JPH02214200A - Electronic part mounting device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting electronic components onto a circuit board.

Conventional technology An electronic component mounting device for mounting electronic components on a circuit board includes a component transport device that transports electronic components (for example, a tape feeder that feeds out a tape holding electronic components) and a component transport device that is mounted on the circuit board. A device having a component transport device support means for supporting the component transport device, and a suction device for picking up the electronic component at a predetermined pick point (suction position) on the component transport device support means and attaching it to a predetermined value 1 on the circuit board is conventional. Are known. The suction means is attached to a head movable in the X and Y directions. The head is driven based on information from a storage means that stores component holding position information on the circuit board and pick point position information.

The circuit board is placed on a guide provided on the board transport device. This guide consists of a movable guide on the side of the component transport device supporting means and a fixed guide on the opposite side, and the circuit board is placed between the movable guide and the fixed guide. The distance between the pick point and the substrate is determined to minimize the average takt.

When changing the circuit board to be used, the movable guide is moved in the Y direction according to the width of the circuit board, etc. At this time, from the viewpoint of average takt, the component transport device support means is also moved in the Y direction to adjust the pick point. Keep the distance between boards constant. Therefore, each time the type of board changes, the Y coordinate position of the pick point on the component transport device support means changes. Therefore, it is necessary to change the Y coordinate of the pick point position information in the storage means.

Problems to be Solved by the Invention Conventionally, this change was made by moving the head close to the pick point on the component conveying device, checking the pick point with the naked eye by moving the suction means up and down, and checking the saga of the head at that time. Based on this, change the Y coordinate of the pick point position information in the storage means, or confirm with the naked eye that the spot is located on the pick point using a light emitting element (for example, a teaching spot) installed in the head, and then The Y coordinate of the pick point position information in the storage means is changed based on the position of the head.

In addition, in order to facilitate visual confirmation, holes or marks are provided in the support means of the component conveying device, and the light emitting elements attached to the head can be moved up and down in the same way as described above by moving the suction means up and down. A method is also used in which the change in the position of the hole or mark is confirmed with the naked eye.

However, in either case, it is necessary for the operator to move the head and visually identify the pick points.

Therefore, the object of the first invention is to pick point it with the naked eye! To provide an electronic component mounting device capable of automatically changing pick point position information in a storage means without requiring verification work.

A second object of the invention is to provide an electronic component mounting device that can automatically adjust the circuit board transfer device when the adjustment width of the movable guide is known due to a change in the circuit board. It is in.

Means for Solving the Problems First invention showing an embodiment of the invention according to claim 1 (first invention)
To explain based on the drawings and FIG. 2, there is a component transport device support means that supports a component transport device that transports the electronic component 5 and is movable in the Y direction, and a head 20 that is movable in the XY directions.
a suction means 22 that is attached to and capable of suctioning the electronic component 5 at a pick point on the component transport device support means;
A storage means 40 for storing component mounting position information and pick point position information on the circuit board 1, and a structure provided at a predetermined position of the component transport device support means 9 to detect the position of the head 20 and issue a detection signal. means 14, a head drive control means 50 for driving the head until the side ratio signal is received after the component transport device support means 9 moves in the Y direction, and a head drive control means 50 for storing pick point position information in the storage means 40 based on the detection signal. This is an electronic component mounting apparatus characterized by comprising a changing means 45 for changing.

A first example showing an embodiment of the invention claimed in claim 2 (second invention)
To explain based on the drawings and FIG. 4, a board transport device 2 that has a fixed guide 3 and a movable guide 4 movable in the Y direction and transports a circuit board 1, and a component transport device that transports an electronic component 5 are used. a component conveyance device support means 9 that supports and is movable in the Y direction; and a suction means 22 that is attached to a head 20 that is movable in the XY force directions and that is capable of sucking the component 5 at a pick point on the component conveyance device support means 9. , a detection means 14 provided at a predetermined position of the component transport device support means 9 to detect the position of the head 20, and a movable guide until a signal from the detection means 14 is received after driving the head 20 by a predetermined distance in the Y direction. Drive control means 8 for driving 4 in the Y direction
0. This is an electronic component mounting device characterized by comprising:

In the first and second inventions, preferably the helad 2
0 is connected to a light emitting means 23, and the detecting means 14 is a light receiving means for detecting light from the light emitting means 23.

Operation When changing the circuit board of the first invention, the operator sweeps the mechanical drive mechanism to move the component transport device support means 9 in the Y direction. Then, when the start button on the sweeping plate is pressed, the head 20 is driven via the head drive control means 50. Detection means 14
The XY coordinates of (xk.

Yk), the head 20 is first driven in the X direction until the X coordinate reaches Xk, and then driven in the Y direction. When the head drive control means 50 receives the starting signal from the detection means 14, it reads the Y coordinate of the head position at that time, and
The change means 45 changes the position information of the pick point in the storage means 40.

The second invention operator presses the start button on the operation panel, and the drive control means 8
0. The head 20 is driven in the Y direction via the head driving means 60 by a distance corresponding to the width of the circuit board to be changed.

Next, the drive control means 80° movable guide drive means 61. Component conveyance device support means 9 via movable guide 42 member 12
is driven in the Y direction, and when light from the light emitting means 23 of the head 20 is detected by the detection means 14, the driving of the movable guide 4 is stopped.

EXAMPLE Hereinafter, an electronic component mounting apparatus of the present invention will be explained based on the drawings.

FIG. 1 is a front view showing the basic configuration of the present invention.

In the figure, 1 is a circuit board, which is transported on a board transport device 2 . The board transfer device 2 has a fixed guide 3 and a movable guide 4 movable in the Y direction, and the circuit board 1 is placed between the guides 3 and 4.

Reference numeral 5 denotes an electronic component (for example, a semiconductor chip component, a resistor component, or a capacitor component), which is inserted into the recess 7 of the tape 6. The tape 6 is fed out from a tape feeder (component transport device) t (not shown).

The tape and tape feeder are supported by tape feeder support means (
It is supported by component transport device support means) 9. This tape feeder support means 9 is supported on a rail 10 so as to be movable in the Y direction, and is movable integrally with the movable guide 4 via a member 12. At a predetermined position of the tape feeder support means 9, a detection means (for example, a light receiving means such as an optical sensor) 14 for detecting the position of the head 20 is provided.

Reference numeral 20 denotes a head movable in XY force directions, and this head 20 includes a suction means (nozzle) 22 and a light emitting means (for example, a chichiingespot) 23. Detecting the light from the light emitting means 23 by the optical sensor +j14 [
From this, the position of the head 20 is detected. A vacuum path is provided in the suction means 22, and the electronic component 5 is suctioned by vacuum pressure at a predetermined suction position (pick point) on the tape feeder support means 9, and the electronic component 5 is placed at a predetermined position on the circuit board 1. Load part 5.

The configuration described above based on FIG. 1 is the first invention and the second invention.
This is a configuration common to both inventions.

First invention FIG. 2 is a block diagram showing the functional configuration of the first invention. Reference numeral 40 denotes a storage means for storing component mounting position information and pick point position information on the circuit board 28. Based on the signal from this storage means 40, the head drive control means 50 of the CPU controls the head drive control means 50 via the head drive means 6o. 20 to XY
direction, and transports the suction means 22 that has suctioned the electronic component 5 to the desired position on the circuit board. 45 is the detection means 14
This is a changing means for changing the Y coordinate in the storage means 40 based on the head position coordinates at the time of receiving the blank start signal.

Next, the present invention will be explained in detail.

First, when changing the circuit board, an operator operates a drive mechanism (not shown) to move the movable guide 4 of the board transfer device 2 in the Y direction. As the movable guide 4 moves, the tape feeder support means 9 also moves via the member 12. Thereafter, the storage means 40 according to the steps shown in the flowchart of FIG.
Change the location storage information inside. That is, when a start button (not shown) on the operation panel 48 is pressed, the head 20h is activated via the head drive control means 50 and the head drive hand P5i 60.
f driven. Assuming that the XY coordinate position of the detection means 14 provided on the tape feeder support means 9 is (Xk, Yk), the head 20 is first driven in the X direction until the X coordinate reaches Xk, and then driven in the Y direction. (Step 70).

This driving of the head 20 in the Y direction continues at least until the head drive control means 50 receives the starting signal from the detecting means 14 (step 71), and when the starting signal is received, the Y coordinate of the head position is (step 72)
), the change means 45 changes the pick point position information in the storage means 40 (step 73).

Second invention FIG. 4 is a block diagram showing the functional configuration of the second invention. The drive control means 80 (, of the CPU) receives the signal from the detection means 14 and controls the head drive means 60 and the movable guide drive means 61. The head drive means 60 drives the head 20 in the XY direction, and the movable guide drive means Reference numeral 61 drives the movable guide 4 and the tape feeder support means 9 (component transport device support means) in the Y direction.The drive control means 80 includes a circuit board, similar to the head drive control means 50 of the first invention. A storage means 40 for storing component mounting position information and pick point position information on 1; and a changing means 45 for changing the Y coordinate of the pick point position information in the storage means 40 as the circuit board is changed. Connecting.

Next, the present invention will be explained in detail.

First, when the operator inputs the change distance of the pick point into the drive control means 80 according to the width of the circuit board to be changed using the setting means (button or knob) on the operation panel 48, the change distance is stored in the storage means via the change means 45. The Y coordinate position of the pick point position information is changed. Next, the operator presses the operation panel 48.
When the upper start button is pressed, the drive control means 80. The head 20 is driven in the Y direction by the distance set by the setting means via the head driving means 6o (steps 90, 91).

Next, drive control means 80. The movable guide drive means 619 moves the tape feeder support means 9 in the Y direction via the id 42 member 12 (step 92), and the detection means 14
When the light from the light emitting means 23 of the head 20 is detected (step 93), the driving of the movable guide 4 is stopped (
Step 94).

Effects of the Invention According to the first invention, it is possible to automatically change the Y coordinate in the stored coordinates, and there is no need for the operator to visually search for a pick point when changing the type of circuit board.

Further, according to the second invention, when changing the type of circuit board, the board transport device can be automatically adjusted.

[Brief explanation of the drawing]

FIG. 1 is a front view showing the main parts of the electronic component mounting apparatus of the present invention, FIG. 2 is a block diagram showing the functional configuration of the first invention, and FIG. 3 is a flowchart showing the operation of the first invention.
The fourth is a block diagram showing the functional configuration of the second invention, and the fifth is a block diagram showing the functional configuration of the second invention.
The figure is a flowchart showing the operation of the second invention. DESCRIPTION OF SYMBOLS 1... Circuit board, 2... Board transfer device, 3... Fixed guide, 4... Movable guide, 5... Electronic component, 9
... Parts conveyance device support means, 1O... Rail, 12
... member, 14... construction means, 20... head,
22... Adsorption means, 23... Light emitting means, 40...
Position information storage means, 45... Changing means, 50... Head drive control means, 60... Head drive means, 61.
. . . Movable guide drive means, 80 . . . Drive control means. Figure 1

Claims (3)

[Claims] (1) A component transport device support means that supports a component transport device that transports electronic components and is movable in the Y direction, and a predetermined pick on the component transport device support means that is attached to a head that is movable in the X and Y directions. a suction means capable of suctioning the component at the point; a storage means for storing component mounting position information on the circuit board and position information of the pick point;
a detection means provided at a predetermined position of the component transport device support means to detect the position of the head and generate a detection signal; An electronic component mounting apparatus comprising: a head drive control means for driving; and a changing means for changing position information of a pick point in the storage means based on the detection signal. (2) It has a fixed guide and a movable guide that can move in the Y direction, supports a board transport device that transports circuit boards, and a component transport device that transports electronic components, and is movable integrally with the board transport device. a component transport device support means; a suction device that is attached to a head movable in XY directions and capable of sucking the component at a pick point on the component transport device support means; and provided at a predetermined position of the component transport device support means. a detection means for detecting the position of the head; and a drive control means for driving the movable guide in the Y direction until receiving a signal from the detection means after driving the head by a predetermined distance in the Y direction. An electronic component mounting device comprising: (3) The electronic component mounting apparatus according to claim 1 or 2, wherein the head is provided with a light emitting means, and the detecting means is a light receiving means for detecting light from the light emitting means.