JPH0220822Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to chip-type electronic components, and in particular to an improvement in the structure for taking out the anode terminal of a solid electrolytic capacitor.

Conventional chip-type solid electrolytic capacitors with a rectangular molded exterior are shown in Figures 1a and 1b.
A flat anode terminal 4 was joined by welding to an anodizable lead wire 2 which was led out in a raised shape from an anode body 1 of a capacitor element, and then provided on the surface of the anode body 1 via a solid electrolyte layer. A flat cathode terminal 5 was bonded to the silver/paste layer using solder, conductive paste 9, etc., and then drawn out, and a mold exterior was applied with insulating resin 7 to form the structure.

However, in such a conventional structure, if the lead wire 2 protrudes even slightly from the mold exterior surface due to the shape of the mold exterior and the structure of the anode terminal 4, the anode terminal 4 must be closely attached to the mold exterior surface and processed. In this case, there was a risk that a portion of the anode terminal 4 would crack. Therefore, the lead wire 2 and the anode terminal 4 must be joined sufficiently inside the inner surface of the mold exterior, taking into account variations in alignment when joining. As a result, the length of the anode body 1 is significantly limited, resulting in a drawback that the capacitance of the capacitor that can be contained within the molded exterior is significantly limited.

The object of the present invention is to provide a chip-type electronic component that overcomes the above-mentioned drawbacks of the prior art.

According to the present invention, an electronic component element body is placed between electrode terminals formed by a pair of flat or angular conductive materials each having a hole on one side and arranged to face each other. A chip-type electronic component is obtained, characterized in that at least one electrode wire of the component element is fitted into the hole, and a space between the pair of electrode terminals is sealed with an insulating resin.

Embodiments of the present invention will be described below with reference to FIGS. 3 and 4.

FIGS. 3a and 3b are diagrams illustrating the first embodiment of the present invention. After pressure-forming metal powder with valve action such as tantalum, niobium, aluminum, etc. into a cylindrical or square plate shape, it is heated to approximately the melting temperature of the valve action metal mentioned above in a high vacuum furnace of approximately 10 ^-5 Torr. A lead wire that can be anodized is led to the anode body 1 which is sintered at a temperature of about 3/4, and the anode body is further anodized to form a dielectric layer having an oxide film of a desired thickness.

Next, it is immersed in a manganese nitrate solution and thermally decomposed at a temperature of around 200℃ to form a manganese dioxide electrolyte on the surface of the dielectric layer, and then immersed in a graphite solution for deriving the cathode section and heated to a temperature of around 200℃. After baking at a temperature of , a silver paste layer is applied to form the cathode layer 3.
A capacitor element is formed. Next, in order to take out the positive and negative terminals 4 and 5 from the capacitor element by molding the insulating resin 7, attach a nickel silver plate to the lead wire 2 protruding from the capacitor element and the cathode layer 3 of the capacitor element. Phosphor bronze,
By etching or pressing a solderable plate metal such as iron nickel, the anode terminal 4 is provided with a circular hole 6a, a square hole 6b, and an oval hole 6c, as shown in FIGS. Process it into a desired shape with a stepped portion.

Next, the tip of the lead wire 2 of the capacitor element is inserted into the hole 6 of the anode terminal 4 to the extent that it does not protrude and is connected by electric welding.Meanwhile, the cathode terminal 5 is connected to the silver paste layer 3 by soldering or by using conductive paste 9. Join.

At this time, when joining the lead wire 2 to the anode terminal 4, place the diameter of the lead wire 2 in the center of the anode terminal 4.
A plate-shaped terminal is used which has been pre-drilled so that the hole having a diameter of 0.5 mm or less is located adjacent to the side surface of the insulating resin 7 on which the capacitor element is molded.

Next, using a molding die, molding is performed using a mold exterior resin such as epoxy or silicone. Subsequently, the anode terminal 4 and the cathode terminal 5 are cut and bent to form an L-shape that hangs down from the side surface of the capacitor element to the bottom corner as shown in FIG.
In this way, with the structure of the present invention, the slightly exposed part of the lead wire 2 from the side surface of the insulating resin 7 covered with the mold is also bent to the extent that the lead wire fits into the hole 6 of the anode terminal 4, which causes unnecessary stress on the frame. There is no need to add. Therefore, the anode terminal crackling that occurred in the past is completely eliminated.

In addition, conventionally, the length of the capacitor element inside the mold exterior required a sufficient margin for the connection position between the lead wire 2 and the anode terminal 4 on the inner surface of the mold exterior side. Since it can be extended close to the side surface, the length of the capacitor element contained inside the mold exterior can also be increased, making it possible to increase the capacitor capacity by about 30% compared to conventional molds.

As described above, the present invention has the following effects compared to the conventional one.

(i) The capacitance of the capacitor can be increased by approximately 30% even with the same molded exterior shape.

(ii) There will be no cracking during bending of the anode terminal due to the protrusion of the lead wire.

(iii) Work efficiency is improved because the matching dimensions of the lead wire and the anode terminal become easier.

[Brief explanation of the drawing]

FIGS. 1a and 1b are a cross-sectional view and a perspective view of a conventional chip-type solid electrolytic capacitor. FIG. 2 is a perspective view of the main parts of the anode terminal and cathode terminal used in FIG. 1. Third
Figures a and b are a cross-sectional view and a perspective view of the chip-type solid electrolytic capacitor of the present invention. Figure 4 a, b, c are the third
FIG. 3 is a perspective view of each embodiment of the main parts of the cathode terminal and anode terminal used in the figure. 1... Capacitor element, 2... Lead wire, 3...
... Cathode layer (silver paste layer), 4 ... Anode terminal, 5
... Cathode terminal, 6, 6a, 6b, 6c ... Hole, 7
...Insulating resin.

Claims (1)

[Claims for Utility Model Registration] (1) A flat anode terminal whose one end is connected to an anode lead wire derived from a solid electrolytic capacitor element, and a flat cathode whose one end is connected to the cathode of the capacitor element. a terminal, one end of the anode terminal, one end of the cathode terminal, and the capacitor element are covered with an insulating resin, and the other end of the anode terminal and the other end of the cathode terminal face each other. In the chip type electronic component drawn out from the insulating resin and disposed, the tip of the lead wire is fitted into a hole provided in a region of the anode terminal exposed from the resin. Chip-type electronic components. (2) The inner diameter of the hole is the outer diameter of the electrode wire plus 0.5 mm.
A chip-type electronic component according to claim 1 of the utility model registration claim, characterized in that: (3) The chip-type electronic component according to claim 1, wherein the hole has a polygonal or elliptical shape.