JPH0221690A - Method of partially modifying ceramic surface - Google Patents

Abstract

PURPOSE:To simplify the manufacturing process while lowering the manufacturing cost by providing a glass glazed layer on the surface of a ceramics substrate and applying thermal energy beams to the glass glazed layer within a predetermined atmosphere for converting the irradiated region into a conductor so that the conductor is partially formed on the substrate. CONSTITUTION:Pb, B or Si glass paste is applied on the surface of the surface of a ceramic substrate 2 and baked to provide a glass glazed layer 3. The ceramic substrate 2 having the glass glazed layer 3 is held within a predetermined atmosphere so that it is partially modified. An apparatus therefor comprises a laser head 11 for radiating YAG or infrared laser light as thermal energy beams and a vacuum chamber provided with a window for transmitting the laser light. The glass glazed layer 3 is radiated with laser light while flow of N2 gas is supplied so as to prevent contamination of the atmosphere within the chamber 12 and while regulation is made so as to hold a partial pressure of oxygen within the vacuum chamber 12 at a desired value. A circuit board 1 having a conductor 4 formed partially can be obtained in this manner.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a method for partially modifying the surface of a ceramic, and more specifically, a method for partially modifying the surface of a ceramic and forming a partial conductor portion on the surface. Regarding how to get it.

(Prior Art) Conventionally, when manufacturing integrated circuits and the like, a conductive metal (for example, carbon
It is common to print, bake, or vapor-deposit a paste made of u, Δg) or oxide (Ru02, etc.) to form a circuit pattern or a resistance layer.

However, in the conventional manufacturing method for integrated circuits and the like as described above, steps such as printing, baking, or vapor deposition are essential, and there is a problem in that the steps are extremely cumbersome.

In addition, since expensive gold layer materials and oxide materials are used to form circuit patterns and resistance layers, it is difficult to create integrated circuits, etc. There is also the problem of rising J-build costs.

(Problems to be Solved by the Invention) As mentioned above, in the conventional method, the process of manufacturing integrated circuits etc. using a ceramic substrate is complicated, and the cost of products manufactured by this method is also high. There is.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a method for partially modifying the surface of ceramics, which is a simple process and can contribute to the production of low-cost integrated circuits.

[Structure of the Invention (Means for Solving the Problem) The method of the present invention includes a step of forming a glass glaze layer on the surface of a ceramic substrate, and applying thermal energy to the glass glaze layer formed by this step in a predetermined atmosphere. The process includes the step of irradiating the irradiated area with a wire to make the irradiated area a conductor to obtain a partial conductor part.

(Function) According to the above structure, the manufacturing process is simplified by eliminating the need for processes such as printing, baking, or vapor deposition, and the partial conductor can be obtained by modifying the glass glaze layer. It is possible to provide a method that does not require the use of materials and can reduce manufacturing costs.

<Example) Examples of the present invention will be described in detail below.

In general, when glass in which elements such as Pb, Si, B, and 0 are arranged in an amorphous manner (hereinafter referred to as "glass glaze") is irradiated with thermal energy rays such as infrared rays and laser beams, some parts of the irradiated area Dissociation of oxygen occurs, and a conductorization phenomenon occurs due to metallization of Pb, B, etc. or generation of oxygen vacancies, and the irradiated area becomes a partial conductor.

The method of this embodiment utilizes the above phenomenon, and a specific example thereof will be described below with reference to FIGS. 1 to 5.

FIG. 1 shows a circuit board 1 obtained by the method of this embodiment.

This circuit board 1 has, for example, a width W of 14 mm and a depth of D=
A ceramic substrate 2 with a thickness of 7 m and a thickness H = 2 mm, a glass glaze layer 3 formed on the surface (upper surface) of this ceramic substrate 2, and a partial conductor portion 4 formed on a part of this glass glaze layer 3. have. In addition, in Figure 1, 5
a, 5b are T, n-(3
This is an electrode part made of a alloy.

Next, the manufacturing process of the circuit board 1 will be explained.

First, manufacturing of the ceramic substrate 2 will be explained.

T! 02. △f! 203.8aT! (h.

Polyvinyl alcohol (
PVA) was appropriately added to make granules, which were then pressure molded. After that, respectively 1450℃ and 1600℃11350
Calcinate in the air for a stable time of °C, TlO2゜Al103
A sintered single plate of , BaTiO3, and SrTiO3, that is, a ceramic substrate 2 shown in FIG. 2 was obtained. The external dimensions of this ceramic substrate 2 are as follows.

Next, PB is applied to the surface of this ceramic substrate 2.

Apply S, S+ type glass paste and further 600°
A baking treatment is performed using C to form a glass glaze layer 3 as shown in FIG.

Next, the ceramic substrate 2 on which the crow glaze@3 has been formed is held in the atmosphere, and as shown in FIG. 4, the crow glaze layer 3 is partially modified by irradiation with natural energy rays. Alternatively, the ceramic substrate 2 on which the glass glaze layer 3 is formed is held in a predetermined atmosphere and this partial modification treatment is performed.

A device for this purpose is shown in FIG.

This device includes a laser head 11 that emits YAG laser light or infrared laser light as a thermal energy beam, and a vacuum chamber 12 provided with a window through which the laser light can pass. After suctioning the inside of this vacuum chamber 12 until the desired oxygen partial pressure is reached by a rotary pump and an oil diffusion pump, the exhaust system 13 is disconnected and the pressure is approximately 1.1 atm, which is slightly higher than atmospheric pressure. N2 gas is introduced so that the pressure becomes .

After this, while flowing N2 gas so as not to pollute the atmosphere inside the vacuum chamber 12, the flow rate from the N2 cylinder and the flow rate from the exhaust valve are adjusted so that the oxygen partial pressure inside the vacuum chamber 12 maintains the desired value. While adjusting the above, the glass glaze layer 3 was irradiated with laser light from the laser head 11 to obtain the circuit board 1 having the partial conductor portion 4 shown in FIG. 1.

Then, electrode parts 5a and 5b made of In-(3a alloy) were provided at both ends of the partial conductor part 4, and the resistance value of the partial conductor part 4 was measured using a four-terminal method resistance meter.The results are shown in Table 1. .

Table 1 In addition, the YAG laser is - brush writing type, pulse excitation type, Q
A switch with a switch frequency of 3KH7 was used.

As is clear from Table 1, the types of laser beams.

By adjusting the power and scanning speed and adjusting the atmosphere, the resistance value of the partial conductor section 4 can be set to various values, and the partial conductor section 4 of the circuit board can be used as a resistor or a conductor for a circuit pattern. becomes.

The atmosphere includes not only air and N2, but also Ar.

It has been confirmed that a resistor or conductor can also be formed using H2 or a mixture thereof.

Furthermore, the manufacturing process described above does not require processes such as printing, baking, or vapor deposition, so it can be much simpler than conventional methods. Furthermore, since the partial conductor portion 4 is necessarily formed by the glass glaze modification process shown in FIG. 3, metals and oxide materials are not required, thereby reducing the manufacturing cost of the product.

Table 2 shows that when forming the glass glaze layer 3 of the circuit board 1 described above, a PB, B, Sr based glass paste with 20 wt% of i02 powder dispersed therein was applied to the ceramic substrate 2 and It is necessary to show the experimental results when sintered with carbon.

(Margins below) Table 2 As is clear from Table 2, T!
By using a material mixed with 02, it is possible to obtain a partial conductor portion 4 having a wider range of resistance values.

FIG. 6 shows an application example of the method of this embodiment, in which a glass glaze layer 3A made of the same material as the glass glaze layer 3 is placed on the surface of a ceramic substrate 2A having a larger shape than the Viramix substrate 2. is formed, and a continuous crank-shaped partial conductor portion 5 is obtained by irradiating the glass glaze layer 3A with a laser beam under the same conditions as described above. By adjusting the light irradiation conditions and changing the line width and length of the partial conductor portion 5, partial conductor portions 5 having various resistance values can be obtained, and the circuit board 1△ with a wide range of applications can be obtained. can be manufactured.

The present invention is not limited to the embodiments described above, and various modifications can be made within the scope of the invention. For example, not only thermal energy rays but also laser beams can be used.
, C02. It can also be carried out using infrared light.

[Effects of the Invention] According to the above-mentioned group (e), the partial conductor portion can be obtained through the step of forming a glass glaze layer on the ceramic substrate and the step of irradiating laser light in a predetermined atmosphere, so that the manufacturing process is simplified. It is possible to provide a method for partially modifying the surface of ceramics that simplifies the process and can contribute to the production of low-cost integrated circuits and the like.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an example of a circuit board obtained by an example of the present invention, FIGS. 2 to 4 are perspective views showing the manufacturing process of the example method, and FIG. FIG. 6 is a perspective view showing an example of application of the method of the embodiment. 2... Ceramic substrate, 3... Glass glaze layer, 4... Partial conductor section.

Claims (2)

[Claims] (1) A step of forming a glass glaze layer on the surface of a ceramic substrate, and irradiating the glass glaze layer formed by this step with thermal energy rays in a predetermined atmosphere to obtain a partial conductor portion in which the irradiated area is made conductive. A method for partially modifying a ceramic surface, comprising the steps of: (2) The predetermined atmosphere is Ar, N_2, H_2,
2. The method for partially modifying a ceramic surface according to claim 1, wherein the atmosphere is selected from vacuum or air, or any combination thereof.