JPH0220657A - Hot-blast type solder melting device - Google Patents

Abstract

PURPOSE:To execute soldering with high reliability by attaching a cylindrical body for exhausting a hot blast to one end of a base body and attaching a plug having a heater contained in the cylindrical body to the other end so as to be attachable and detachable. CONSTITUTION:To one end of a base body 1 provided with a through-hole 2 in the axial direction, a cylindrical body 3 for exhausting a hot blast from the tip is attached. To the other end, a plug 4 to which a heater 6 has been attached so as to be self-supportable is attached so as to be attachable and detachable. The heater 6 is contained in the cylindrical body 3, and the heater 6 is allowed to have the outside diameter by which an air flow can move between the heater and the cylindrical body 3. In such a way, soldering can be executed with high reliability.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a hot air solder melting device used for attaching a flat pack type IC to a printed circuit board and for removing an IC attached to the board. Pause.

(Prior art) In response to the recent demand for high-density packaging, electrical components such as semiconductor circuits are manufactured by having a strip extending approximately parallel to the side surface of the package, as shown in FIG. It is configured as a flat package. These flat-packaged electrical components can be surface-mounted by soldering onto the surface of a printed circuit board without using a socket, making it possible to effectively utilize the surface of the printed circuit board and improve mounting density. There are big benefits.

However, when soldering to a printed circuit board or replacing a mounted flat pack IC due to a failure or a change in specifications, there is a problem in that all the lead pieces welded to the printed circuit board must be melted at the same time in order to be removed. There is.

For this purpose, a hot air generator containing a suction pad that communicates with a negative pressure source is used in a nozzle formed to match the shape of the flat pack IC, and the flat pack IC is fixed by adsorption to the suction pad. is lowered to the circuit board, and hot air is blown out of the nozzle to melt the solder on the board.

However, since this suction pad is usually made of an elastic material such as silicone rubber, when an electrical component is pressed against a circuit board, the suction pad elastically deforms and misaligns, which may cause a connection error. Not only is there
There was a problem in that the suction pad was exposed to hot air and was susceptible to deterioration.

In order to solve this problem, the present applicant has proposed a structure in which the inner wall contacts the peripheral surface of the electronic component package and contacts the package surface at a position where the node portion of the package is exposed, as shown in FIG. A member having a stepped portion a,
The outer cylinder C regulates the outlet e of the nozzle tip d, and the space f formed by the stepped part a and the package surface.
We proposed a device for hot air soldering that connects a device to a negative pressure source.

According to this device, it is not only possible to improve the positioning accuracy and reliability of flat pack ICs by eliminating the need to house a suction pad inside the nozzle, but also to reduce the size of the nozzle. This also has the effect of making it possible to solder with hot air, and furthermore, the space forming the suction part acts as a heat insulating layer to prevent the temperature of the IC from rising.

Although miniaturization has become possible in this way, there is a disadvantage in that the air in the hot air generator is not mixed uniformly, which tends to cause temperature unevenness in the hot air.

(Problems to be Solved) The present invention has been made in view of the above circumstances, and its purpose is to develop a new solder that has a uniform temperature distribution regardless of the miniaturization of the hot air generator. The purpose of the present invention is to provide a hot air generator for melting.

(Means for solving the problem) In an apparatus for melting solder using PAm, which is equipped with a nozzle having an electric component suction tool at the lower end, hot air is applied from the tip to one end of the through hole of a base body having a through hole bored in the axial direction. The cylindrical body that ejects water has a length at the other end that can be accommodated in the cylindrical body, and the heater has an outer diameter that allows movement of air flow between the cylindrical body and the heater. Equipped with a hot air generator with a removably attached plug.

(Function) Compressed air is blown from the inner circumferential surface of a cylindrical body with a circular cross section that accommodates the heater, the compressed air is swirled in a spiral shape within the cylindrical body, and the air is stirred sufficiently, and then jetted out from a nozzle. This makes it possible to obtain hot air with a uniform temperature.

(Example) The details of the present invention will be described below based on illustrated examples.

FIG. 1 is a cross-sectional view of an apparatus showing an embodiment of the present invention, and reference numeral 1 in the figure indicates a base made of a refractory material such as metal, in which a through hole 2 is bored in the axial direction. A cylindrical body 3 having a circular cross section that accommodates a heater 6 to be described later and blows out hot air from its tip is fixed to one end of the through hole 2, and a plug 4 is removably attached to the other end of the through hole 2 with a screw or the like. Further, an air injection hole 5 is formed on the side surface of the base body 1 in a tangential direction of the through hole 2 and communicating with the outside.

On the other hand, the distal end surface of the plug 4, that is, the surface for insertion into the through hole 2, has a length that can be accommodated in the cylindrical body 3, and
A heater 6 formed by winding a heating wire such as a nichrome wire so as to have an outer diameter that allows movement of air flow between the heater 6 and the cylindrical body 3 is installed so as to be able to stand on its own. In addition, the symbol 7.7 in the figure
indicates a lead wire that supplies power to the heater 6.

According to this embodiment, when the air injection hole 5 is connected to a compressed air power source and the heater 6 is energized, the air flowing from the air injection hole 5 flows in from the tangential direction of the inner peripheral surface of the through hole of the base body 1. The heater 6 rotates around the center line of the cylindrical body 3.
pass through. During this passage, the air passes through the heater 6
It flows into every corner of the tube, receives heat, and is heated, and at the same time stirs the surrounding air by its own swirling motion, becomes uniform in temperature, and is ejected from the tip of the cylindrical body 3.

On the other hand, if the heater 6 breaks due to long-term use, remove the plug 4 from the base 1, pull out the heater 6 from the cylindrical body 3, and set the plug with a new heater installed. can be exchanged.

21st! l is the aforementioned Ili! This figure shows an embodiment of a hot air type solder melting device using an I-air generator, and reference numeral 10 in the figure is a main body of the hot air generator that is attached to a base 11 so as to be movable up and down. A nozzle member 13 is removably provided, which has an outlet 15 that sucks the flat-packed IC and blows hot air to the lead portion of the flat-packed IC.

This nozzle member 13 has a flat-backed IC inner surface.
A wall portion lea forming an air outlet 15 that matches the circumferential shape of the IC and has a constant gap with the outside 11114 on the outer surface side, and a central portion that controls the height of exposing the lead piece in contact with the surface of the flat-packed IC. A partitioning member 16 consisting of a stepped portion 16b forming a suction chamber 17 connected to the suction pipe 20 is joined at the tip of the outer cylinder 14, and the wall surface and the outer cylinder 1
3 to form an outlet 15.

A frame 30 is fixed to the upper part of the storage barrel 12, and each through hole 31 has a plurality of holes 31, 31.31 drilled at equal intervals in this embodiment (FIG. 3). The hot air generator described above is inserted and fixed with its cylindrical body facing downward, and each compressed air injection hole 5 is connected to a compressed air source.

In this embodiment, when the suction tube 20 is connected to a negative pressure source and the flat-packed IC to be soldered is inserted into the suction chamber 17, the flat-packed IC is connected to the wall of the partitioning member 16 with its peripheral surface. The surface is regulated by the stepped portion 16b and is held under negative pressure in the suction chamber 17 located above.

In this state, when the heater 6 of each hot air generator is energized and compressed air is supplied to the static injection hole 5, the air flowing from the injection hole 5 flows in from the tangential direction of the inner peripheral surface of the through hole 2 of the base l. It rotates around the center line of the cylindrical body 3 and then passes through the heater 6.

In the process of this passage, the air flows into every corner of the heater 6, receives heat and is heated, and at the same time, its own swirling movement stirs the surrounding air to make it uniform in temperature, and the air flows from the tip of the cylindrical body 3 to the nozzle member 13. The solder flows into the circuit board and is ejected from the outlet 15 to melt the cream solder previously applied to the circuit board, thereby performing soldering.

FIG. 4 shows an embodiment of the above-mentioned mounting frame, and the reference numeral 40 in the figure indicates the storage cylinder 12 (second
The pressure-proof supply pipe 2 is attached to the base body that also serves as a frame.
A plurality of through holes 42, 42, 42 with a circular cross section in this embodiment, three in this embodiment, are arranged at equal intervals around the extraction hole 41 of 0.
Compressed air inlets 43, 43, 43 are formed so as to communicate in the tangential direction of each through hole 42.

In this embodiment, by fixing the cylindrical body 44, 44, 44 to the tip of the through hole, that is, to the nozzle side, and attaching the aforementioned plug 4 (Fig. 1) to the other end, the hot air generator can be connected to the hot air generator. This results in a suitable heater assembly.

FIG. 5 shows a second embodiment of the present invention, in which reference numeral 5o denotes a hot air induction body with a circular cross section and a nozzle 51 with a flat-packed IC suction chamber at its tip that is detachably installed. , an inner cylinder 52 is coaxially disposed inside, and a gap is provided at the tip to form an outlet 53.53. A plurality of cylindrical bodies 55 are disposed on the upper part of the hot air induction body 50 so as to correspond to the tangential direction of the circumferential surface of the induction body.
．． Fix one end of 55.55 and attach the heater 56.56 here.
．． 56, and a compressed air source is connected to the other end, and a compressed static electricity inlet 57 is provided separately from these. Note that the reference numeral 58 in the figure indicates a suction tube.

In this embodiment, when compressed air is supplied with the heater 56.56.56 energized, the cylindrical body 55.55.5
The hot air ejected from the inductor 5 flows in from the tangential direction of the induction member 5°, reaches the nozzle 51 while making a swirling motion between the inner member 152, and is ejected from the outlet 53.

In this process, the hot air flowing in from each cylindrical body 55 is mutually stirred within the space formed by the induction body 50 and the inner cylinder 52, and has a uniform temperature. Furthermore, when the power to the heater is cut off and compressed air is injected from the compressed air inlet 57 at the stage when soldering is completed, cold air is blown out from the outlet 53 within a very short time and the soldered leads are The pieces will cool quickly.

According to this embodiment, the chest to which the nozzle 51 is fixed, that is, the hot air guide 50, can be formed as thin as possible, so that blind spots are reduced and positioning accuracy and workability can be improved.

In this embodiment, compressed air is injected from the end of the cylindrical body 55, but by using the hot air generator shown in FIG. 1, the air can be stirred doubly. As a result, hot air with a more uniform temperature distribution can be obtained.

(Effects of the Invention) As explained above, in the present invention, in an apparatus for melting solder with hot air, which is equipped with a nozzle having an electric component suction tool at the lower end, the through hole is formed in a base body having a through hole in the axial direction. A cylindrical body that blows out hot air from the tip at one end, and a length that can be accommodated in the cylindrical body at the other end,
The hot air generator is equipped with a plug that is removably attached to a heater having an outer diameter that allows movement of air flow between it and the cylindrical body. It can be spouted after sufficient stirring, and the hot air with even temperature not only enables highly reliable soldering, but also prevents abnormal heat generation of the heater and extends its life. The heater can be replaced by replacing the plug.

[Brief explanation of the drawing]

Figures 1 (a) and (b) are sectional views showing an embodiment of a solder melting apparatus according to an embodiment of the present invention, Figure 2 is a sectional view showing an embodiment of a solder melting apparatus using a hot air generator, and Figure 3 The figure is a top view showing one embodiment of the frame body for installation in the device in figure 2, and figure 4.
Figures (A) and (B) are sectional views showing other embodiments of the above frame body, Figures 5 (A) and (B) are sectional views respectively showing other embodiments of the present invention, and Figure 6 is a sectional view showing other embodiments of the frame body. FIG. 7 is a diagram showing an example of a conventional hot-air solder melting device, and FIG. 7 is a diagram showing an example of a flat-packed IC. Fig. 1 1... Base body 2... Through hole 3... Cylindrical body 4... Plug 5... Air injection hole 6... Heater 13... Nozzle member

Claims (1)

[Claims] In an apparatus for melting solder with hot air, which is equipped with a nozzle having an electric component suction tool at the lower end, a cylindrical body from which hot air is ejected from the tip is provided at one end of the through hole of a base body having a through hole bored in the axial direction. At the other end, a plug is removably attached that has a length that can be accommodated in the cylindrical body and has a heater that can stand on its own and has an outer diameter that allows airflow to move between the cylindrical body and the cylindrical body. A hot air type solder melting device characterized by being equipped with a hot air generator.