JPH0223036B2 - - Google Patents
Info
- Publication number
- JPH0223036B2 JPH0223036B2 JP56149450A JP14945081A JPH0223036B2 JP H0223036 B2 JPH0223036 B2 JP H0223036B2 JP 56149450 A JP56149450 A JP 56149450A JP 14945081 A JP14945081 A JP 14945081A JP H0223036 B2 JPH0223036 B2 JP H0223036B2
- Authority
- JP
- Japan
- Prior art keywords
- magnetoresistive element
- wiring board
- flexible wiring
- magnetic
- magnetoresistive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
Landscapes
- Measuring Magnetic Variables (AREA)
- Hall/Mr Elements (AREA)
Description
【発明の詳細な説明】
本発明は磁気検出センサ装置、特に磁気抵抗効
果を有する磁気抵抗素子の外部接続用配線の構造
に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a magnetic detection sensor device, and particularly to a structure of wiring for external connection of a magnetoresistive element having a magnetoresistive effect.
従来より提案されている磁気検出素子を利用し
た磁気検出センサ装置は、例えば第1図に要部断
面図を示すように非磁性体基板1上に被着形成さ
れた磁気抵抗効果を有する磁気抵抗素子2が例え
ば歯車、磁石などの被検出磁性体3の回転数等を
バイアス用磁石4の磁束の変化により測定する構
造を有している。しかしながら、上記構造の場
合、磁気抵抗素子2からの外部接続用リード5は
途中に金線などのボンデイングワイヤ6を用いて
おり、パツケージングのため、非磁性体金属から
なるケース7とキヤツプ8とを接着し、例えばエ
ポキシ系樹脂9で樹脂モールドを行なつた場合、
少々の熱膨張差によりボンデイングワイヤ6を切
断させたり、ボンデイングワイヤ6の弛みにより
キヤツプ8と接触したり、またワイヤボンデイン
グを行なつているため、キヤツプ8の表面から磁
気抵抗素子2の表面までの距離dが長くなり被検
出磁性体3から磁気抵抗素子2の平面までの距離
が長くなつてしまい磁気抵抗素子2の感度を低下
させるなど種々の欠点があつた。 A magnetic detection sensor device using a magnetic detection element that has been proposed in the past includes, for example, a magnetoresistive device having a magnetoresistive effect formed on a non-magnetic substrate 1, as shown in FIG. The element 2 has a structure that measures the rotational speed of a magnetic body 3 to be detected, such as a gear or a magnet, by changing the magnetic flux of a bias magnet 4. However, in the case of the above structure, the external connection lead 5 from the magnetoresistive element 2 uses a bonding wire 6 such as a gold wire in the middle, and for packaging, the case 7 and cap 8 made of non-magnetic metal are connected. If you glue and mold with epoxy resin 9, for example,
The bonding wire 6 may be cut due to a slight difference in thermal expansion, the bonding wire 6 may come into contact with the cap 8 due to slackness, and since wire bonding is performed, the bonding wire 6 may be disconnected from the surface of the cap 8 to the surface of the magnetoresistive element 2. As the distance d becomes longer, the distance from the magnetic body 3 to be detected to the plane of the magnetoresistive element 2 becomes longer, resulting in various drawbacks such as a decrease in the sensitivity of the magnetoresistive element 2.
したがつて本発明は、磁気抵抗素子からの外部
接続用配線の少なくとも一部を、フレキシブル配
線板で引き出すことによつて、高感度でかつ信頼
性の高い磁気検出センサ装置を提供することを目
的としている。以下図面を用いて本発明の実施例
を詳細に説明する。 Therefore, an object of the present invention is to provide a highly sensitive and reliable magnetic detection sensor device by drawing out at least a part of the external connection wiring from the magnetoresistive element using a flexible wiring board. It is said that Embodiments of the present invention will be described in detail below with reference to the drawings.
第2図は本発明による磁気検出センサ装置の一
例を示す第1図に相当する要部断面図であり、第
1図と同記号は同一要素となるのでその説明は省
略する。第2図において、磁気抵抗素子2の図示
しないボンデイングパツド部にはポリイミド系の
フレキシブル配線板10の一端が電気的に接続さ
れかつその他端側は外部接続用リード5にリセク
タブル11を介して電気的に接続されている。こ
の場合、磁気抵抗素子2とフレキシブル配線板1
0との接続は熱圧着、半田付けなどの手段により
容易にできる。そして、磁気抵抗素子2はキヤツ
プ8の内面側にフレキシブル配線板10を介して
エポキシ系樹脂9でモールドされている。 FIG. 2 is a sectional view of a main part corresponding to FIG. 1 showing an example of a magnetic detection sensor device according to the present invention, and since the same symbols as in FIG. 1 represent the same elements, a description thereof will be omitted. In FIG. 2, one end of a polyimide flexible wiring board 10 is electrically connected to a bonding pad (not shown) of the magnetoresistive element 2, and the other end is electrically connected to an external connection lead 5 via a resectable 11. connected. In this case, the magnetoresistive element 2 and the flexible wiring board 1
0 can be easily connected by means such as thermocompression bonding or soldering. The magnetoresistive element 2 is molded with epoxy resin 9 on the inner surface of the cap 8 with a flexible wiring board 10 interposed therebetween.
このような構成によれば、従来のワイヤボンデ
イングでの接続で問題となつていたボンデイング
ワイヤ6(第1図参照)の切断およびキヤツプ8
への接触事故の発生が皆無となり、フレキシブル
配線板10とキヤツプ8はフレキシブル配線板1
0の外面側にポリイミドのオーバーレイフイルム
があるため、接触可能である。また、フレキシブ
ル配線板10を用いたことによつて、薄くかつ均
一な厚さのフイルムの絶縁層を構成することがで
き、磁気抵抗素子2をキヤツプ8の内面側に最近
接して配置できるので、キヤツプ8の表面から磁
気抵抗素子2の表面までの距離dが大幅に短縮で
き、磁気抵抗素子2の感度を向上させることがで
きる。 According to such a configuration, the problem of cutting the bonding wire 6 (see FIG. 1) and connecting the cap 8 with conventional wire bonding is avoided.
There are no accidents caused by contact with the flexible wiring board 10 and the cap 8.
Since there is a polyimide overlay film on the outer surface of 0, it can be contacted. Furthermore, by using the flexible wiring board 10, it is possible to construct a film insulating layer with a thin and uniform thickness, and the magnetoresistive element 2 can be placed closest to the inner surface of the cap 8. The distance d from the surface of the cap 8 to the surface of the magnetoresistive element 2 can be significantly shortened, and the sensitivity of the magnetoresistive element 2 can be improved.
以上説明したように本発明によれば、磁気抵抗
素子の外部接続用配線の断続、接触事故の発生が
皆無となるので、信頼性および歩留りを大幅に向
上させることができる。また、磁気抵抗素子と被
検出磁性体との間隔を大幅に短縮できるので、検
出感度の高い磁気検出センサ装置が得られるなど
の極めて優れた効果を有する。 As explained above, according to the present invention, there is no disconnection or contact accident in the wiring for external connection of the magnetoresistive element, so reliability and yield can be significantly improved. Furthermore, since the distance between the magnetoresistive element and the magnetic body to be detected can be significantly shortened, it has extremely excellent effects such as obtaining a magnetic detection sensor device with high detection sensitivity.
第1図は従来の磁気検出センサ装置の一例を示
す要部断面図、第2図は本発明による磁気検出セ
ンサ装置の一例を示す要部断面図である。
1……非磁性体基板、2……磁気抵抗素子、4
……バイアス用磁石、5……外部接続用リード、
7……ケース、8……キヤツプ、9……エポキシ
系樹脂、10……フレキシブル配線板、11……
リセクタブル。
FIG. 1 is a sectional view of a main part of an example of a conventional magnetic detection sensor device, and FIG. 2 is a sectional view of a main part of an example of a magnetic detection sensor device according to the present invention. 1... Non-magnetic substrate, 2... Magnetoresistive element, 4
...Bias magnet, 5...External connection lead,
7... Case, 8... Cap, 9... Epoxy resin, 10... Flexible wiring board, 11...
Resectable.
Claims (1)
された磁気抵抗効果を有する磁気抵抗素子と、該
磁気抵抗素子の前記非磁性体基板と反対側の面の
少なくとも一部を覆うと共にその一端側が前記磁
気抵抗素子のボンデイングパツト部と直接接続さ
れ、かつ他端側が外部接続用配線の少なくとも一
部を構成するフレキシブル配線板と、該フレキシ
ブル配線板の前記一端側の少なくとも一部を覆つ
て該フレキシブル配線板に近接配置された非磁性
体金属板とを具備してなることを特徴とする磁気
検出センサ装置。1. A non-magnetic substrate, a magnetoresistive element having a magnetoresistive effect formed on the non-magnetic substrate, and a magnetoresistive element that covers at least a part of the surface of the magnetoresistive element opposite to the non-magnetic substrate. a flexible wiring board whose one end side is directly connected to the bonding pad portion of the magnetoresistive element and whose other end side constitutes at least a part of the external connection wiring; and a flexible wiring board that covers at least a part of the one end side of the flexible wiring board. A magnetic detection sensor device comprising: a non-magnetic metal plate disposed close to the flexible wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56149450A JPS5851580A (en) | 1981-09-24 | 1981-09-24 | Magnetic detection sensor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56149450A JPS5851580A (en) | 1981-09-24 | 1981-09-24 | Magnetic detection sensor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5851580A JPS5851580A (en) | 1983-03-26 |
| JPH0223036B2 true JPH0223036B2 (en) | 1990-05-22 |
Family
ID=15475378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56149450A Granted JPS5851580A (en) | 1981-09-24 | 1981-09-24 | Magnetic detection sensor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5851580A (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5953287U (en) * | 1982-09-30 | 1984-04-07 | 三洋電機株式会社 | magnetic detector |
| DE3447312A1 (en) * | 1984-12-24 | 1986-07-10 | Standard Elektrik Lorenz Ag | MAGNETIC SENSOR |
| JPS62111569U (en) * | 1985-12-27 | 1987-07-16 | ||
| JPS62111570U (en) * | 1985-12-27 | 1987-07-16 | ||
| JPH07122662B2 (en) * | 1988-04-13 | 1995-12-25 | 松下電器産業株式会社 | Magnetic sensor |
| JPH0296655A (en) * | 1988-10-03 | 1990-04-09 | Nippon Steel Corp | Improvement of sensitivity of magnetic sensor |
| JPH0644967Y2 (en) * | 1989-01-17 | 1994-11-16 | 鹿島建設株式会社 | Precast concrete formwork |
| JPH0733182Y2 (en) * | 1989-07-04 | 1995-07-31 | 日本サーボ株式会社 | Magnetic sensor |
| JPH03138988A (en) * | 1989-10-24 | 1991-06-13 | Matsushita Electric Ind Co Ltd | Magnetic detector and manufacture thereof |
| US5508611A (en) * | 1994-04-25 | 1996-04-16 | General Motors Corporation | Ultrathin magnetoresistive sensor package |
| JP2000088868A (en) * | 1998-09-09 | 2000-03-31 | Matsushita Electric Ind Co Ltd | Speed sensor |
| DE10018269B4 (en) * | 2000-04-13 | 2009-04-09 | Dr. Johannes Heidenhain Gmbh | scanning |
| JP2007127673A (en) * | 2007-02-22 | 2007-05-24 | Matsushita Electric Ind Co Ltd | Rotational speed sensor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5189871U (en) * | 1975-01-14 | 1976-07-19 |
-
1981
- 1981-09-24 JP JP56149450A patent/JPS5851580A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5851580A (en) | 1983-03-26 |
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