JPH02209232A - Continuous method of manufacturing metal foil laminates - Google Patents

Abstract

PURPOSE: To shorten a post-curing time and to enhance the curing degree of a laminate by employing high frequency heating in a post-curing process in a case for continuously producing a laminate consisting of a specific metal foil layer and a specific resin layer. CONSTITUTION: The metal foil wherein copper or other metal is coated with zinc supported on a cellophane sheet 21 is coated with a polyester/epoxy resin compsn. containing a catalyst. The first metal foil sheet A having the polyester/ epoxy resin coating film is sent to a laminating table 7 held to uniform temp. and gelling is started by the heat of the laminating table 7. A second zinc coated metal foil is applied to the partially gelled polyester/epoxy resin coated first metal foil sheet A sent into a squeeze roll 9 to be bonded thereto to form a laminate which is, in turn, cured by multistage heat treatment. After curing, the laminate is trimmed at its end parts to be set to desired width. Next, the cut laminates are stacked to be introduced into a high frequency applicator 17 to receive the action of high frequency electromagnetic energy.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a method for continuously manufacturing (adhering and curing) a laminate comprising a metal foil layer and a reinforced polyester/epoxy resin layer.

Such laminates include circuit boards, E, M, and I-R.

F.1. Used as a shielding material (electromagnetic interference/radio interference shielding material).

<Prior Art> Circuit boards and shielding materials are manufactured by laminating electrical insulating materials such as glass fiber-reinforced unsaturated polyester sheets on metal foils, such as copper foils. This type of circuit board and shield material may be flexible or flexible, and may be either one-sided (metal foil is laminated on only one side of the insulating material) or double-sided (metal foil is laminated on both sides of the insulating material). ), or classified into multiple layers.

Electrical insulation is the substrate or support for the metal foils to be joined. The National Electrical Manufacturers Association (NEMA) has established standards for various basic materials. NEMA also establishes standards for polyester-epoxy glass mat sheet laminates, such as grades GPO-1, GPO-2, and GPO-3.

Typically, a metal foil, such as a copper foil, is fixed to the reinforced plastic sheet by a suitable adhesive. For example, US Pat. No. 3,700.53E1 discloses the use of polyimide adhesives to adhere copper foil to resin-impregnated glass cloth. It is also known to add adhesion promoters to insulating substrate materials. For example, U.S. Pat.
No. 7.900 and No. 3,149,201,
Unsaturated polyester resins are disclosed as adhesion promoters for adhering copper foils when the insulating substrate material consists of methyl methacrylate resins. However, these US patents disclose that increasing the proportion of polyester resin generally reduces the adhesion of the copper foil to the resin substrate. When the proportion of polyester exceeds 45 parts by weight to 100 parts by weight of methyl methacrylate resin, the adhesion drops rapidly to unacceptable values, US Pat. No. 4,093,768.
The patent discloses that an unsaturated polyester resin containing about 2% by weight benzotriazole as an adhesion promoter can be directly bonded to copper foil under pressure.

Alternatively, it has been suggested that the metal foil be surface treated to promote adhesion. U.S. Pat. No. 3,674.445 discloses that a strongly adhesive organic film can be formed on a copper surface by using a vacuum-deposited zinc film as a brimer and interposing "C". ,729,
No. 294 discloses a method for promoting adhesion of polymeric insulation coatings to copper surfaces. This method forms a thin zinc film on the copper surface, heats the surface and diffuses the zinc,
This method provides a zinc-dispersed surface with the golden appearance of brass.

It can be seen that these prior art techniques are generally complex and therefore expensive to implement.

Therefore, the applicant hereby discloses a metal-clad polyester glass fiber laminate (metal-cl
ad polyester-glass fiber
describes an improved invention relating to IalIlinatas). That is, in U.S. Patent No. 4,420,509,
A continuous method of bonding unsaturated polyester directly to metal foil is described. U.S. Pat. No. 4,446,173 describes a continuous method for bonding unsaturated polyester directly to zinc-coated metal foil. U.S. Patent No. 4,58
Publication No. 7,161 (corresponding Japanese application; Japanese Patent Application Laid-Open No. 1983-179
No. 249) describes a continuous method for bonding unsaturated polyester epoxy resin directly to zinc-coated metal foil. According to these publications, finished products with a degree of hardening of 83 to 94% are produced by post-curing in a hot air convection oven. The post-curing time required for this purpose is, for example, 4 to 24 hours.

<Problems to be Solved by the Invention> According to the above method, the method for manufacturing the laminate is certainly simplified, and therefore the manufacturing cost is also reduced. However, since post-curing takes 4 to 24 hours, there is an additional problem in reducing manufacturing costs.

In recent years, the performance of laminates (peel resistance strength) has also increased.

In order to further improve processability, etc., it is desired to further improve the degree of hardening of the laminate. However, in the post-curing method using the hot air convection oven, the degree of curing of the laminate is 83 to 94.
Therefore, the present invention aims to shorten the post-curing time and improve the hardness of the laminate.

<Means for Solving the Problems> The present invention is a method for manufacturing a laminate made in view of the above problems, and includes at least one zinc-coated metal foil and a polyester/epoxy resin or an epoxy resin reinforced with glass fibers. The resin is partially gelled, the partially gelled resin and the zinc coated metal foil are pressurized if necessary, and the partially gelled resin and the zinc coated metal foil are laminated by post-curing. A method for manufacturing a laminate in which zinc-coated metal foil is directly bonded, characterized in that the post-curing is performed by high-frequency heating.

<Detailed Description of the Invention> The present invention comprises an electric circuit board, E, M, 1. -R,Fl, provides a rapid, economical, continuous process for bonding and curing metal-clad polyester fiberglass laminates useful as shields. Electrical circuit boards utilize copper or other metal foils that are subsequently etched to leave portions of the copper foil as electrical conductors. The thickness of copper foil is usually -
Expressed in ounces of copper to foil per square feed, electrodeposited foil is generally used for electrical circuit boards and E, M, I.

R,F,! , used in the production of shielding materials. Electrodeposited foil is obtained by plating a stainless steel drum and continuously peeling the plated foil from it. The inner surface of the resulting foil has a smooth finished surface, but the outer surface is rough, resulting in a large surface area and excellent adhesion. In the method of the invention, the rough surface of the copper foil is further coated with zinc. The thickness of the foil is controlled by adjusting the solution concentration and electrical and mechanical parameters in the plating process. Generally, electrical circuit boards and shielding materials utilize copper foil with a wall thickness of 1 to 2 ounces per square feed. -1 ounce of foil per square feed is approximately 0.0036c
m (0,0014 In, ), whereas a 2 oz foil has a wall thickness of approximately 0.0071 Ca (0,0028
It has a wall thickness of in, ). The zinc coating commonly used on the rough surface of copper foil is preferably an electrogalvanized coating, for example,
The thickness is approximately 15 to 25 μ·C11 (6 to 10 μ·in).

The copper foil utilized in the method of this invention is described by the Institute for Interconnect Packaging and Electrical Circuits.
Ute for Interc.

Connecting and PackagingE
It conforms to the standard established by Electronics Electronics Corporation, that is, the standard I PC-CF-150E. The copper foil may be heat treated before forming the catalyst-containing polyester-epoxy resin coating. Preheating the zinc-coated copper foil will bond the zinc-coated copper foil to the polyester-epoxy resin. become an obstacle when
Heating of zinc-coated copper foil increases the adhesion of the zinc-coated foil surface to polyester epoxy resins, by an unknown mechanism, which helps prevent wrinkles and other surface defects. .

Optionally, cellophane sheets are utilized to support the zinc coated copper foil. Flat transparent cellophane is suitable for this purpose. Cellophane formed from polyethylene terephthalate is also available. Generally, about 48 to 1 f4
Cellophane in the range of gauge (approximately 0.12 to 0.44 cm) is utilized.

Generally, when heavy copper foil is used, it is necessary to make the cellophane sheet thicker to minimize its stress.

The unsaturated polyester resins utilized are generally linear polyesters, which are crosslinked with vinyl monomers to form thermosetting polymers. Polyester resins consisting of phthalic anhydride, maleic anhydride, propylene glycol, ethylene glycol, and styrene are also suitable. The main purpose of the method of this invention is to manufacture rigid circuit boards and shielding materials, but by using the method of this invention,
It is also possible to produce flexible electrical circuit boards. Flexible unsaturated polyester and epoxy resins are utilized to manufacture flexible electrical circuit boards. Typical flexible unsaturated polyester resins include phthalic anhydride, maleic anhydride and diethylene glycol (HOCH2CH
20CH2CHOH), etc.

The polyester epoxy resin used in the practice of this invention contains from about 80% to about 90% by weight polyester and from about 10% to about 20% by weight epoxy resin. The preferred proportions of polyester and epoxy resin are from about 84% to about 88% polyester and about 12% by weight polyester.
1i weight percent to about 16 weight percent epoxy resin. A particularly preferred formulation includes about 86% polyester and about 14% epoxy resin.

The unsaturated polyester resin utilized in the method of this invention contains a catalyst to promote crosslinking or thermoset structure. A primary consideration in catalyst selection is generally the temperature at which the curing process is performed. There is an optimum temperature for a given resin-catalyst system at which the resin formed by catalytic decomposition at that temperature
All free radicals can be utilized. Above this temperature, peroxide is wasted, and at lower temperatures, more time is required to complete the cure.

Catalysts useful in the process of this invention include peroxides such as benzoyl peroxide, methyl ethyl ketone peroxide, hydroperoxides such as cumene hydroperoxide, or other compounds that decompose to form active free radicals, such as t-butyl There's perbenzoate. In the method of this invention, the amount of catalyst utilized may be sufficient to achieve gelation in about 1 1/2 to 4 minutes and exothermic curing in about 5 to about 8 minutes. This time (to reach the exothermic curing stage) does not indicate completion of curing, but merely indicates that the heat generated by the curing reaction has reached a maximum.

Flame retardants such as bromine-containing compounds can be added to the polyester resin and catalyst. Adhesion promoters can also be added to the polyester resin and catalyst to increase the adhesion of the metal foil to the polyester resin insulation. Sodium silicate is known to be an effective adhesion promoter in the method of this invention. Generally, a sodium silicate salt solution of from about 0.1 to about 1% (preferably about 0.5%) by weight, based on the polyester resin, is utilized in the process of this invention. A preferred sodium silicate solution useful as an adhesion promoter in the method of this invention is sodium silicate salt D, available from PQ Cocoation, Burley Forest, Pennsylvania, USA.
(registered trademark). Sodium silicate D is S I O2
/N a 20 weight ratio is 2, and the density at 20° C. is 1.53 g/cm 3 .

The epoxy resin system (EP) used in this method.

xy resin system) is a modified 4°4
’-Isopropylidene chefhenol/epichlorohydrin, using the Shell Chemicals trademark.
Epon 9801 and Epon-RSL-490 both use proprietary additives.
Styrene monomers are used along with additives. Epon hardeners Epon 9850 and R5C-491 are hardeners for the corresponding resins. Shell Epon 9801 is used with Epon 9850. Epone RSL-490 is R3C-
Used with 491. Epon 9850 is a trimetalic anhydride with proprietary additives.

RSL-491 is a heterocyclic amine with proprietary additives. When the manufacturing method of the present invention is carried out using these epoxy resins alone or in combination with a polyester resin, the peel adhesion strength of the laminate is significantly improved.

If desired, fillers can be added to the catalyst-containing polyester epoxy resin. Typical fillers include Josiah kaolin, fused silica, alumina trihydrate, aragonite and CA-5 calcium sulfate. Utilizing fillers of this type improves the physical properties of the final laminate, including mechanical and electrical properties.

The amount of filler used is approximately 5 parts by weight per 100 parts by weight of resin.
It is sufficient if it is in the range of ~50 parts by weight.

In the method of this invention, glass 1a fibers are utilized to strengthen (reinforce) the polyester epoxy resin. In one embodiment, chopped glass fibers (chopped gla
ss Nber 5trands) is randomly distributed within the resin layer as a reinforcing material. In another embodiment, instead of short glass fibers, a mat of glass fibers is similarly coated with resin. Glass is particularly useful as a reinforcing agent. This is because it has high tensile strength, high modulus, can be formed into small diameter fibers, is inert, and has a low specific gravity compared to other equal strength fibers. In embodiments of the invention that utilize short glass fibers, a plurality of glass fibers (glass
s fiberstards) is approximately s, 1cm+
(2 tn-) length filaments are cut and randomly distributed within the polyester-epoxy resin layer. In embodiments utilizing glass mats, electrically insulating glass fibers having a weight of about 3/4 to about 12 ounces per square foot are uniformly coated onto the polyester-epoxy resin layer. Generally, in the method of this invention, the weight of the glass fiber filaments dispersed within the polyester epoxy resin is from about 10% to about 30% by weight based on the resin, and from about 10% to about 20% by weight based on the resin. Preferably, and most preferably about 12-15% by weight of the resin.

Referring to FIG. 1, in one preferred method of the present invention, a zinc-coated metal foil (hereinafter referred to as a first metal) of copper or other metal is supported, optionally on a cellophane sheet 21 (see FIG. 2). A polyester/epoxy resin composition containing a catalyst is coated on the foil (referred to as Foil A) (this is done in the area shown in the figure).

A coating of catalyst-containing polyester-epoxy resin is applied to the first metal foil A using a doctor blade 5 set to form a puddle. Glass mats or short glass fibers are uniformly distributed over the entire polyester/epoxy resin layer supported by the first metal foil A at portions H shown in the figure.

The first metal foil sheet A with the polyester-epoxy resin coating is then fed to a lamination table 7 maintained at a uniform temperature. In addition, this laminated table 7 has a thickness of about 10~
The temperature can be adjusted to 93°C (50 to 200” F). The temperature at the lamination table 7 is approximately 38°C (100°F) to
Preferably, the temperature is maintained at 93°C (200'F). Gelation is started by the heat of the lamination table 7. In the method of the present invention, the moving speed of the first metal foil sheet A having the polyester/epoxy resin coating in the lamination table 7 is set to about 3 to 20 m/min (10 to 65 ft/min), particularly about 6 to about 11 m/min. (20 to 35 ft/min) is preferable.

Returning to FIG. 1 again, a second zinc-coated metal foil (hereinafter referred to as second Called metal foil B; second
(see figure) may be coated. Of course, the second metal foil B5, for example, the second copper foil, can be heated to promote adhesion, and the second metal foil B5 can also be supported by the cellophane sheet 21.

The key point in the method of the invention is the squeeze roll 9 at the point where the second metal foil B meets the partially gelled polyester epoxy resin.

The squeezing roll 9 is adjusted according to the final thickness of the laminate and ensures that the polyester-epoxy resin paddle is shaped at this position on the forming line. That is, the amount of polyester/epoxy resin specified by the doctor blade 5 at the start of the molding line is the same as the amount of polyester/epoxy resin specified by the squeezing roll 9 when using the second metal foil B.
More than the amount of epoxy resin. The polyester-epoxy resin paddle formed by the squeeze roll 9 is important. This is because when the second metal foil B comes into contact with the partially gelled polyester/epoxy resin film formed on the first metal foil A,
This is because this is the first contact with the second metal foil. If the second metal foil B is coated with a polyester/epoxy resin before contacting the second metal foil B with the polyester/epoxy resin film of the first metal foil A, the second metal foil B will cover the polyester/epoxy resin film of the first metal foil A. Heated to the temperature of polyester/epoxy resin. Therefore, according to this aspect of the invention, the second
Air bubbles and other defects that prevent the formation of a strong bond between the metal foil B and the partially gelled polyester epoxy resin are eliminated.

Of course, if a single-sided product containing metal foil on only one side of the polyester/epoxy resin film is desired, the second metal 'f3B
is omitted.

The above method can also be applied to form only a polyester epoxy material which is then bonded to one or more metal foils. The squeezing roll 9 applies pressure to the laminate to promote adhesion in both single-sided and double-sided products.

In this invention, the squeezing roll 9 has an overall diameter of about 0.0
25~0.318 cm (0,OlO~0.125 i
n, ), the squeezing roll 9 is approximately 0.152 to 0.318 cm overall.
(0,060 to 0.125 in, ).

Next, the laminate is cured by a multi-stage heat treatment.
The furnace zone No. 1 is set as follows.

(11 Preheat zone: approximately 120-175°C (250-350°F) to rapidly bring the laminate up to curing temperature.

(2) Gelation zone: approx. 38-175℃ (100-350℃)
temperature range (°F), temperature control in this zone must be carefully carried out to prevent runaway curing reactions.

(3) Exothermic zone: No heat is normally supplied since the curing resin reaches its maximum temperature in this zone.

(4) Finishing Zone To finish harden the two laminates, approx.
It has a temperature range of 50-260°C (300-500°F).

After curing, the laminate is edge trimmed to the desired width. If cellophane sheet 21 is used, it is removed from the laminate after curing.

Trimming is done by shearing. When shearing the single-sided copper-coated laminate into small blanks, the foil side is up, with the polyester-epoxy resin layer facing the shearing table. By shearing from the foil side in this manner, the possibility of peeling of the foil from the edges of the blank is reduced.

Next, the cut laminates are stacked to a weight of about 4,000 bonds, and this is introduced into the high frequency applicator 17.
(see diagram), about 5 minutes to 1 hour, about 1, ooo, ooo to 5
,000,000 cycles/second, human power up to about 200,000 watts, and a magnetic field voltage of about s,ooo to 50,000 volts RMS. Then, the temperature of the laminate will be approximately 90 to 230°C (2
00~450@F). Next, the laminate thus post-cured is automatically applied to the high-frequency applicator 1.
7 and automatically introduces another stack of laminates into the high frequency applicator 17. In FIG. 3, reference numeral 23 indicates a high-output high-frequency generator capacitively coupled to the work electrode 25 (high-voltage RF). Reference numeral 27 is an electrode on the installation side, and reference numeral 29 is a high frequency shield.

When the resin used in the system is completely cured, it generates a total of about 300 Joules of reaction heat per gram.

Continuously cured in a 4-stage hot air oven system, and heated to approximately 120-260℃ (
Laminates subjected to temperatures in the range of 250 to 500'F) exhibit approximately
It shows a residual cure in the range of 50 Joules. The stack of laminates is then heated to about 120-260°C (250-50°C) using high frequency electromagnetic energy in accordance with the present invention.
After curing by heating to a temperature of 0 DEG F., the finished product has a degree of cure of about 97-99%. This increases the peel adhesion strength of the laminate, improves the physical properties of the laminate, and improves the performance and processing properties of the laminate.

The method according to the invention does not contain a polyester component.
That is, it can also be used for layers or sheets made only of reinforced epoxy resin.

FIG. 2 is a diagram showing a laminate 20 manufactured by the method of the present invention. The one shown is a double-sided product and uses a cellophane support sheet 21. As mentioned above, after curing, the cellophane sheet 21 is removed from the laminate 20. The code 19 in the figure is a polyester reinforced with short glass fibers.
This is an epoxy resin layer.

The invention particularly relates to electrical circuit boards and E, M, I-RF, 1.
Useful for adhering zinc-coated copper foil to polyester-epoxy resin substrates to produce shielding materials;
It is contemplated that other metals may also be utilized in this invention. For low cost printed circuit boards, zinc coated copper foil is replaced with zinc coated aluminum foil in the present invention. For special purposes, zinc-coated silver or gold foil may be utilized, and for resistive circuits, zinc-coated tantalum or titanium may be utilized. In addition to electrical circuit boards and shielding materials, the method according to the invention can be used in the production of structural laminates, such as those obtained by bonding zinc-coated aluminum foil to a corrugated polyester epoxy resin substrate.

As used herein, electroplated zinc coatings contain about 500 to 1500 micrograms of zinc per square inch of coating.

Note that those skilled in the art should understand that various changes can be made without departing from the scope and spirit of the invention, and should be able to easily implement the same. Therefore,
It is intended that the scope of the present invention be encompassed by all claims of patentable novelty residing in the invention, including all features which can be treated as equivalent by those skilled in the art as set forth above.

<Effects of the Invention> As explained above, in the present invention, high-frequency heating is employed in the post-curing step when continuously manufacturing a laminate consisting of a specific metal foil layer and a specific resin layer.

This made it possible to increase the degree of curing of the resin layer to 97-99%.

Therefore, the peel adhesion strength, physical properties and processability of the laminate are improved.

Furthermore, the time required for post-curing is shortened to 1/1 of that of conventional methods.
It will be less than 10. This reduces the manufacturing cost of the laminate.

<Example> First Example Using the method shown in FIG. ) Create a double-sided electrical circuit board using 1 oz. Single-sided type electric circuit board and E,
M, I-R.

F.1. The same method is used to make the shielding material.AO, a polyester epoxy resin containing 1% by weight cellulose acetate butyrate, is manufactured by Alpha Corporation, Alpha Resins Division, Colley Beale, Tennessee, USA. (Alpha Polyester Resin 59-60101). 2 bonds of cumene hydroperoxide, 0.4 bonds of benzotrimethylammonium chloride and 0.1 pounds of 16
A catalyst system containing a wt% zinc solution (Zinc 16 brand by Tenneco Corporation) was applied to polyester 2
It is blended with 00 Bond.

The polyester resin, epoxy resin and other ingredients used are as follows.

84%...Polyester resin: Product name LER323 manufactured by Alpha Resin Division; (0-diclopentadiene (o
rtho-D, C, P) + styrene + 10% methyl methacrylate modified resin (MMAmodified R
e5in).

14%...Epoxy resin: Product name manufactured by Ciel Chemicals 9801 (70% 9850 Hardening agent 30%
).

Brominated flame retardant Nigerate Manufactured by Lake Chemical Company Product name 22 DE83°3P, H, R,...
Flame retardant resin: Antimony oxide 50P, H, R, ... Calcium sulfate: Product name C7628 woven glass (wo
glass).

3/4 oz...M-113 cut strand mat.

0.5P, H, R,...Glass-resin binder; trade name VTMOEO0 0,5P, H, R,...defoaming agent: trade name BYK-50
0゜0, I P, H, R, ... Zinc 16 (main part of catalyst system)
1, OP, H, R, -...z Suberox (Espe
rox) 28P, D, (heat-cured peroxide system).

The first copper foil is supported by a 174 gauge flat transparent cellophane sheet. A catalyst-containing polyester epoxy resin is injected onto the cuprous foil at a rate sufficient to form a puddle resulting in a -like coating. The doctor blade is set at 0.267 cm (0.105 in.). While moving at a linear speed of about 6.7 m/min (22 ft 7 min), a glass mat of 14% by weight based on the weight of the polyester epoxy resin is uniformly spread over the polyester epoxy resin layer. The laminated table is heated to 80℃ (
It is operated at a temperature of 175°F. The glass mat has a weight of 1.5 ounces per square foot (M113 glass mat).

The squeeze roll is 0.17ca+ (0,8111n,
), and the curing zone of the four-stage hot air stove system (heater 11) is set at 149°C (300°F) in the preheat zone and 121°C (250°F) in the gelation zone.
) and 204°C (40°C) in the finishing zone.
The wall thickness of the 0 single-sided product set at 0°F is 0.15 cm (0,059 in, ).

The partially gelled single-sided product was cut into 28 cm (11 inch) squares and stacked to weigh 14 kg (31 lb).
First, the partially gelled, single-sided product 26 is inserted between the working electrodes 25, 27 of a radio frequency applicator 17 that generates approximately 4,000 watts of energy at 90,000,000 cycles/second. The operating voltage is approximately 20,000 volts RMS. The results obtained are as follows.

Sample weight: 14kg (31,01 bond), large trunk size H
28cm x 28cm (11" x 1"), thickness: 1.27ca+ (0,50") starting temperature;
24°C (75°F) End temperature = 177°C (315° F) High frequency generator anode power ratio 2.8 to 5.3 kW High frequency generator anode power input 1.9 to 3.5 kW total Heating time = 15 minutes Sample temperature change: 10°F max. Degree of cure before RF heating: 94% (17 units/g, residual) Degree of cure after RF heating: 99% (1.6 units/g) g, residual) Peeling resistance before RF heating: 1.32 kg/cm (
Peel resistance after RF heating: 1.60 kg/c+a
(8.98 bonds/inch) Second Example: Partially gelled resin coated with second copper foil.

Repeat the method of the above example. The cupric foil is supported on a 48 gauge transparent cellophane support. The wall thickness of the double-sided product thus obtained was 0.176 cm (0.06
2 inches).

The partially gelled double-sided product was cut into 28 cn (11 inch) squares and stacked to weigh 14 kg (31 lb).
The partially gelled, single-sided product is then inserted between the working electrodes 15.27 of the radio frequency applicator 17, which generates approximately 4,000 watts of energy at 90,000,000 cycles/second.

The operating voltage is approximately 20,000 volts RMS. The results obtained are as follows.

Sample duplexity: 14 kg (31,000 t lbs), size: 28CIX 28C11 (11 in. : 177℃ (315''F) High frequency generator anode power output = 4.0~6.0 kW High frequency generator anode power 2.7~4.0 kW Total heating time: 12 minutes Sample temperature Change: up to 10° F Degree of cure before RF heating: 88.6% (34.3 units/g, residual) Degree of cure after RF heating: 97.4% (7,9 units/g)
g, residual) RF, peeling resistance before heating: 1.69 kg/cm
(9,44 bonds/inch) Peeling resistance after RF heating: 1.89 kg/cn+
(10,61 bonds/inch) When the above partially gelled product is post-cured in a hot air oven, it takes more than 12 hours to reach the post-curing temperature, and the temperature distribution of the product stack is 28°C. (over 50° F).

[Brief explanation of the drawing]

Fig. 1 is a schematic production line diagram showing the method for manufacturing the laminate of the present invention, Fig. 2 is a schematic cross-sectional view of the laminate of the present invention obtained by the method shown in Fig. 1, and Fig. 3 is a high-frequency post-curing A schematic explanatory diagram of an applicator. 17...High frequency applicator, 20...Double-sided laminate, 26...Laminated body of partially gelled resin and metal foil, A, B...Metal foil. Patent applicant: Glass Steel Industrial Laminates, Inc.

Claims (1)

[Claims] At least one zinc-coated metal foil and a glass fiber-reinforced polyester epoxy resin or epoxy resin are laminated, the resin is partially gelled, and if necessary, the resin is partially gelled. In the method for manufacturing a laminate, the partially gelled resin and the zinc-coated metal foil are directly bonded by pressurizing the partially gelled resin and the zinc-coated metal foil, and the post-curing is performed using high-frequency waves. A method for manufacturing a laminate, characterized in that the method is performed by heating.