JPH0223386U - - Google Patents
Info
- Publication number
- JPH0223386U JPH0223386U JP10095688U JP10095688U JPH0223386U JP H0223386 U JPH0223386 U JP H0223386U JP 10095688 U JP10095688 U JP 10095688U JP 10095688 U JP10095688 U JP 10095688U JP H0223386 U JPH0223386 U JP H0223386U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- space
- case
- packaging
- passage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 239000004570 mortar (masonry) Substances 0.000 claims 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
Description
第１図は本考案に係るチツプ型電子部品の包装
用ケースを示す側断面図、第２図は同ケースの内
部構造を示す平面図、第３図は同ケースによる電
子部品の送出し状態を示す説明図、第４図は本考
案に係る包装用ケースの変形例を示す平面図であ
る。
１，２：ケース本体、３：電子部品の収容空間
、４：通路、６，６…：誘導案内溝、Ｅ，Ｅ…：
電子部品。
Fig. 1 is a side cross-sectional view showing a packaging case for chip-type electronic components according to the present invention, Fig. 2 is a plan view showing the internal structure of the case, and Fig. 3 shows the delivery state of electronic components using the case. FIG. 4 is a plan view showing a modification of the packaging case according to the present invention. 1, 2: Case body, 3: Housing space for electronic components, 4: Passage, 6, 6...: Guide groove, E, E...:
electronic components.
Claims (1)
ケース体１，２内に設け、その空間３内にチツプ
型の電子部品Ｅ，Ｅ…を多数個収容すると共に、
この電子部品Ｅ，Ｅ…を空間３の下端側からケー
ス外に連通する通路４で個々に取出し可能に形成
してなることを特徴とするチツプ型電子部品の包
装用ケース。 (2) 上記空間３の斜面に沿つて通路４の開口４
ａに亘る電子部品Ｅ，Ｅ…の誘導案内溝６，６…
を放射状に設けてなることを特徴とする請求項１
記載の包装用ケース。 (3) 上記誘導案内溝６，６…を斜面の上部側で
三角洲状に広げしかも通路４の開口４ａ側で電子
部品Ｅ，Ｅ…の一個分と相応する横幅に狭く形成
してなることを特徴とする請求項２記載の包装用
ケース。[Scope of Claim for Utility Model Registration] (1) A space 3 that narrows downward in the shape of an approximately inverted conical mortar is provided in the case bodies 1 and 2, and chip-shaped electronic components E, E... are provided in the space 3. In addition to accommodating a large number of
A case for packaging chip-type electronic components, characterized in that the electronic components E, E, . (2) Opening 4 of passage 4 along the slope of space 3
Guidance guide grooves 6, 6... for electronic components E, E... extending over a.
Claim 1 characterized in that:
Packaging case as described. (3) The above-mentioned guide grooves 6, 6... are widened into a triangle shape on the upper side of the slope, and narrowed to a width corresponding to one electronic component E, E... on the opening 4a side of the passage 4. The packaging case according to claim 2, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10095688U JPH0223386U (en) | 1988-07-29 | 1988-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10095688U JPH0223386U (en) | 1988-07-29 | 1988-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0223386U true JPH0223386U (en) | 1990-02-15 |
Family
ID=31329506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10095688U Pending JPH0223386U (en) | 1988-07-29 | 1988-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0223386U (en) |
-
1988
- 1988-07-29 JP JP10095688U patent/JPH0223386U/ja active Pending