JPH02232391A - アデイテイブ鍍金浴および方法 - Google Patents

アデイテイブ鍍金浴および方法

Info

Publication number
JPH02232391A
JPH02232391A JP30096389A JP30096389A JPH02232391A JP H02232391 A JPH02232391 A JP H02232391A JP 30096389 A JP30096389 A JP 30096389A JP 30096389 A JP30096389 A JP 30096389A JP H02232391 A JPH02232391 A JP H02232391A
Authority
JP
Japan
Prior art keywords
mol
bath
plating
copper
thick film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP30096389A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0317914B2 (2
Inventor
Issa S Mahmoud
イーサ・セツド・マームード
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPH02232391A publication Critical patent/JPH02232391A/ja
Publication of JPH0317914B2 publication Critical patent/JPH0317914B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP30096389A 1988-12-21 1989-11-21 アデイテイブ鍍金浴および方法 Granted JPH02232391A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US28999588A 1988-12-21 1988-12-21
US289995 1988-12-21

Publications (2)

Publication Number Publication Date
JPH02232391A true JPH02232391A (ja) 1990-09-14
JPH0317914B2 JPH0317914B2 (2) 1991-03-11

Family

ID=23114079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30096389A Granted JPH02232391A (ja) 1988-12-21 1989-11-21 アデイテイブ鍍金浴および方法

Country Status (2)

Country Link
EP (1) EP0375180A3 (2)
JP (1) JPH02232391A (2)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6031319B2 (ja) * 2012-10-04 2016-11-24 ローム・アンド・ハース電子材料株式会社 電解銅めっき液及び電解銅めっき方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL84048C (2) * 1952-07-05
US4686017A (en) * 1981-11-05 1987-08-11 Union Oil Co. Of California Electrolytic bath and methods of use
US4576685A (en) * 1985-04-23 1986-03-18 Schering Ag Process and apparatus for plating onto articles

Also Published As

Publication number Publication date
JPH0317914B2 (2) 1991-03-11
EP0375180A2 (en) 1990-06-27
EP0375180A3 (en) 1991-01-30

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