JPH0222321A - Resin compound for sealing - Google Patents
Resin compound for sealingInfo
- Publication number
- JPH0222321A JPH0222321A JP17184488A JP17184488A JPH0222321A JP H0222321 A JPH0222321 A JP H0222321A JP 17184488 A JP17184488 A JP 17184488A JP 17184488 A JP17184488 A JP 17184488A JP H0222321 A JPH0222321 A JP H0222321A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- inorganic filler
- coupling agent
- epoxy resin
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 title claims description 10
- 229920005989 resin Polymers 0.000 title description 10
- 239000011347 resin Substances 0.000 title description 10
- 150000001875 compounds Chemical class 0.000 title 1
- 239000011256 inorganic filler Substances 0.000 claims abstract description 17
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 17
- 239000007822 coupling agent Substances 0.000 claims abstract description 15
- 239000003822 epoxy resin Substances 0.000 claims abstract description 14
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 14
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims abstract description 4
- -1 glycidyloxy Chemical group 0.000 claims abstract description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 4
- 239000011342 resin composition Substances 0.000 claims description 16
- 239000010680 novolac-type phenolic resin Substances 0.000 claims description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 5
- 125000003277 amino group Chemical group 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 2
- 229920003986 novolac Polymers 0.000 abstract description 11
- 239000005011 phenolic resin Substances 0.000 abstract description 11
- 239000000203 mixture Substances 0.000 abstract description 9
- 229910000679 solder Inorganic materials 0.000 abstract description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 7
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 4
- 229920001568 phenolic resin Polymers 0.000 abstract description 4
- 239000000843 powder Substances 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 4
- 125000003700 epoxy group Chemical group 0.000 abstract description 3
- 239000000377 silicon dioxide Substances 0.000 abstract description 3
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 abstract 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 abstract 1
- 239000012778 molding material Substances 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000006087 Silane Coupling Agent Substances 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000001993 wax Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- QEZIKGQWAWNWIR-UHFFFAOYSA-N antimony(3+) antimony(5+) oxygen(2-) Chemical compound [O--].[O--].[O--].[O--].[Sb+3].[Sb+5] QEZIKGQWAWNWIR-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical class [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- CAYGQBVSOZLICD-UHFFFAOYSA-N hexabromobenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1Br CAYGQBVSOZLICD-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 125000005371 silicon functional group Chemical group 0.000 description 1
- 125000005480 straight-chain fatty acid group Chemical class 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Sealing Material Composition (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、耐湿性、半田耐熱性に優れた電子・電気部品
等の封止用樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a resin composition for sealing electronic/electrical parts, etc., which has excellent moisture resistance and soldering heat resistance.
（従来の技術）
近年、半導体集積回路の分野において、高集積化、高信
頼性化の技術開発と同時に、半導体装置の実装工程の自
動化が推進されている。 例えばフラットパッケージ型
の半導体装置を回路基板に取り付ける場合、従来はリー
ドビン毎に半田付けを行っていたが、最近は、半導体装
置全体を２５０℃以上に加熱した半田浴に浸漬して、半
田付けを行う方法が採用されている。(Prior Art) In recent years, in the field of semiconductor integrated circuits, along with technological developments for higher integration and higher reliability, automation of semiconductor device mounting processes has been promoted. For example, when attaching a flat package type semiconductor device to a circuit board, soldering was traditionally done for each lead bin, but recently the entire semiconductor device is immersed in a solder bath heated to 250°C or higher. The method is adopted.
（発明が解決しようとする課題）
従来のエポキシ樹脂、ノボラック型フェノール樹脂およ
び無機質充填剤からなる樹脂組成物で封止した半導体装
置では、装置全体の半田浴浸漬を行うと耐湿性が低下す
るという欠点があった。(Problems to be Solved by the Invention) It has been reported that in semiconductor devices sealed with conventional resin compositions consisting of epoxy resin, novolak type phenolic resin, and inorganic filler, the moisture resistance decreases when the entire device is immersed in a solder bath. There were drawbacks.
特に吸湿した半導体装置を半田浸漬すると封止樹脂中の
無機質充填剤と樹脂との界面にｙｌｉｌＩｌを生じ、著
しい耐湿劣化をおこし、電極の腐食による断線、リーク
電流を生じ、長期間の信頼性を保証することができない
という欠点がある。In particular, when a semiconductor device that has absorbed moisture is immersed in solder, ylilIl is generated at the interface between the inorganic filler in the sealing resin and the resin, causing a significant deterioration of moisture resistance, causing wire breakage and leakage current due to electrode corrosion, and reducing long-term reliability. The drawback is that it cannot be guaranteed.
ところで一般に、有機・無機複合系からなる材料の改質
、すなわち機械的強度の向上、耐水性の向上および浸水
後の電気的特性の改筈にシランカップリング剤を使用す
ることは公知であり、半導体装置の封止用樹脂組成物に
もそれが使用されている。 しかし、従来の封止用樹脂
組成物に使用されるシランカッ１リング剤は、炭素官能
性基とケイ素官能性基とが脂肪族骨格によって結ばれた
ものであり、前記欠点をもつ封止用樹脂組成物は、かか
るシランカップリング剤が使用されれなものであった。By the way, it is generally known that silane coupling agents are used to modify materials consisting of organic-inorganic composite systems, that is, to improve mechanical strength, improve water resistance, and modify electrical properties after immersion in water. It is also used in resin compositions for sealing semiconductor devices. However, the silane cutting agent used in conventional encapsulating resin compositions has a carbon functional group and a silicon functional group connected by an aliphatic skeleton, and thus silane cutting agents used in conventional encapsulating resin compositions have the above-mentioned drawbacks. The composition used such a silane coupling agent.
本発明は、上記の欠点を解消するためになされたもので
、半田浴浸漬後の耐湿性および半田耐熱性に優れた、界
面の剥離や、腐食による断線等がなく長期間の信頼性に
耐え得る封止用樹脂組成物を提供しようとするものであ
る。The present invention was made to eliminate the above-mentioned drawbacks, and has excellent moisture resistance and soldering heat resistance after immersion in a solder bath, and has long-term reliability without peeling at the interface or disconnection due to corrosion. The present invention aims to provide a sealing resin composition that can be obtained.
［発明の構成］
（課題を解決するための手段）
本発明者は、上記の目的を達成しようと鋭意研究を重ね
た結果、封止用樹脂の成分である＊！機質充填剤を芳香
族骨格をもつ耐熱性の良いカップリング剤で処理すれば
耐湿性および半田耐熱性のよい樹脂組成物が得られるこ
とを見いだし、本発明を完成したものである。[Structure of the Invention] (Means for Solving the Problems) As a result of intensive research to achieve the above object, the present inventor has discovered that *! The present invention was completed based on the discovery that a resin composition with good moisture resistance and soldering heat resistance can be obtained by treating a structural filler with a coupling agent having an aromatic skeleton and good heat resistance.
すなわち、本発明は、
（Ａ）エポキシ樹脂
（Ｂ）ノボラック型フェノール樹脂
（Ｃ）次の一般式で示されるカップリング剤（但し、式
中、Ｒ’はアミノ基、水酸基又はグリシジルオキシ基を
、Ｒ２はメチル基又はエチル基を、ｎは０．１又は２の
整数を、それぞれ表す）（Ｄ）無機質充填剤
を必須成分とし、全体の樹脂組成物に対して前記（Ｄ）
無機質充填剤を２５〜９０重量％含有することを特徴と
する封止用樹脂組成物である。That is, the present invention provides (A) an epoxy resin, (B) a novolac type phenolic resin, and (C) a coupling agent represented by the following general formula (wherein, R' is an amino group, a hydroxyl group, or a glycidyloxy group, (R2 represents a methyl group or an ethyl group, n represents an integer of 0.1 or 2, respectively) (D) an inorganic filler is an essential component, and the above (D) is added to the entire resin composition.
This is a sealing resin composition characterized by containing 25 to 90% by weight of an inorganic filler.
本発明に用いる（Ａ）エポキシ樹脂としては、その分子
中にエポキシ基を少なくとも２個有するものである限り
、分子構造、分子量など特に制限はなく、一般に封止用
材料に使用されているものを広く包含することができる
。 例えばビスフェノール型の芳香族系、シクロヘキサ
ン誘導体等の脂環族系、さらに次の一般式で示されるエ
ポキシノボラック系等の樹脂が挙げられる。The epoxy resin (A) used in the present invention is not particularly limited in terms of molecular structure and molecular weight as long as it has at least two epoxy groups in its molecule. Can be broadly encompassed. Examples include aromatic resins such as bisphenol type, alicyclic resins such as cyclohexane derivatives, and epoxy novolak resins represented by the following general formula.
（但し、式中Ｒ１は水素原子、ハロゲン原子又はアルキ
ル基を、Ｒ２は水素原子又はアルキル基を、ｎは１以上
の整数を表す）
これらのエポキシ樹脂は唯独又は２種以上混合して使用
することができる。(However, in the formula, R1 represents a hydrogen atom, a halogen atom, or an alkyl group, R2 represents a hydrogen atom or an alkyl group, and n represents an integer of 1 or more.) These epoxy resins may be used alone or in combination of two or more. can do.
本発明に用いる（Ｂ）ノボラック型フェノール樹脂とし
ては、フェノール、アルキルフェノール等のフェノール
類とホルムアルデヒドあるいはパラホルムアルデヒドを
反応させて得られるノボラック型フェノール樹脂および
これらの変性樹脂、例えばエポキシ化もしくはブチル化
ノボラック型フェノール樹脂等が挙げられ、これらの樹
脂は単独もしくは２種以上の混合系として用いることが
できる。 ノボラック型フェノール樹脂の配合割合は、
前述した（Ａ＞エポキシ樹脂のエポキシ基（ａ ）と（
Ｂ）ノボラック型フェノール樹脂のフェノール性水酸基
（ｂ ）との当量比［（ａ）／（ｂ）］が０，１〜１０
の範囲内であることが望ましい、 当量比が０．１未満
もしくは１０を超えると、耐湿性、成形作業性および硬
化物の電気特性が悪くなり、いずれの場合も好ましくな
い、 従って上記の範囲内に限定するのが好ましい。The (B) novolak type phenolic resin used in the present invention includes novolak type phenol resins obtained by reacting phenols such as phenol and alkylphenols with formaldehyde or paraformaldehyde, and modified resins thereof, such as epoxidized or butylated novolak types. Examples include phenol resins, and these resins can be used alone or as a mixture of two or more. The blending ratio of novolac type phenolic resin is
The above-mentioned (A>epoxy group of epoxy resin (a) and (
B) The equivalent ratio [(a)/(b)] of the novolac type phenolic resin to the phenolic hydroxyl group (b) is 0.1 to 10.
If the equivalent ratio is less than 0.1 or more than 10, the moisture resistance, molding workability, and electrical properties of the cured product will deteriorate, which is undesirable in any case. It is preferable to limit it to .
本発明に用いる（Ｃ）カップリング剤としては次の一般
式を有する耐熱性の良いものである。The coupling agent (C) used in the present invention has the following general formula and has good heat resistance.
（但し、式中、Ｒ１はアミノ基、水酸基又はグリシジル
オキシ基を、Ｒ２はメチル基又はエチル基を、ｎは０．
１又は２の整数を、それぞれ表す）エポキシ樹脂にはア
ミノ基あるいは水酸基が結合し、ノボラック型フェノー
ル樹脂にはグリシジル基が結合することが確認されてい
るが、エポキシ樹脂又はフェノール樹脂と結合するその
池の官能性基であってもよいことは勿論である。 これ
らは単独もしくは２種以上混合して使用することができ
る。(However, in the formula, R1 is an amino group, a hydroxyl group, or a glycidyloxy group, R2 is a methyl group or an ethyl group, and n is 0.
It has been confirmed that amino groups or hydroxyl groups (representing integers of 1 or 2, respectively) are bonded to epoxy resins, and that glycidyl groups are bonded to novolac-type phenolic resins. Of course, it may also be a functional group. These can be used alone or in combination of two or more.
カップリング剤を配合する方法としては、無機質充填を
予しめカップリング剤で処理配合する方法、或いはエポ
キシ樹脂もしくはノボラック型フェノール樹脂中にカッ
プリング剤を溶解しておき、そこに無機質充填剤を混合
する方法等があり、そのいずれでもよい、 カップリン
グ剤の添加量は無機質充填剤の表面積から適切に計算さ
れる。The method of blending the coupling agent is to process and blend the inorganic filler with the coupling agent in advance, or to dissolve the coupling agent in epoxy resin or novolac type phenol resin and mix the inorganic filler there. There are several methods to do this, and any of these methods may be used.The amount of the coupling agent to be added is appropriately calculated from the surface area of the inorganic filler.
本発明に用いる（Ｄ＞無機質充填剤としては、シリカ粉
末、アルミナ、三酸化アンチモン、タルク、炭酸カルシ
ウム、チタンホワイト、クレーマイカ、ベンガラ、ガラ
ス繊維、炭素繊維等が挙げられ、これらは単独もしくは
２種以上の混合系として用いる。 これらのなかでも特
にシリカ粉末が好ましく使用できる。 無機質充填剤の
配合割合は、全体の樹脂組成物に対して２５〜９０重量
％の範囲で含有することが好ましい、 その割合が２５
重１％未溝では耐湿性、耐熱性、機械的特性および成形
性に効果なく、また９０重量％を超えるとカサバリが大
きくなり、成形性が悪く実用に適さない。Examples of inorganic fillers used in the present invention (D> Used as a mixture of the above. Among these, silica powder is particularly preferably used. The blending ratio of the inorganic filler is preferably in the range of 25 to 90% by weight based on the entire resin composition. The percentage is 25
If the weight is 1% without grooves, it has no effect on moisture resistance, heat resistance, mechanical properties, or moldability, and if it exceeds 90% by weight, the coverage becomes large and the moldability is poor, making it unsuitable for practical use.
本発明の封止用樹脂組成物は、エポキシ樹脂、ノボラッ
ク型フェノール樹脂、カップリング剤および無機質充填
剤を必須成分とするが、本発明の目的に反しない限度に
おいて、必要に°応じて、天然ワックス類、合成ワック
ス類、直鎖脂肪酸の金属塩、酸アミド、エステル類、パ
ラフィン類などの離型剤、塩素化パラフィン、ブロムｊ
・ルエン、ヘキサブロムベンゼン、二酸化アンチモンな
どの難燃剤、カーボンブラック、ベンガラなどの着色剤
、シランカップリング剤、種々の硬化促進剤等を適宜添
加配合することができる。The encapsulating resin composition of the present invention contains an epoxy resin, a novolac type phenolic resin, a coupling agent, and an inorganic filler as essential components, but as necessary, natural Waxes, synthetic waxes, metal salts of straight chain fatty acids, acid amides, esters, release agents such as paraffins, chlorinated paraffins, bromine
-Flame retardants such as luene, hexabromobenzene and antimony dioxide, colorants such as carbon black and red iron oxide, silane coupling agents, various curing accelerators, etc. can be appropriately added and blended.
本発明の封止用樹脂組成物を成形材料として製造する場
合の一般的な方法は、エポキシ樹脂、ノボラック型フェ
ノール樹脂、カップリング剤で表面処理した無機質充填
剤、その他の原料成分を所定の組成比に選択し、ミキサ
ー等によって十分均一に混合した後、更に熱ロールによ
る溶融混合処理、またはニーダ等による混合処理を行い
、次いで冷却固化させ適当な大きさに粉砕して成形材料
とすることができる。 こうして得られた成形材料は、
電子部品或いは電気部品の封止用として、また、被覆、
絶縁等に適用することができる。A general method for producing the encapsulating resin composition of the present invention as a molding material is to mix an epoxy resin, a novolak phenol resin, an inorganic filler surface-treated with a coupling agent, and other raw materials into a predetermined composition. After mixing thoroughly and uniformly using a mixer, etc., it is further melt-mixed using a hot roll or mixed using a kneader, etc., and then cooled and solidified and ground into an appropriate size to form a molding material. can. The molding material thus obtained is
For sealing electronic or electrical parts, coating,
It can be applied to insulation, etc.
（作用）
本発明の封止用樹脂組成物は、特定のカップリング剤を
用いることによって、！！機雪質充填剤表面が耐熱性の
よいカップリング剤で被覆されるために、半田浴に浸漬
しても封止樹脂すなわちエポキシ樹脂やフェノール樹脂
との界面に剥離を生じることがなくなる。 その結果、
外部から水の浸入ができにくくなる。 また、無機質充
填剤からの塩素イオンやすｉ・リウムイオンなどの不純
物イオンの流出が抑制され、半田浸漬後においても耐湿
性の劣化が少なくなる。(Function) The sealing resin composition of the present invention can be obtained by using a specific coupling agent! ! Since the surface of the snow filler is coated with a coupling agent having good heat resistance, peeling does not occur at the interface with the sealing resin, ie, the epoxy resin or the phenol resin, even if it is immersed in a solder bath. the result,
It becomes difficult for water to enter from the outside. Further, the outflow of impurity ions such as chloride ions and i.lium ions from the inorganic filler is suppressed, and deterioration of moisture resistance is reduced even after immersion in solder.
（実施例）
次に本発明を実施例によって具体的に説明するが、本発
明は実施例に限定されるものではない。(Example) Next, the present invention will be specifically explained with reference to Examples, but the present invention is not limited to the Examples.
以下の実施例および比較例において、「％」とあるのは
「重量％」を意味する。In the following Examples and Comparative Examples, "%" means "% by weight".
実施例
クレゾールノボラックエポキシ樹脂（エポキシ当量２１
５） １８％に、ノボラック型フェノール樹脂（フェノ
ール当量１Ｇ？＞ ９％、次式で示されるカップリン
グ剤０．４％、
溶融シリカ粉末７２％、硬化促進剤０．３％、エステル
系ワックス０．３％を常温で混合し、更に９０＝ ９５
℃で混練して冷却した後、粉砕して成形材料（Ａ）を製
造した。Example Cresol novolac epoxy resin (epoxy equivalent weight 21
5) 18%, novolac type phenol resin (phenol equivalent 1G? > 9%, coupling agent shown by the following formula 0.4%, fused silica powder 72%, curing accelerator 0.3%, ester wax 0 .3% mixed at room temperature and further 90=95
After kneading and cooling at °C, the mixture was pulverized to produce a molding material (A).
比較例
クレゾールノボラックエポキシ樹脂（エポキシ当量２１
５） １９％に、ノボラック型フェノール樹脂（フェノ
ール当ｊ１１０７） ９％、シリカ粉末７１％、硬化
促進剤０．３％、エステル系ワックス０．３％および次
の構造で示されるシランカップリング剤０．４％、
第１表
（単位）
を実施例と同様にして成形材料（Ｂ）を製造した。Comparative example Cresol novolac epoxy resin (epoxy equivalent: 21
5) 19%, 9% novolac type phenol resin (phenol per j1107), 71% silica powder, 0.3% curing accelerator, 0.3% ester wax, and 0 silane coupling agent represented by the following structure. .4%, Table 1 (unit) A molding material (B) was produced in the same manner as in the examples.
実施例および比較例で得られた成形材料（Ａ）〜（Ｂ）
を用いて、１７０℃に加熱した金型内にトランスファー
注入し、硬化させて封止した成形品を得た。 この成形
品について耐湿性の試験を行い結果を得たので第１表に
示したが、本発明の顕著な効果が確認された。Molding materials (A) to (B) obtained in Examples and Comparative Examples
The molded product was transferred and injected into a mold heated to 170° C. and cured to obtain a sealed molded product. A moisture resistance test was conducted on this molded article, and the results are shown in Table 1, and the remarkable effects of the present invention were confirmed.
＊： 試料の成形材料を用いて、２本以上のアルミニウ
ム配線を有するシリコン製チップを通常の４２アロイフ
レームに接着し、１７５℃で２分間トランスファー成形
して、５Ｘ ＩＯＸ １．５Ｉｌｌのフラットパッケー
ジ型成形品を得、その後１１５℃で８時間後硬化を行っ
た。 この成形品を予しめ４０℃１９０％ＲＨ，１００
時間の吸湿処理をした後、２５０℃の半田浴に１０秒間
浸漬した。 その後１２７℃、２．５気圧の飽和水蒸気
中でプレッシャークツカーテストを行い、アルミニウム
の配線の腐食による断線を不良として評価した。*: Using the sample molding material, a silicon chip with two or more aluminum wirings was bonded to a regular 42 alloy frame, transfer molded at 175°C for 2 minutes, and molded into a 5X IOX 1.5Ill flat package mold. A molded article was obtained and then post-cured at 115° C. for 8 hours. This molded product is heated at 40℃, 190%RH, 100℃ in advance.
After being subjected to moisture absorption treatment for a period of time, it was immersed in a 250°C solder bath for 10 seconds. Thereafter, a pressure puller test was conducted in saturated steam at 127° C. and 2.5 atm, and disconnections due to corrosion of the aluminum wiring were evaluated as defects.
［発明の効果］
以」二の説明および第１表から明らかなように、本発明
の封止用樹脂組成物は、樹脂と無機質充填剤との界面に
剥離か生じないために耐湿性に優れ、半田浴に浸漬した
後でも耐湿性劣化が少なく、腐食による断線やリーク電
流の発生などがなく、しかも、長期間に渡って信頼性を
保証することが可能となったものである。[Effects of the Invention] As is clear from the following explanation and Table 1, the encapsulating resin composition of the present invention has excellent moisture resistance because no peeling occurs at the interface between the resin and the inorganic filler. Even after being immersed in a solder bath, there is little deterioration in moisture resistance, there is no disconnection due to corrosion, there is no leakage current, and it is possible to guarantee reliability over a long period of time.
特許出願人 東芝ケミカル株式会社Patent applicant: Toshiba Chemical Corporation
Claims (1)
ルオキシ基を、Ｒ＾２はメチル基又はエチル基を、ｎは
０、１又は２の整数 を、それぞれ表す） （Ｄ）無機質充填剤 を必須成分とし、全体の樹脂組成物に対して前記（Ｄ）
無機質充填剤を２５〜９０重量％含有することを特徴と
する封止用樹脂組成物。[Scope of Claims] 1 (A) Epoxy resin (B) Novolac type phenolic resin (C) Coupling agent represented by the following general formula ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (However, in the formula, R^ 1 represents an amino group, a hydroxyl group, or a glycidyloxy group, R^2 represents a methyl group or an ethyl group, and n represents an integer of 0, 1, or 2.) (D) An inorganic filler is an essential component, and the total (D) for the resin composition
A sealing resin composition containing 25 to 90% by weight of an inorganic filler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17184488A JP2660999B2 (en) | 1988-07-12 | 1988-07-12 | Resin composition for sealing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17184488A JP2660999B2 (en) | 1988-07-12 | 1988-07-12 | Resin composition for sealing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0222321A true JPH0222321A (en) | 1990-01-25 |
| JP2660999B2 JP2660999B2 (en) | 1997-10-08 |
Family
ID=15930817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17184488A Expired - Fee Related JP2660999B2 (en) | 1988-07-12 | 1988-07-12 | Resin composition for sealing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2660999B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5882088A (en) * | 1996-01-26 | 1999-03-16 | Shimano, Inc. | Bicycle hub |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100532490C (en) * | 2005-08-05 | 2009-08-26 | 比亚迪股份有限公司 | Encapsulation material and preparation method thereof |
-
1988
- 1988-07-12 JP JP17184488A patent/JP2660999B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5882088A (en) * | 1996-01-26 | 1999-03-16 | Shimano, Inc. | Bicycle hub |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2660999B2 (en) | 1997-10-08 |
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