JPH0221470U - - Google Patents
Info
- Publication number
- JPH0221470U JPH0221470U JP9719088U JP9719088U JPH0221470U JP H0221470 U JPH0221470 U JP H0221470U JP 9719088 U JP9719088 U JP 9719088U JP 9719088 U JP9719088 U JP 9719088U JP H0221470 U JPH0221470 U JP H0221470U
- Authority
- JP
- Japan
- Prior art keywords
- bottom plate
- plate
- wick material
- heat
- heat absorbing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims 7
- 239000007788 liquid Substances 0.000 claims 4
- 239000006096 absorbing agent Substances 0.000 claims 3
- 230000005514 two-phase flow Effects 0.000 claims 3
- 230000008016 vaporization Effects 0.000 claims 3
- 238000010521 absorption reaction Methods 0.000 claims 2
- 238000009834 vaporization Methods 0.000 claims 2
- 238000005192 partition Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
Description
第1図は本考案のうち、第1の考案の一実施例
を示す断面図、第2図は第1図の―矢視図、
第3図は第1図の―矢視図、第4図は第1の
考案の二相流吸熱器と機器及び断熱材との圧下固
着を示す断面図、第5図は本考案のうち第2の考
案の一実施例を示す説明図、第6図は従来型の二
相流吸熱器を示す説明図、第7図は従来型の二相
流吸熱器と機器及び断熱材との圧下固着を示す断
面図、第8図は従来より考えられている宇宙基地
に設置した機器の冷却装置の回路図である。
図中、17は吸熱板、8は底板、19は容器、
21は液体流路、23は蒸気流路、24はウイツ
ク材、25は溝、26は浸透部、27は気化部、
29はウイツク材、35はウイツク材を示す。
Fig. 1 is a sectional view showing an embodiment of the first invention of the present invention, Fig. 2 is a view taken in the direction of - arrow in Fig. 1,
Fig. 3 is a view taken along the - arrow in Fig. 1, Fig. 4 is a sectional view showing how the two-phase flow heat absorber of the first invention is fixed to the equipment and the heat insulating material, and Fig. 5 is a view of the two-phase flow heat absorber of the first invention, and Fig. Fig. 6 is an explanatory drawing showing an example of the idea of 2, Fig. 6 is an explanatory drawing showing a conventional two-phase flow heat absorber, and Fig. 7 is an explanatory drawing showing a conventional two-phase flow heat absorber, equipment, and heat insulating material under pressure. FIG. 8 is a circuit diagram of a conventional cooling system for equipment installed at a space base. In the figure, 17 is a heat absorption plate, 8 is a bottom plate, 19 is a container,
21 is a liquid flow path, 23 is a vapor flow path, 24 is a wick material, 25 is a groove, 26 is a permeation part, 27 is a vaporization part,
29 represents wood, and 35 represents wood.
Claims (1)
と底板との周縁部間を密閉して平板状の容器を形
成し、該容器の内部に隔壁により周方向に延びる
液体流路を形成し、該液体流路の内側に容器中心
線と平行な方向に延びる蒸気流路を設け、前記液
体流路と蒸気流路との間の空間に棧状のウイツク
材を前記吸熱板と底板とに当接し得るよう所要数
挿入するとともに、所要の厚さを有するウイツク
材を前記棧状のウイツク材に当接し得るよう底板
に固着して浸透部と気化部とを形成し、該気化部
の頂部をなす前記吸熱板の下面に所要形状の複数
の溝を設け、前記液体流路と浸透部とを連通させ
、前記蒸気流路と気化部とを連通させたことを特
徴とする二相流吸熱器。 (2) 請求項1記載の二相流吸熱器において、気
化部の頂部をなす吸熱板の下面に所要形状の複数
の溝を設けることに代え、吸熱板の下面に所要の
厚さを有するウイツク材を固着し、該ウイツク材
の下面に棧状のウイツク材の頂部を当接させたこ
とを特徴とする二相流吸熱器。[Claims for Utility Model Registration] (1) A heat absorbing plate and a bottom plate are disposed in parallel, and the peripheral edges of the heat absorbing plate and the bottom plate are sealed to form a flat container, and the inside of the container is A liquid channel extending in the circumferential direction is formed by the partition wall, a vapor channel extending in a direction parallel to the center line of the container is provided inside the liquid channel, and a steam channel is provided in the space between the liquid channel and the vapor channel. Insert a required number of wicking materials having a shape such that they can come into contact with the heat absorption plate and the bottom plate, and fixing wicking materials having a required thickness to the bottom plate so that they can come into contact with the ridge-shaped wicking materials to form a permeation part. A plurality of grooves of a desired shape are provided on the lower surface of the heat absorption plate forming the top of the vaporization section, the liquid flow path and the permeation section are communicated, and the vapor flow path and the vaporization section are connected. A two-phase flow heat absorber characterized by being in communication with each other. (2) In the two-phase flow heat absorber according to claim 1, instead of providing a plurality of grooves of a desired shape on the lower surface of the heat absorbing plate forming the top of the vaporizing section, a wick having a required thickness is provided on the lower surface of the heat absorbing plate. A two-phase flow heat absorber characterized in that the top of the wick material is fixed to the wick material and the top of the wick material is brought into contact with the bottom surface of the wick material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988097190U JPH0612367Y2 (en) | 1988-07-22 | 1988-07-22 | Two-phase flow heat absorber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988097190U JPH0612367Y2 (en) | 1988-07-22 | 1988-07-22 | Two-phase flow heat absorber |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0221470U true JPH0221470U (en) | 1990-02-13 |
| JPH0612367Y2 JPH0612367Y2 (en) | 1994-03-30 |
Family
ID=31322455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988097190U Expired - Lifetime JPH0612367Y2 (en) | 1988-07-22 | 1988-07-22 | Two-phase flow heat absorber |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0612367Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6295467B1 (en) * | 2017-03-14 | 2018-03-28 | 北日本自動機装株式会社 | Liquid cooling device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49116647A (en) * | 1973-03-12 | 1974-11-07 | ||
| JPS6380472U (en) * | 1986-11-14 | 1988-05-27 |
-
1988
- 1988-07-22 JP JP1988097190U patent/JPH0612367Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49116647A (en) * | 1973-03-12 | 1974-11-07 | ||
| JPS6380472U (en) * | 1986-11-14 | 1988-05-27 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6295467B1 (en) * | 2017-03-14 | 2018-03-28 | 北日本自動機装株式会社 | Liquid cooling device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0612367Y2 (en) | 1994-03-30 |
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