら
れている。固体電解質層50は、絶縁基板lOの表面を
一定の厚みで覆っており、前記作用i20と対極30を
設けた凸部11の一部が固体電解質層50の上に露出し
ている。各電極2o・・・の一端は固体電解質層50の
外まで延長されて露出していて、外部回路への接続を果
たす端子部22.32.42となっている。このような
三次元凹凸構造を備えたセンサは、電極20.30と固
体電解質N50および外界との境界において良好な電気
化学反応が行われ、センサの感度もしくは出力を向上さ
せることができるのである。
FIGS. 4 and 5 show the structure of an electrochemical sensor having such a three-dimensional uneven structure. This sensor is constructed by forming a large number of convex portions 11 on a flat surface of an insulating substrate 10, and forming a working electrode 20 and a counter electrode 30 so as to cover the convex portions 11.
0 has a three-dimensional uneven structure. Reference electrode 40 is working electrode 2
0 and the counter electrode 30 on a flat portion without a convex portion 11. The solid electrolyte layer 50 covers the surface of the insulating substrate IO with a certain thickness, and a part of the convex portion 11 provided with the action i20 and the counter electrode 30 is exposed above the solid electrolyte layer 50. One end of each electrode 2o is extended and exposed to the outside of the solid electrolyte layer 50, and serves as a terminal portion 22, 32, 42 for connection to an external circuit. In a sensor having such a three-dimensional uneven structure, a good electrochemical reaction occurs at the boundary between the electrode 20, 30, the solid electrolyte N50, and the outside world, and the sensitivity or output of the sensor can be improved.

上記のような従来のプレーナ型電気化学センサにおいて
、三次元凹凸構造の形成方法としては、合成樹脂やセラ
ミック等の絶縁材料からなる絶縁基板10を物理的もし
くは化学的手段で加工して凹凸構造を形成する方法のほ
かに、導電性基板に凹凸構造を加工した後、その表面に
絶縁層を形成して絶縁基板10を形成する方法がある。
In the conventional planar electrochemical sensor as described above, the three-dimensional uneven structure is formed by processing the insulating substrate 10 made of an insulating material such as synthetic resin or ceramic by physical or chemical means to form the uneven structure. In addition to this method, there is a method of forming an insulating substrate 10 by processing a concavo-convex structure on a conductive substrate and then forming an insulating layer on the surface thereof.

上記した導電性基板に凹凸構造を加工してから絶縁層を
形成する方法であれば、フォトリソグラフィ技術等の微
細加工手段を採用して、微細がっ正確な凹凸構造が形成
できるという利点がある。
The above-mentioned method of forming an uneven structure on a conductive substrate and then forming an insulating layer has the advantage that it is possible to form a fine and accurate uneven structure by employing microfabrication methods such as photolithography technology. .

具体的には、例えば、導電性基板としてシリコン基板を
用い、これをアルカリエツチングすることによって三次
元凹凸構造を形成した後、表面に二酸化シリコンの絶縁
層を形成する方法が採用される。
Specifically, for example, a method is employed in which a silicon substrate is used as the conductive substrate, a three-dimensional uneven structure is formed by alkali etching, and then an insulating layer of silicon dioxide is formed on the surface.

第6図は、上記のような絶縁基板10の形成方法の一例
を示している。シリコン基板13の平坦な表面に対して
、凸部11に相当する個所にエツチングパターン60を
形成し、アルカリ溶液でエツチングすることによってシ
リコン基板13を掘り込んで残ったところが凸部11と
なる〔工程(al〕。エツチングパターン60を除去し
た後、シリコン基板13を酸化させる等の方法で、シリ
コン基板13の表面全体に絶縁N14を形成して、三次
元凹凸構造を備えた絶縁基板lOを形成する〔工程中)
〕。
FIG. 6 shows an example of a method of forming the insulating substrate 10 as described above. An etching pattern 60 is formed on the flat surface of the silicon substrate 13 at a location corresponding to the convex portion 11, and the silicon substrate 13 is etched by etching with an alkaline solution, and the remaining portion becomes the convex portion 11. (al) After removing the etching pattern 60, an insulating substrate 14 is formed on the entire surface of the silicon substrate 13 by oxidizing the silicon substrate 13, thereby forming an insulating substrate 10 having a three-dimensional uneven structure. [During the process]
].

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上記のようなプレーナ型センサにおいて、センサの小型
化を図るためには、前記した三次元凹凸構造の微細化を
一層進めなければならず、例えば、凸部11の幅を5 
tts程度の微細な形状にすることが要求される。とこ
ろが、このように微細な凸部IIを形成すると強度が弱
くなるという問題が生じ、センサの使用中等に凸部11
が破壊したり一部が欠損したりすることによって、凸部
11の上に形成された作用極20および対極30の電極
ifr線を引き起こし、センサの性能低下を生じるとい
う問題があった。
In order to make the sensor smaller in the planar sensor as described above, it is necessary to further miniaturize the three-dimensional uneven structure described above.
It is required that the shape be as fine as tts. However, forming the minute protrusions II in this way causes a problem that the strength becomes weak, and when the protrusions 11 are formed during use of the sensor, etc.
There is a problem in that the breakage or partial loss of the convex portion 11 causes electrode ifr lines of the working electrode 20 and the counter electrode 30 formed on the convex portion 11, resulting in deterioration of sensor performance.

特に、導電性の基板13の表面に絶縁層14を形成して
絶縁基板10を形成する方法では、絶縁層14を形成す
る際に、基板13の凸部11、特に根元のところで歪み
を生じ、凸部11に対して大きなストレスを与えるため
に、凸部11が強度的に弱くなって破壊され易くなるの
である。第7図は、シリコン基板13の表面に酸化処理
を行って絶縁層14を形成した場合の凸部11周辺を示
しており、絶縁Ji14の形成反応の進行に伴って、絶
縁層14の変形や内部応力が発生し、特に、凸部11の
根元部分は、底面と側面とが角状に交わっていて応力集
中が生じ易いため、凸部11の根元部12に大きな応力
が発生し、ここから破壊し易くなってしまうのである。
In particular, in the method of forming the insulating substrate 10 by forming the insulating layer 14 on the surface of the conductive substrate 13, when forming the insulating layer 14, distortion occurs at the convex portions 11 of the substrate 13, especially at the roots. Since a large stress is applied to the protrusion 11, the protrusion 11 becomes weak in strength and becomes easily broken. FIG. 7 shows the area around the convex portion 11 when the insulating layer 14 is formed by performing oxidation treatment on the surface of the silicon substrate 13. As the formation reaction of the insulating Ji 14 progresses, the insulating layer 14 is deformed and Internal stress is generated, especially at the root portion of the convex portion 11, where the bottom and side surfaces intersect in an angular shape, and stress concentration is likely to occur. This makes it easier to destroy.

なお、このような凸部11の根元部12における強度の
低下は、上記したように導電性基板13の表面に絶縁層
14を形成する構造の場合に特に顕著であるが、セラミ
ック等の絶縁性材料からなる絶縁基板10の場合にも生
じる問題である。
Note that such a decrease in strength at the root portion 12 of the convex portion 11 is particularly noticeable in the case of a structure in which the insulating layer 14 is formed on the surface of the conductive substrate 13 as described above, but This problem also occurs in the case of the insulating substrate 10 made of material.

そこで、この発明の課題は、前記のような三次元凹凸構
造を備えたブレーナ型電気化学式センサにおいて、凹凸
構造の強度を向上させた電気化学式センサと、そのよう
な電気化学式センサの製造方法を提供することにある。
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an electrochemical sensor of the Brehner type electrochemical sensor having a three-dimensional uneven structure as described above, in which the strength of the uneven structure is improved, and a method for manufacturing such an electrochemical sensor. It's about doing.

〔課題を解決するための手段〕[Means to solve the problem]

上記課題を解決する、この発明の請求項1記載の電気化
学式センサは、絶縁基板の同一面上に作用極、対極およ
び参照極が設けられ、各種が電解質層で覆われている電
気化学式センサにおいて、作用極と対極とを設ける個所
の基板表面に多数の凹凸部を有するとともに、凹凸部の
底面と側面とが交わる根元部が円弧状をなすようにして
いる。
An electrochemical sensor according to claim 1 of the present invention that solves the above problems is an electrochemical sensor in which a working electrode, a counter electrode, and a reference electrode are provided on the same surface of an insulating substrate, and each electrode is covered with an electrolyte layer. The surface of the substrate at the location where the working electrode and the counter electrode are provided has many uneven portions, and the root portion where the bottom surface and the side surface of the uneven portion intersect forms an arc shape.

また、上記のような電気化学式センサを製造する方法で
ある請求項2記載の発明は、絶縁基板が、導電性基板と
その表面に形成される絶縁層とで構成されるものであっ
て、導電性基板の表面に、底面と側面とが交わる根元部
が角状をなす多数の凹凸部を形成しておき、凹凸部の表
面に熱酸化法によって酸化膜を堆積させた後、この酸化
膜を除去することによって、基板表面の凹凸部の前記根
元部を円弧状に形成し、ついで導電性基板の表面に絶縁
層を形成するようにしている。
Further, the invention according to claim 2, which is a method for manufacturing the electrochemical sensor as described above, is one in which the insulating substrate is composed of a conductive substrate and an insulating layer formed on the surface thereof, A large number of uneven parts each having an angular base where the bottom and side surfaces intersect are formed on the surface of the flexible substrate, and an oxide film is deposited on the surface of the uneven parts by a thermal oxidation method. By removing it, the root portion of the uneven portion on the substrate surface is formed into an arc shape, and then an insulating layer is formed on the surface of the conductive substrate.

〔作  用〕[For production]

請求項1記載の発明によれば、絶縁基板の凹凸部の、底
面と側面とが交わる根元部が円弧状に形成されているの
で、従来の角状のものに比べて、根元部における応力集
中が少なくなり、強度的にはるかに強いものとなり、微
細な凹凸部を形成しても破壊され難くなる。
According to the invention as claimed in claim 1, since the root portion of the uneven portion of the insulating substrate where the bottom surface and the side surface intersect is formed in an arc shape, stress concentration at the root portion is reduced compared to a conventional square shape. It becomes much stronger in terms of strength, and is less likely to be destroyed even if minute unevenness is formed.

請求項2記載の発明によれば、導電性基板の表面に絶縁
層を形成した構造の絶縁基板を製造する際に、導電性基
板に凹凸部を形成する段階では、凹凸部の底面と側面と
が交わる根元部を角状に形成してお(、この導電性基板
の凹凸部の表面に熱酸化法によって酸化膜を堆積させた
後、この酸化膜を除去すると、酸化膜の形成過程で導電
性基板の凹凸部表面が局部的に変形させられたりして加
工され、凹凸部全体が滑らかな外形を有するものとなり
、凹凸部の前記根元部が円弧状に形成されることになる
。このようにして、凹凸部の根元部が円弧状に形成され
た導電性基板の表面に絶縁層を形成して絶縁基板を製造
すれば、絶縁基板の凹凸部の根元部が円弧状をなすとと
もに、絶縁層の形成段階で、凹凸部の円弧状をなす根元
部には応力集中が生じ難いので、絶縁層の形成に伴う凹
凸部の強度低下も生じない。
According to the invention as claimed in claim 2, when manufacturing an insulating substrate having a structure in which an insulating layer is formed on the surface of the conductive substrate, in the step of forming the uneven portion on the conductive substrate, the bottom and side surfaces of the uneven portion are The bases where the two intersect are formed into an angular shape (after depositing an oxide film on the uneven surface of the conductive substrate by a thermal oxidation method and then removing this oxide film, the conductive film becomes conductive during the oxide film formation process. The surface of the uneven portion of the substrate is processed by being locally deformed, so that the entire uneven portion has a smooth outer shape, and the root portion of the uneven portion is formed in an arc shape. If an insulating substrate is manufactured by forming an insulating layer on the surface of a conductive substrate having an arcuate root portion of the uneven portion, the root portion of the uneven portion of the insulating substrate will be arcuate, and the insulation layer will be At the stage of forming the layer, stress concentration is unlikely to occur at the arcuate root portions of the uneven portions, so that the strength of the uneven portions does not decrease due to the formation of the insulating layer.

〔実 施 例〕〔Example〕

ついで、この発明を実施例を示す図面を参照しながら、
以下に詳しく説明する。
Next, while referring to the drawings showing embodiments of the present invention,
This will be explained in detail below.

第1図は、この発明にかかる電気化学式センサの実施例
について、概略的な構造を示している。
FIG. 1 shows a schematic structure of an embodiment of an electrochemical sensor according to the present invention.

センサの基本的な構造については、前記した従来例と同
様の構造であるので、共通する部分には同じ符号をつけ
、重複する説明は省略する。
The basic structure of the sensor is the same as that of the conventional example described above, so common parts are given the same reference numerals and redundant explanation will be omitted.

シリコン等からなる導電性基板13の表面を二酸化シリ
コン等からなる絶縁層14で覆ってなる絶縁基板10の
表面に多数の細い板状をなす凸部11を並べて2列に設
け、各凸部列の上に作用極20および対極30を形成し
ており、作用極20と対極30の間の平坦な部分には参
照極40が形成されている。作用極20・・・等の電極
はプラチナや金等の通常の電極材料で形成されている。
A large number of thin plate-shaped protrusions 11 are arranged in two rows on the surface of an insulating substrate 10 which is formed by covering the surface of a conductive substrate 13 made of silicon or the like with an insulating layer 14 made of silicon dioxide or the like. A working electrode 20 and a counter electrode 30 are formed on the working electrode 20 and a counter electrode 30, and a reference electrode 40 is formed in a flat portion between the working electrode 20 and the counter electrode 30. Electrodes such as the working electrode 20 are made of ordinary electrode materials such as platinum and gold.

絶縁基板10の表面は高分子固体電解質等からなる電解
質層50で覆われているとともに、凸部11の一部は電
解質層50の上部に露出している。各電極20・・・の
一端は電解質層50の外まで延長してあって、外部回路
との接続用端子部22,32゜42を構成している。以
上のような構成は、前記した従来例等、通常の電気化学
式センサと同様のものである。
The surface of the insulating substrate 10 is covered with an electrolyte layer 50 made of a solid polymer electrolyte or the like, and a portion of the protrusion 11 is exposed above the electrolyte layer 50. One end of each electrode 20 extends to the outside of the electrolyte layer 50 and constitutes a terminal portion 22, 32° 42 for connection to an external circuit. The configuration described above is similar to the conventional electrochemical sensor described above.

この実施例では、第1図(a)に示すように、凸部11
の側面と底面とが交わる根元部12が、滑らかな円弧状
に形成されている点に特徴がある。根元部12の円弧の
寸法は、大きなほど応力集中が起き難く強度的に好まし
いが、凹凸構造における電気化学反応への影響や加工条
件等を考慮して適当な寸法に設定される。なお、図示し
た実施例では、凸部11の上端の隅部についても滑らか
な円弧状に形成されており、これによって、凸部11の
上端隅部が欠けたり損傷し難くなり、電極の形成も行い
易い等の効果がある。
In this embodiment, as shown in FIG. 1(a), the convex portion 11
The base 12, where the side surface and the bottom surface intersect, is formed into a smooth arc shape. The larger the size of the circular arc of the root portion 12, the less stress concentration will occur, which is preferable in terms of strength, but it is set to an appropriate size in consideration of the influence on the electrochemical reaction in the uneven structure, processing conditions, etc. In the illustrated embodiment, the upper corners of the convex portions 11 are also formed into smooth arc shapes, which makes it difficult for the upper corners of the convex portions 11 to be chipped or damaged, making it easier to form electrodes. It has the effect of being easy to perform.

凸部11の高さや間隔等の寸法は、通常の三次元凹凸構
造を有する電気化学式センサと同様に、センサの出力感
度や加工条件等を考慮して適当に設定される。凸部11
の構造は、図示したように、細長い板状の凸部11を多
数平行に並べたもののほか、突起状の凸部11を縦横あ
るいは千鳥状に配設したもの等、各種の三次元凹凸構造
に変更することもできる。なお、図示した実施例では、
絶縁基板10の平坦な表面に凸部llが突出した構造で
あるが、絶縁基板10の平坦な表面に多数の凹溝を形成
するなど、凹凸何れの構造でも実施可能である。
Dimensions such as the height and spacing of the convex portions 11 are appropriately set in consideration of the output sensitivity of the sensor, processing conditions, etc., as in the case of an ordinary electrochemical sensor having a three-dimensional uneven structure. Convex portion 11
As shown in the figure, the structure includes various three-dimensional uneven structures, such as a structure in which a large number of elongated plate-like protrusions 11 are arranged in parallel, and a structure in which protrusion-like protrusions 11 are arranged vertically and horizontally or in a staggered manner. It can also be changed. In addition, in the illustrated example,
Although this is a structure in which the convex portions 11 protrude from the flat surface of the insulating substrate 10, it is also possible to form any structure with concave or convex structures, such as forming a large number of grooves on the flat surface of the insulating substrate 10.

各電極20・・・の構成についても、図示した実施例の
構造以外に、通常の電気化学式センサにおいて採用され
ている各種の構造に変更することができる。
The structure of each electrode 20 can also be changed to various structures employed in ordinary electrochemical sensors other than the structure of the illustrated embodiment.

つぎに、上記のような構造の電気化学式センサの製造方
法の一例について説明する。
Next, an example of a method for manufacturing an electrochemical sensor having the above structure will be described.

第2図は(al〜(klへと工程順に模式的に示してお
り、まず、シリコン基板13の(110)面からなる平
坦な表面に、エツチング用二酸化シリコン層60を熱酸
化法で膜厚lnに堆積させる〔工程(a)〕。二酸化シ
リコン層60の上にレジスト70を塗布し〔工程…))
、所定のパターンで露光現像して、作用極20および対
極30の凸部11に対応する個所のみにレジスト70を
残す〔工程(C)〕このようにして形成されたレジスト
70をマスクにして、二酸化シリコン層60を所定のパ
ターンで除去し、シリコン基板13の表面を一部露出さ
せる。このとき、シリコン基板13の(ITl)面ある
いは(1丁丁)面と(110)面との交線と平行になる
ように二酸化シリコンjif60をパタンーニングして
、後工程におけるシリコン基板13の掘り込みを行い易
くしておく 〔工程(d)〕。
FIG. 2 schematically shows the process order from (al to (kl). First, a silicon dioxide layer 60 for etching is deposited on the flat surface of the (110) plane of the silicon substrate 13 using a thermal oxidation method. [Step (a)]. Apply a resist 70 on the silicon dioxide layer 60 [Step...)].
, exposure and development is carried out in a predetermined pattern, leaving the resist 70 only at the locations corresponding to the convex portions 11 of the working electrode 20 and the counter electrode 30 [Step (C)] Using the resist 70 thus formed as a mask, The silicon dioxide layer 60 is removed in a predetermined pattern to partially expose the surface of the silicon substrate 13. At this time, silicon dioxide jif 60 is patterned so as to be parallel to the intersection line of the (ITl) plane or the (110) plane of the silicon substrate 13, and the engraving of the silicon substrate 13 in the later process is performed. Make it easy to perform [Step (d)].

レジスト70を除去した後〔工程(e))、KOH45
wt%、Hg055wt%からなり液温80℃のエツチ
ング液を用いて、シリコン基板13を一定の深さまで掘
り込むことによって、凸部11のみが突出した形で残る
〔工程(f)〕。このとき、前記したような二酸化シリ
コン層60の配置パターンでシリコン基板13のエツチ
ングを行うと、シリコン基板13の面方位によるエツチ
ングレートの異方性によって、シリコン基板13の表面
に対して垂直に掘り込まれていき、凸部11の形状を正
確に形成することができる。通常、エツチング時間25
程度度でシリコン基板13の掘り込みが完了する。シリ
コン基板13の凸部11の上面に残った二酸化シリコン
層60を除去すれば、所定の凸部11を有するシリコン
基板13が得られる〔工程((イ)〕。
After removing the resist 70 [step (e)), KOH45
The silicon substrate 13 is dug to a certain depth using an etching solution containing 55 wt% of Hg and 55 wt% of Hg at a liquid temperature of 80° C., so that only the convex portions 11 remain in a protruding form [step (f)]. At this time, when the silicon substrate 13 is etched with the arrangement pattern of the silicon dioxide layer 60 as described above, etching is performed perpendicularly to the surface of the silicon substrate 13 due to the anisotropy of the etching rate depending on the plane orientation of the silicon substrate 13. The shape of the convex portion 11 can be formed accurately. Normally, etching time is 25
The digging of the silicon substrate 13 is completed in a certain degree. By removing the silicon dioxide layer 60 remaining on the upper surface of the convex portion 11 of the silicon substrate 13, the silicon substrate 13 having the predetermined convex portion 11 is obtained [Step (A)].

シリコン基板13の凸部11を含む表面全体に、前記同
様の熱酸化法によって、1μ層の厚さで凸部加工用の酸
化膜である二酸化シリコン膜61を堆積させる〔工程(
h)〕。この二酸化シリコン膜61を、HF:HmO=
4:1のエッチャントを用いてエツチング除去すると、
シリコン基板13の凸部11表面が加工されて、前記し
たような、凸部11の根元部12の円弧形状や凸部11
先端の円弧形状が形成される〔工程(1)〕。
A silicon dioxide film 61, which is an oxide film for processing the protrusions, is deposited to a thickness of 1 μm over the entire surface of the silicon substrate 13, including the protrusions 11, by the same thermal oxidation method as described above [step (
h)]. This silicon dioxide film 61 is formed by HF:HmO=
When removed by etching using a 4:1 etchant,
The surface of the convex portion 11 of the silicon substrate 13 is processed to form the circular arc shape of the root portion 12 of the convex portion 11 and the convex portion 11 as described above.
A circular arc shape at the tip is formed [step (1)].

上記のようにして凸部11の加工が行われたシリコン基
板13の表面全体に、絶縁層となる二酸化シリコン層1
4を5000人の厚みで堆積させれば、シリコン基板1
3と二酸化シリコン層14からなり、三次元凹凸構造を
有する絶縁基板10が作製される〔工程(j)〕。
A silicon dioxide layer 1 serving as an insulating layer is spread over the entire surface of the silicon substrate 13 on which the convex portions 11 have been processed as described above.
4 is deposited to a thickness of 5,000 people, the silicon substrate 1
3 and a silicon dioxide layer 14, an insulating substrate 10 having a three-dimensional uneven structure is produced [step (j)].

その後、絶縁基板10の表面に、マスクスパンタリング
法等の通常の電極形成方法を用いて、プラチナ等からな
る各電極20・・・を、例えば厚み11程度に形成する
〔工程(k)〕。さらに、電極20・・・の上を電解質
層50で覆えば、電気化学式センサが製造できる。
Thereafter, each electrode 20 made of platinum or the like is formed to a thickness of about 11, for example, on the surface of the insulating substrate 10 using a normal electrode forming method such as a mask sputtering method [step (k)]. Furthermore, by covering the electrodes 20 with an electrolyte layer 50, an electrochemical sensor can be manufactured.

以上の説明した工程のうち、この発明の特徴であるシリ
コン基板13の凸部11の加工工程を、第3図によって
、さらに詳しく説明する。
Among the steps described above, the step of processing the convex portion 11 of the silicon substrate 13, which is a feature of the present invention, will be explained in more detail with reference to FIG.

工程(川において形成されたシリコン基Fi13の凸部
11は、凸部11の側面と底面とが直線的に交わって、
角状の隅部すなわち根元部12を構成している。したが
って、このままの状態で絶縁層14を形成したのでは、
前記した従来例と同様に、凸部11の根元部12に応力
集中が生じて、強度が低下してしまう。そこで、工程(
h)で、シリコン基板13の表面全体に比較的厚い二酸
化シリコンからなる酸化膜61を堆積させると、酸化膜
61が形成されるときに発生する内部応力等によって酸
化膜61が歪み、シリコン基板13に対してストレスを
与える。このストレスは、凸部11の根元部12等に集
中的に作用し、凸部11を局部的に変形加工することに
なる。酸化膜61を除去してしまうと、シリコン基板1
3のストレスは開放されるが、凸部11の根元部12等
の変形は残ったままになり、凸部11の根元部12や凸
部11の先端が円弧状に加工された状態になる。
The convex portion 11 of the silicon base Fi 13 formed in the process (river) has a shape in which the side and bottom surfaces of the convex portion 11 intersect linearly,
It constitutes an angular corner portion, that is, a root portion 12. Therefore, if the insulating layer 14 is formed in this state,
Similar to the conventional example described above, stress concentration occurs at the root portion 12 of the convex portion 11, resulting in a decrease in strength. Therefore, the process (
In h), when a relatively thick oxide film 61 made of silicon dioxide is deposited over the entire surface of the silicon substrate 13, the oxide film 61 is distorted due to internal stress etc. generated when the oxide film 61 is formed, and the silicon substrate 13 give stress to This stress acts intensively on the root portion 12 and the like of the convex portion 11, causing the convex portion 11 to be locally deformed. When the oxide film 61 is removed, the silicon substrate 1
3 is released, but the deformation of the root portion 12 of the convex portion 11 remains, and the root portion 12 of the convex portion 11 and the tip of the convex portion 11 are processed into an arc shape.

その後、工程(jlに示すように、絶縁層となる比較的
薄い二酸化シリコン層14を形成すれば、根元部12が
円弧状の凸部11は、絶縁層14を形成してもストレス
を受は難く歪みも生じ難い形状であるので、凸部11の
強度が低下せず、従来の方法で作製された絶縁基板IO
に比べて、はるかに強度を向上させることができるので
ある。
After that, as shown in step (jl), if a relatively thin silicon dioxide layer 14 is formed as an insulating layer, the convex portion 11 having an arcuate root portion 12 will not receive stress even if the insulating layer 14 is formed. Since it has a shape that does not easily cause distortion, the strength of the convex portion 11 does not decrease, and the insulating substrate IO produced by the conventional method
It is possible to significantly improve the strength compared to

上記した電気化学式センサの製造方法において、絶縁基
板10を構成する導電性基板13および絶縁層14は、
前記したシリコン基板と二酸化シリコン層のほかにも、
通常の各種電子素子等に用いられている導電性基板材料
と絶縁層材料とを組み合わせて使用することができる。
In the method for manufacturing an electrochemical sensor described above, the conductive substrate 13 and the insulating layer 14 that constitute the insulating substrate 10 are
In addition to the silicon substrate and silicon dioxide layer described above,
It is possible to use a combination of conductive substrate materials and insulating layer materials that are commonly used in various electronic devices.

導電性基板13に凸部11等の凹凸形状を形成する方法
や、電8ii20・・・の形成方法等の具体的な工程も
、通常の電気化学式センサその他の電子素子の製造技術
を適用することができる。
Specific steps such as the method of forming uneven shapes such as the convex portions 11 on the conductive substrate 13 and the method of forming the electrodes 8ii20... can also be performed by applying ordinary manufacturing techniques for electrochemical sensors and other electronic devices. Can be done.

前記のような製造方法によって製造された絶縁基板10
の強度を従来のものと比較するために、強度試験を行っ
た結果について説明する。
Insulating substrate 10 manufactured by the above manufacturing method
We will explain the results of a strength test to compare the strength of this product with that of a conventional product.

試験に使用した絶縁基板10は、前記した第1図のよう
な構造の凸部11を有し、凸部11の幅が5.Ill、
隣接する凸部11間の隙間が5nのものである。試験品
は、前記した酸化膜61による凸部11の加工工程を行
った後に、比較的薄い絶縁層14を形成し、凸部11の
根元部12が円弧状をなす、この発明の実施品と、上記
凸部11の加工工程を行わず、そのまま絶縁層14を形
成した従来品とであり、これらを10分間超音波水洗し
た後に、凸部11が破壊されたか否かを観察し、その結
果を下表に示している。
The insulating substrate 10 used in the test has a convex portion 11 having a structure as shown in FIG. 1 described above, and the width of the convex portion 11 is 5. Ill,
The gap between adjacent convex portions 11 is 5n. The test product is a practical product of the present invention in which a relatively thin insulating layer 14 is formed after the process of processing the protrusion 11 using the oxide film 61 described above, and the root portion 12 of the protrusion 11 has an arc shape. , and a conventional product in which the insulating layer 14 was directly formed without performing the processing step of the convex part 11, and after washing these with ultrasonic water for 10 minutes, it was observed whether the convex part 11 was destroyed. are shown in the table below.

第1表 以上の結果から、角状の根元部12を有する凸部11に
直接絶縁層I4を形成した従来品は、絶縁層14の形成
過程で生じたストレス等によって、試験後には全ての凸
部11が破壊されていたのに対し、二酸化シリコン層6
1の形成除去によって根元部12が円弧状に加工された
凸部11を備えた実施品の場合には、絶縁層14を形成
してもストレスが緩和されるので、凸部11が全く破壊
されておらず、この発明の効果が実証された。
From the results shown in Table 1, it can be seen that in the conventional product in which the insulating layer I4 was directly formed on the convex part 11 having the angular root part 12, all convex parts were removed after the test due to the stress generated in the process of forming the insulating layer 14. While part 11 was destroyed, silicon dioxide layer 6
In the case of an actual product having a convex portion 11 whose root portion 12 is processed into an arc shape by forming and removing step 1, the stress is alleviated even if the insulating layer 14 is formed, so that the convex portion 11 is not destroyed at all. The effectiveness of this invention was demonstrated.

〔発明の効果〕〔Effect of the invention〕

以上に述べた、この発明にかかる電気化学式センサは、
絶縁基板の凹凸部の根元部を円弧状に形成して、応力集
中が生じ難い形状にしておくことによって、凹凸部の強
度向上を果たすことができる。したがって、センサを使
用しているうちに、凹凸部が破壊されて、センサの機能
が低下したり、電極が断線してしまう等の問題が生じず
、三次元凹凸構造を有するセンサの優れた性能を、長期
間にわたって安定して維持でき、センサの安定性や信頼
性を大幅に向上できる。
The electrochemical sensor according to the present invention described above is
The strength of the uneven portion can be improved by forming the root portion of the uneven portion of the insulating substrate into an arcuate shape so that stress concentration is difficult to occur. Therefore, while the sensor is in use, there will be no problems such as damage to the uneven parts, deterioration of the sensor function, or disconnection of the electrodes, and the excellent performance of the sensor with the three-dimensional uneven structure. can be maintained stably over a long period of time, greatly improving the stability and reliability of the sensor.

特に、絶縁基板が、導電性基板の表面を絶縁層で覆った
構造のものの場合には、通常の方法によって導電性基板
の上に形成された凹凸部の表面に一旦、酸化膜を形成し
た後で除去することによって、凹凸部の根元部を円弧状
に加工することができ、その上に絶縁層を形成して絶縁
基板を製造すれば、従来、絶縁層を形成する際に住じて
いた凹凸部の根元部の応力集中を緩和することができ、
凹凸部の強度向上をより効果的に果たすことができる。
In particular, when the insulating substrate has a structure in which the surface of the conductive substrate is covered with an insulating layer, an oxide film is first formed on the surface of the uneven portion formed on the conductive substrate by a normal method. By removing it with Stress concentration at the base of uneven parts can be alleviated,
The strength of the uneven portion can be improved more effectively.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の実施例にかかる電気化学式センサを
示し、第1図(a)は全体の斜視図、第1図Tb)は凹
凸部の拡大断面図2.第2図(a)〜(klはセンサの
製造工程を順に示す模式的断面図、第3図(g)。 (h)、 01は前回のうちの一部工程の拡大断面図、
第4図は従来例の斜視図、第5図は断面図、第6図は絶
縁基板の製造方法の一例を示す断面図、第7図は凹凸部
の拡大断面図である。 10・・・絶縁基板 11・・・凸部 12・・・根元
部13・・・導電性基板 14・・・絶縁層 20.3
0゜40・・・電極 50・・・電解質層 61・・・
酸化膜第1図
FIG. 1 shows an electrochemical sensor according to an embodiment of the present invention, FIG. 1(a) is a perspective view of the whole, and FIG. Figures 2 (a) to (kl are schematic cross-sectional views showing the manufacturing process of the sensor in order, Figure 3 (g); (h), 01 are enlarged cross-sectional views of some of the previous steps;
FIG. 4 is a perspective view of a conventional example, FIG. 5 is a sectional view, FIG. 6 is a sectional view showing an example of a method for manufacturing an insulating substrate, and FIG. 7 is an enlarged sectional view of an uneven portion. 10... Insulating substrate 11... Convex portion 12... Root portion 13... Conductive substrate 14... Insulating layer 20.3
0°40... Electrode 50... Electrolyte layer 61...
Oxide film diagram 1

Claims (1)

【特許請求の範囲】 1 絶縁基板の同一面上に作用極、対極および参照極が
設けられ、各極が電解質層で覆われている電気化学式セ
ンサにおいて、作用極と対極とを設ける個所の絶縁基板
表面に多数の凹凸部を有するとともに、凹凸部の底面と
側面とが交わる根元部が円弧状をなすことを特徴とする
電気化学式センサ。 2 絶縁基板が、導電性基板とその表面に形成される絶
縁層とで構成されるものであって、導電性基板の表面に
、底面と側面とが交わる根元部が角状をなす多数の凹凸
部を形成しておき、凹凸部の表面に熱酸化法によって酸
化膜を堆積させた後、この酸化膜を除去することによっ
て、基板表面の凹凸部の前記根元部を円弧状に加工し、
この導電性基板の表面全体に絶縁層を形成する請求項1
記載の電気化学式センサの製造方法。
[Claims] 1. In an electrochemical sensor in which a working electrode, a counter electrode, and a reference electrode are provided on the same surface of an insulating substrate, and each electrode is covered with an electrolyte layer, insulation at a location where the working electrode and the counter electrode are provided. An electrochemical sensor characterized by having a large number of uneven parts on the surface of a substrate, and having an arcuate base where the bottom and side surfaces of the uneven parts intersect. 2 The insulating substrate is composed of a conductive substrate and an insulating layer formed on the surface thereof, and the surface of the conductive substrate has many irregularities whose bases where the bottom and side surfaces intersect are angular. After forming an oxide film on the surface of the uneven portion by a thermal oxidation method and removing this oxide film, the root portion of the uneven portion on the substrate surface is processed into an arc shape,
Claim 1: An insulating layer is formed on the entire surface of the conductive substrate.
A method of manufacturing the electrochemical sensor described above.
JP1018604A 1989-01-26 1989-01-26 Electrochemical sensor and method of manufacturing the same Expired - Fee Related JP2659133B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1018604A JP2659133B2 (en) 1989-01-26 1989-01-26 Electrochemical sensor and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1018604A JP2659133B2 (en) 1989-01-26 1989-01-26 Electrochemical sensor and method of manufacturing the same

Publications (2)

Publication Number Publication Date
JPH02196956A true JPH02196956A (en) 1990-08-03
JP2659133B2 JP2659133B2 (en) 1997-09-30

Family

ID=11976247

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1018604A Expired - Fee Related JP2659133B2 (en) 1989-01-26 1989-01-26 Electrochemical sensor and method of manufacturing the same

Country Status (1)

Country Link
JP (1) JP2659133B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100504373C (en) 2005-04-20 2009-06-24 华广生技股份有限公司 Electrochemical sensory test strip and its manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100504373C (en) 2005-04-20 2009-06-24 华广生技股份有限公司 Electrochemical sensory test strip and its manufacturing method

Also Published As

Publication number Publication date
JP2659133B2 (en) 1997-09-30

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