JPH0220110U - - Google Patents
Info
- Publication number
- JPH0220110U JPH0220110U JP9865288U JP9865288U JPH0220110U JP H0220110 U JPH0220110 U JP H0220110U JP 9865288 U JP9865288 U JP 9865288U JP 9865288 U JP9865288 U JP 9865288U JP H0220110 U JPH0220110 U JP H0220110U
- Authority
- JP
- Japan
- Prior art keywords
- stage
- wafer chuck
- moves
- wafer
- measuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003550 marker Substances 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- A Measuring Device Byusing Mechanical Method (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図は本考案の実施例１を示す構成図、第２
図は本考案の実施例２を示す構成図である。
１……ウエハチヤツク、２……Ｘ−Ｙステージ
、３ａ……ナイフ、３ｂ……レジスト滴下装置、
４……Ｘ−Ｙ−Ｚステージ、５……入力装置、６
……制御装置、７……ウエハ。
Figure 1 is a configuration diagram showing the first embodiment of the present invention;
The figure is a configuration diagram showing a second embodiment of the present invention. 1... Wafer chuck, 2... X-Y stage, 3a... Knife, 3b... Resist dropping device,
4...X-Y-Z stage, 5...Input device, 6
...Control device, 7...Wafer.
Claims (1)
た段差を測ることにより、膜厚を求める段差測定
装置において、ウエハチヤツクと、ウエハチヤツ
クを水平方向に移動せしめるＸ−Ｙステージと、
ウエハチヤツクの上方に位置し、段差部を形成す
るマーカと、マーカを垂直、水平方向に移動せし
めるＸ−Ｙ−Ｚステージと、段差形成位置並びに
制御命令を入力する入力装置と、入力指示に従い
、Ｘ−ＹステージとＸ−Ｙ−Ｚステージの駆動系
を制御する制御装置とを有することを特徴とする
段差形成装置。 A step measuring device that measures the film thickness by peeling off a part of the film on the wafer to the underlying layer and measuring the step formed thereon includes a wafer chuck, an X-Y stage that moves the wafer chuck in the horizontal direction,
A marker located above the wafer chuck that forms a step, an X-Y-Z stage that moves the marker vertically and horizontally, an input device that inputs the step formation position and control commands, - A step forming apparatus characterized by having a control device for controlling a drive system of a Y stage and an XYZ stage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9865288U JPH0220110U (en) | 1988-07-26 | 1988-07-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9865288U JPH0220110U (en) | 1988-07-26 | 1988-07-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0220110U true JPH0220110U (en) | 1990-02-09 |
Family
ID=31325116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9865288U Pending JPH0220110U (en) | 1988-07-26 | 1988-07-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0220110U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013015323A (en) * | 2011-06-30 | 2013-01-24 | Ulvac Japan Ltd | Film thickness measuring apparatus and film thickness measuring method |
-
1988
- 1988-07-26 JP JP9865288U patent/JPH0220110U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013015323A (en) * | 2011-06-30 | 2013-01-24 | Ulvac Japan Ltd | Film thickness measuring apparatus and film thickness measuring method |
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