JPH0219964B2 - - Google Patents
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- Publication number
- JPH0219964B2 JPH0219964B2 JP57022537A JP2253782A JPH0219964B2 JP H0219964 B2 JPH0219964 B2 JP H0219964B2 JP 57022537 A JP57022537 A JP 57022537A JP 2253782 A JP2253782 A JP 2253782A JP H0219964 B2 JPH0219964 B2 JP H0219964B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- chip
- molding
- capacitor element
- slide block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】
本発明はチツプ型コンデンサのモールド成形方
法およびその成形装置に関し、特にチツプ型固体
電解コンデンサの電極部を露出させた状態で樹脂
外装するモールド成形方法およびその成形装置に
関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method and apparatus for molding a chip-type capacitor, and more particularly to a method and apparatus for molding a chip-type solid electrolytic capacitor in which the capacitor is sheathed with resin with the electrode portion exposed.
従来チツプ型固体電解コンデンサとしては特開
昭49−15954号公報に開示された構造がある。 A conventional chip-type solid electrolytic capacitor has a structure disclosed in Japanese Patent Laid-Open No. 15954/1983.
例えば、第１図ａ，ｂに示すようにコンデンサ
素子１の陽極リード線５および陰極部１ａにそれ
ぞれ金属製の陽極端子２と、陰極端子３とを電気
的に接合し、コンデンサ素子１の表面と両電極端
子２，３との隙間をモールド成形樹脂（以後樹脂
と略称）４でモールド成形装置を用いて樹脂外装
して製造されている。この場合、両電極端子２，
３を最初に接合するため、コンデンサ素子１の表
面の凹凸や、位置決めの困難さから、また、両電
極端子２，３の接続精度の影響などから位置ず
れ、ねじれなどが発生し、モールド成形装置のキ
ヤビテイー部へ挿入出来ないものもあれば、キヤ
ビテイー部の壁と両電極端子の間隙に樹脂が流れ
込み、後工程での樹脂バリの除去作業が必要であ
り、且つこのバリ除去の工数が膨大となる。 For example, as shown in FIGS. 1a and 1b, metal anode terminals 2 and cathode terminals 3 are electrically connected to the anode lead wire 5 and cathode portion 1a of the capacitor element 1, respectively, and the surface of the capacitor element 1 is The gap between the electrode terminals 2 and 3 is covered with a molded resin (hereinafter abbreviated as resin) 4 using a molding machine. In this case, both electrode terminals 2,
3 is bonded first, the unevenness of the surface of the capacitor element 1, the difficulty in positioning, and the influence of the connection accuracy of both electrode terminals 2 and 3 may cause positional deviations and twists, and the molding equipment Some products cannot be inserted into the cavity, and resin flows into the gap between the cavity wall and both electrode terminals, requiring removal of resin burrs in the subsequent process, and the number of man-hours required to remove burrs is enormous. Become.
一方、第２図ａ，ｂに示すようにコンデンサ素
子１より引き出された陽極リード線５の状態で前
述と同様に樹脂にて、樹脂外装した後、両電極端
子２，３を接合する製造方法もあるが、この場合
でも、コンデンサ素子１の陰極部１ａは凹凸の影
響とモールド成形装置は一般的に鋼製のため、モ
ールド成形装置のキヤビテイー部の壁との密着性
が悪く、樹脂が流れ込み、この樹脂バリを除去し
ないかぎり陰極端子３との電気接合は不可能であ
るばかりか、この樹脂バリを除去するのに膨大な
工数と、バリを除去する際の加圧等の影響で品質
的な信頼性をも劣化させる欠点があつた。 On the other hand, as shown in FIGS. 2a and 2b, the anode lead wire 5 drawn out from the capacitor element 1 is covered with resin in the same manner as described above, and then both electrode terminals 2 and 3 are bonded together. However, even in this case, because the cathode part 1a of the capacitor element 1 is affected by unevenness and the molding equipment is generally made of steel, the adhesion with the wall of the cavity part of the molding equipment is poor, and the resin may flow in. , unless this resin burr is removed, electrical connection with the cathode terminal 3 is not possible, and it takes a huge amount of man-hours to remove the resin burr, and the quality is affected by the pressure applied when removing the burr. However, there were also drawbacks that degraded reliability.
本発明の目的はかかる従来欠点を除去した電気
的特性の信頼性が高く、小型で寸法精度の高いチ
ツプ型コンデンサのモールド成形方法およびその
成形装置を提供することにある。 It is an object of the present invention to provide a molding method and a molding apparatus for a chip-type capacitor which is small in size and has high dimensional accuracy, which eliminates such conventional drawbacks and has highly reliable electrical characteristics.
本発明によれば、チツプ型コンデンサの電極部
をモールド成形装置内で弾性を有する有機物を密
着させながら、モールド成形樹脂を封入し、弾性
を有する有機物を離型させ、樹脂外装したコンデ
ンサ素子をモールド成形装置より突出し離型さ
せ、電極部を露出させて樹脂外装することを特徴
とするチツプ型コンデンサのモールド成形方法お
よびその成形装置が得られる。 According to the present invention, the electrode portion of a chip-type capacitor is sealed with an elastic organic material in a molding device, and a molding resin is encapsulated, the elastic organic material is released from the mold, and a resin-sheathed capacitor element is molded. There is obtained a molding method for a chip-type capacitor and a molding apparatus thereof, characterized in that the capacitor is released from the molding device to expose the electrode portion and is covered with resin.
以下、本発明の実施例をチツプ型固体電解コン
デンサにより第３図乃至第５図を用いて説明す
る。 Hereinafter, embodiments of the present invention will be explained using a chip type solid electrolytic capacitor with reference to FIGS. 3 to 5.
第３図ａ、第４図ａは本発明のモールド成形装
置での第１図および第２図構造のチツプ型固体電
解コンデンサを樹脂外装している状態の断面図で
あり、第３図ｂ、第４図ｂは弾性を有する有機物
の断面形状の図である。第３図ａ、第４図ａに示
す様に固定側の上型キヤビテイーブロツク部（以
下、上型部と称す）１０，１１と可動側の下型キ
ヤビテイーブロツク部（以下、下型部と称す）１
２，１３によつて形成されてるモールド成形装置
のキヤビテイー部に第１図ａ、第２図ａに示す構
造の樹脂４を除いた状態のチツプ電解コンデンサ
を下型部１２，１３へ投入後可動させ、上型部１
０，１１とクランプして第３図ｂ，第４図ｂに示
すスライドブロツク１４に固定された、たとえ
ば、シリコンゴムなどの弾性を有する有機物１５
（以下、有機物と称す）で両電極端子２，３及び
第２図ａのコンデンサ素子１の陰極部１ａに完全
密着するようにクランプされた上型部１０，１
１、下型部１２，１３の側面へ接触するまでスラ
イドブロツク１４を摺動させる。スライドブロツ
クブロツク１４より突き出している有機物１５の
寸法量H1、H2と有機物１５の硬度によつて、密
着性を調整することが出来る。この後、キヤビテ
イー部に樹脂４を注入させてコンデンサ素子１を
樹脂で外装する。次に有機物１５を両電極端子
２，３及びコンデンサ素子１より離すようにスラ
イドブロツク１４を摺動させ、引続き上型部１
０，１１および下型部１２，１３を上下に可動さ
せ、樹脂外装された製品を後述する突き出し機構
でノツクアウトして開放し、第１図ａ，ｂの如き
両電極端子に樹脂バリが全く付着していない状態
の電極部を完全露出させて樹脂外装するチツプ型
固体電解コンデンサが得られる。また、第２図ｂ
の如きコンデンサ素子１の陰極部１ａに樹脂バリ
が全く付着しない状態の電極部を完全露出させて
樹脂外装し、この後両電極端子２，３を電気的に
接合して第１図と同じ構造のチツプ型固体電解コ
ンデンサが得られる。 3a and 4a are cross-sectional views of the chip-type solid electrolytic capacitors having the structures shown in FIGS. 1 and 2, which are covered with resin, in the molding apparatus of the present invention, and FIGS. 3b, FIG. 4b is a diagram of a cross-sectional shape of an organic material having elasticity. As shown in FIGS. 3a and 4a, there are upper mold cavity block parts (hereinafter referred to as upper mold parts) 10 and 11 on the fixed side and lower mold cavity block parts (hereinafter referred to as lower mold parts) on the movable side. (referred to as mold part) 1
After inserting the chip electrolytic capacitor with the structure shown in FIGS. 1a and 2a, with the resin 4 removed, into the cavity part of the molding device formed by 2 and 13 into the lower mold parts 12 and 13, the capacitor is moved. and upper mold part 1
0, 11 and fixed to the slide block 14 shown in FIGS. 3b and 4b, for example, an elastic organic substance 15 such as silicone rubber.
(hereinafter referred to as organic matter), the upper mold parts 10 and 1 are clamped so as to be in complete contact with both electrode terminals 2 and 3 and the cathode part 1a of the capacitor element 1 shown in FIG. 2a.
1. Slide the slide block 14 until it comes into contact with the side surfaces of the lower mold parts 12 and 13. The adhesion can be adjusted by adjusting the dimensions H1 and H2 of the organic matter 15 protruding from the slide block block 14 and the hardness of the organic matter 15. Thereafter, resin 4 is injected into the cavity to cover the capacitor element 1 with the resin. Next, the slide block 14 is slid so that the organic substance 15 is separated from both electrode terminals 2 and 3 and the capacitor element 1, and then the upper mold part 1
0, 11 and the lower mold parts 12, 13 are moved up and down, and the resin-sheathed product is knocked out and opened using the ejecting mechanism described later, and no resin burrs are attached to both electrode terminals as shown in Fig. 1 a and b. A chip-type solid electrolytic capacitor is obtained in which the electrode portion in the uncondensed state is completely exposed and covered with resin. Also, Figure 2b
The cathode part 1a of a capacitor element 1, such as the one shown in FIG. A chip-type solid electrolytic capacitor of 100 mL can be obtained.
次に第５図を参照して本発明のモールド成形装
置の構成について説明する。 Next, the configuration of the molding apparatus of the present invention will be explained with reference to FIG.
本装置は大別するとＡ点より上部を固定側の上
型部、下部を可動側の下型部とに二分割される。
固定側の上型部１０，１１には固定側取付板１６
と固定側型板１７とが固定して配設される。この
装置の中央には円筒状のチヤンバー１８が取付け
られる。固定側型板１７には上型部１０，１１が
固定されて配置されている。可動側下型部には可
動側取付板１９にスペーサブロツク２０と可動側
サム板２１が固定され、この上部に可動側受け板
２２と可動側型板２３とが載置し、可動側カム板
２１と可動側型板２３とがボルトａでH3の寸法
間隙で摺動するように取付けられ、さらに可動側
型板２３には下型部１２，１３が固定されてい
る。可動カム板２１にスライド調整カム２４がボ
ルトｂで固定され、可動側カム板２１と可動側受
け板２２の間に圧縮バネ２５が挿着されている。
スライドブロツク１４には有機物１５が固着さ
れ、スライドブロツク１４に定められ量、すなわ
ち、H3の寸法間隙で摺動可能に遊合したスライ
ド調整カム２４と接合している。また、可動側取
付板１９と可動側カム板２１の間に突出板２６を
有し、突出ピン２７がこの突出板２６に固定さ
れ、可動側の下型部１２，１３が構成されモール
ド成型装置が成り立つている。 Roughly speaking, this device is divided into two parts: an upper mold part on the fixed side above point A, and a lower mold part on the movable side below the point A.
A fixed side mounting plate 16 is attached to the fixed side upper mold parts 10 and 11.
and the fixed side template 17 are fixedly arranged. A cylindrical chamber 18 is mounted in the center of the device. Upper mold parts 10 and 11 are fixedly disposed on the fixed mold plate 17. A spacer block 20 and a movable thumb plate 21 are fixed to a movable side mounting plate 19 in the movable lower mold part, and a movable side receiving plate 22 and a movable side mold plate 23 are placed on the upper part of the movable side cam plate. 21 and a movable mold plate 23 are attached with bolts a so as to be slidable with a dimensional gap of H 3 , and the lower mold parts 12 and 13 are further fixed to the movable mold plate 23. A slide adjustment cam 24 is fixed to the movable cam plate 21 with bolts b, and a compression spring 25 is inserted between the movable cam plate 21 and the movable receiving plate 22.
An organic material 15 is fixed to the slide block 14, and is connected to a slide adjustment cam 24 which is slidably engaged with the slide block 14 with a gap of a predetermined amount, that is, H3 . Further, a protrusion plate 26 is provided between the movable side mounting plate 19 and the movable side cam plate 21, a protrusion pin 27 is fixed to this protrusion plate 26, and the lower mold parts 12 and 13 on the movable side are configured. is established.
次に前述の構成よりなる本装置の動作を説明す
る。 Next, the operation of this apparatus having the above-mentioned configuration will be explained.
可動側の下型部１２，１３を可動させＡ点より
開いた状態では有機物１５、スライドブロツク１
４は上型部１０，１１、下型部１２，１３より
H3の寸法間隙分だけ離れた状態となる。従つて、
Ｂ点では同じく圧縮バネ２５の反発力でH3の寸
法間隔分が開く状態となる。この状態でコンデン
サ素子１を下型部１２，１３へセツトし、可動側
の下型部１２，１３を動作させ、先ずＡ点が閉と
なり、上型部１０，１１と下型部１２，１３とが
接合し、次にＢ点が閉じると圧縮バネ２５が縮
み、且つ可動側型板２３が下降し、スライド調製
カム２４によりスライドブロツク１４が移動し
て、第３図、第４図に示す状態となり、チヤンバ
ー１８よりタブレツト状の樹脂４の塊を投入し、
モールド成形機（図示省略）に取付けられたプラ
ンジヤー２８が下降して溶融した樹脂がランナー
２９を通過して上型部１０，１１、下型部１２，
１３のキヤビテイー部に流入して熱硬化され、樹
脂外装される。 When the lower mold parts 12 and 13 on the movable side are moved and opened from point A, organic matter 15 and slide block 1 are removed.
4 from the upper mold parts 10 and 11 and the lower mold parts 12 and 13
They will be separated by a dimensional gap of H 3 . Therefore,
At point B, the repulsive force of the compression spring 25 also opens the space by a distance H3 . In this state, the capacitor element 1 is set on the lower mold parts 12, 13, and the lower mold parts 12, 13 on the movable side are operated. First, point A is closed, and the upper mold parts 10, 11 and the lower mold parts 12, 13 are closed. are joined, and then point B closes, the compression spring 25 is compressed, the movable template 23 is lowered, and the slide block 14 is moved by the slide adjustment cam 24, as shown in FIGS. 3 and 4. state, a tablet-shaped lump of resin 4 is put into the chamber 18,
A plunger 28 attached to a molding machine (not shown) descends and the molten resin passes through a runner 29 to form upper mold parts 10, 11, lower mold part 12,
It flows into the cavity 13, is thermosetted, and is covered with resin.
この後、可動側の下型部１２，１３を可動さ
せ、Ａ点が開いた状態にすると、圧縮バネ２５の
反発力で有機物１５とスライドブロツク１４とが
元の位置に戻りコンデンサ素子１より離れ、次に
モールド成形機のノツク部（図示省略）で突出板
２６を突き上げ突出ピン２７で樹脂外装された製
品を突出しする。 After this, when the lower mold parts 12 and 13 on the movable side are moved to open the point A, the organic matter 15 and the slide block 14 return to their original positions due to the repulsive force of the compression spring 25 and move away from the capacitor element 1. Next, the protruding plate 26 is pushed up using a notch (not shown) of the molding machine, and the resin-coated product is ejected using the protruding pin 27.
以上、本発明によれば小型で外形寸法精度が高
く、且つ電気的特性の安定した樹脂外装のチツプ
型コンデンサが得られ、また、樹脂外装後の樹脂
バリ取り作業が全く不要となり、且つ量産に適す
るもので、その工業的価値は大である。 As described above, according to the present invention, it is possible to obtain a resin-clad chip capacitor that is small, has high external dimensional accuracy, and has stable electrical characteristics, and also eliminates the need for resin deburring after the resin exterior, and is suitable for mass production. It is suitable and has great industrial value.
なお本発明ではモールド成形方法およびその成
形装置の実施例を述べたが、樹脂のポツテイング
および、キヤステイング等の樹脂外装方法でも可
能になることは勿論である。 In the present invention, embodiments of a molding method and a molding apparatus thereof have been described, but it goes without saying that resin packaging methods such as resin potting and casting can also be used.
第１図ａおよびｂはチツプ型固体電解コンデン
サのそれぞれ斜視図および断面図。第２図ａおよ
びｂは固体電解コンデンサの斜視図および樹脂外
装後の断面図。第３図ａおよびｂは本発明のモー
ルド成形装置での第１図構造のチツプ型固体電解
コンデンサを樹脂外装中の断面図、および第３図
ａの弾性を有する有機物とスライドブロツク部分
の断面拡大図。第４図ａおよびｂは本発明１２の
モールド成形装置で、第２図構造の固体電解コン
デンサを樹脂外装中の断面図および第４図ａの弾
性を有する有機物とスライドブロツク部分の断面
拡大図を示す。第５図は本発明のモールド成形装
置の断面図を示す。
１……コンデンサ素子、１ａ……陰極部、２…
…陽極端子、３……陰極端子、４……（モールド
成形）樹脂、５……陽極リード線、１０，１１…
…固定側の上型部、１２，１３……可動側の下型
部、１４……スライドブロツク、１５……弾性を
有する有機物、１６……固定側取付板、１７……
固定側型板、１８……チヤンバー、１９……可動
側取付板、２０……スペサーブロツク、２１……
可動側カム板、２２……可動側受け板、２３……
可動側型板、２４……スライド調整カム、２５…
…圧縮バネ、２６……突出板、２７……突出ピ
ン、２８……プランジヤー、２９……ランナー、
ａ，ｂ……ボルト。
Figures 1a and 1b are a perspective view and a sectional view, respectively, of a chip-type solid electrolytic capacitor. FIGS. 2a and 2b are a perspective view and a sectional view of the solid electrolytic capacitor after being covered with resin. Figures 3a and 3b are cross-sectional views of the resin exterior of the chip-type solid electrolytic capacitor having the structure shown in Figure 1 in the molding apparatus of the present invention, and an enlarged cross-sectional view of the elastic organic material and slide block portion of Figure 3a. figure. FIGS. 4a and 4b show a cross-sectional view of the resin exterior of the solid electrolytic capacitor having the structure shown in FIG. 2, and an enlarged cross-sectional view of the elastic organic substance and slide block portion of FIG. show. FIG. 5 shows a sectional view of the mold forming apparatus of the present invention. 1... Capacitor element, 1a... Cathode part, 2...
... Anode terminal, 3 ... Cathode terminal, 4 ... (molded) resin, 5 ... Anode lead wire, 10, 11 ...
...Upper mold part on the fixed side, 12, 13...Lower mold part on the movable side, 14...Slide block, 15...Elastic organic substance, 16...Mounting plate on the fixed side, 17...
Fixed side template, 18...Chamber, 19...Movable side mounting plate, 20...Spacer block, 21...
Movable side cam plate, 22... Movable side receiving plate, 23...
Movable side template, 24...Slide adjustment cam, 25...
... Compression spring, 26 ... Projection plate, 27 ... Projection pin, 28 ... Plunger, 29 ... Runner,
a, b...Bolt.
Claims (1)
ンデンサ素子の電極部分にのみ弾性を有する有機
物を密圧着させながらモールド成形樹脂を封入す
る工程と、前記弾性を有する有機物を離型させ、
前記電極部分を露出させて樹脂外装されたコンデ
ンサ素子を前記モールド成形装置より突出し離型
する工程とを有することを特徴とするチツプ型コ
ンデンサのモールド成形方法。 ２ 上型部および下型部によつて形成されるキヤ
ビテイー部内にチツプ型コンデンサ素子を配置し
て樹脂外装する樹脂モールド成形装置において、
前記チツプ型コンデンサ素子の露出すべき電極部
分に密圧着される弾性を有する有機物を固定した
スライドブロツクと、前記スライドブロツクに定
められた量で摺動を可能に遊合されて前記スライ
ドブロツクを前記電極部分へ向けて移動させるス
ライド調整カムと、前記スライド調整カムを引き
戻す圧縮バネとを有して構成されることを特徴と
するチツプ型コンデンサのモールド成形装置。[Scope of Claims] 1. A step of encapsulating a molding resin while closely pressing an elastic organic substance only to the electrode portion of a chip-type capacitor element placed in a molding device, and releasing the elastic organic substance from the mold. let me,
A method for molding a chip-type capacitor, comprising the step of exposing the electrode portion and ejecting the resin-sheathed capacitor element from the molding device and releasing it from the mold. 2. In a resin molding device in which a chip-type capacitor element is arranged in a cavity formed by an upper mold part and a lower mold part and is covered with resin,
A slide block having an elastic organic material fixed thereon is closely pressed to the electrode portion of the chip-type capacitor element to be exposed, and the slide block is slidably fitted to the slide block by a predetermined amount. 1. A molding device for a chip-type capacitor, comprising a slide adjustment cam that moves toward an electrode portion, and a compression spring that pulls back the slide adjustment cam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57022537A JPS58139419A (en) | 1982-02-15 | 1982-02-15 | Method and device for molding chip condenser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57022537A JPS58139419A (en) | 1982-02-15 | 1982-02-15 | Method and device for molding chip condenser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58139419A JPS58139419A (en) | 1983-08-18 |
| JPH0219964B2 true JPH0219964B2 (en) | 1990-05-07 |
Family
ID=12085550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57022537A Granted JPS58139419A (en) | 1982-02-15 | 1982-02-15 | Method and device for molding chip condenser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58139419A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6094721A (en) * | 1983-10-28 | 1985-05-27 | 日立コンデンサ株式会社 | Apparatus for producing molded condenser |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5222296B2 (en) * | 1972-12-13 | 1977-06-16 | ||
| JPS5219499B2 (en) * | 1972-12-13 | 1977-05-28 |
-
1982
- 1982-02-15 JP JP57022537A patent/JPS58139419A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58139419A (en) | 1983-08-18 |
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