JPH02235399A - Alignment device of electronic component - Google Patents

Abstract

PURPOSE:To perform alignment simply by providing prisms which compose images of both leads and patterns as well as an image sensing element of composed images between the electronic component leads and pads on a print plate. CONSTITUTION:Right angle prisms 3 and 4 have a main surface that is formed into a spherical surface (FE) and only a central small part (surface JK) has a plane and they come into contact with the surface (AC) of a roof prism 5. Rays of light coming from each pattern 2 to the surface AB of the roof prism 5 are reflected by surfaces AI and BD and reach a surface CI. Out of the rays which reach the surface CI, the rays which arrive at a junction surface JK with the right angle prism 4 are emitted from a surface FG of the prism 4 after passing through the surface JK. Further, reaching the surface CJ and KI, the rays are reflected and emitted from a surface CD. The rays of light coming from leads 1 come into a surface GH and are reflected by a surface HI and then reach the surface FE. Then only the rays that reach the surface JK may pass through the surface FE and are emitted from the surface CD. Passing through the surface CD of the prism 5, the rays pass through a group 6 of lenses and reach an image sensing element 7. Then images of the pads 2 and the leads 1 are composed at periphery and center parts and such a state of image composition facilitates alignment.

Description

[Detailed description of the invention] [Table of contents] Overview Industrial field of application Conventional technology Problems to be solved by the invention Means for solving the problems (Fig. 1) Working examples (Figs. 2 to 5) ) Effects of the invention [Summary] Regarding an electronic component alignment device, it is possible to align an electronic component such as an IC with a foot pattern of a board using a single camera without switching the screen, and the alignment is The overall goal is to make this process easy, quick, and use inexpensive equipment.The electronic component leads to be mounted and the pads on the printed circuit board that are to be mounted are imaged and aligned using an image sensor. In an electronic component alignment device, a plurality of prisms are provided between the lead and the pad to combine images of the lead and the pad, and an image pickup element is provided to capture the combined image by the prisms. .

[Industrial application field]

The present invention relates to an alignment device for electronic components, and more specifically, it is used when mounting electronic components such as ICs on a board.In particular, the present invention relates to an alignment device for electronic components, which is used when mounting electronic components such as ICs on a board. The present invention relates to an electronic component alignment device as described above.

(Prior Art) In recent years, with the miniaturization of electronic components, there has been a demand for high-density mounting on foot patterns on printed circuit boards.

Therefore, using an image sensor such as a camera, the target I
A method is known in which images of an electronic component such as C and a foot pattern of a board are taken, and the position of the child component and the foot pattern is aligned based on the position of the target object in each image.

[Problem to be solved by the invention]

Conventional devices such as those described above often have the following drawbacks.

(1) Conventionally, it has been common to separately image electronic components such as ICs and foot patterns to determine their respective positions.

Then, either the IC or the like and the foot pattern can be imaged and processed using separate cameras, or one camera can be used and the target can be switched using a reflective mirror or the like and processed.

(2) In the above case, if two cameras are used, the cost will be high, and if one camera is used, a switching mechanism will be required and switching will take time.

The present invention solves these conventional drawbacks, and uses one camera to monitor electronic components such as ICs and 7 circuit boards without switching screens.
In addition to making it possible to align with the cut pattern,
The purpose is to enable alignment to be performed easily, in a short time, and with inexpensive equipment.

[Failure to solve the problem]

FIG. 1 is a diagram showing the principle of the present invention, and the principle of the present invention will be explained below based on this diagram.

Reference numeral 1 indicates a lead portion of an electronic component (such as an IC) to be aligned, and 2 indicates a pad (foot pattern) on a printed circuit board to be mounted, and a conductor portion connected to the lead of the IC or the like.

3 is a right-angle prism, 4 is a right-angle prism whose main surface is spherical (
1"11), and only the small central portion (JK surface) is flat. This flat portion (JK surface) is in optical contact with the Dove prism 50i (ACi).

The light from the pad 2 that is incident on the AB surface of the Dove prism 5 is reflected by the AI surface and the BD surface and reaches the CI surface. This CI
Of the light that reaches the surfaces, the light that reaches the joint surface JK with the right angle prism 4 passes through the JK surface and is emitted from the FG surface of the prism 4.

On the other hand, among the light that has reached the CI surface, the light that has reached the CJ and KI surfaces is reflected and radiated from the CD surface.

Further, the light from the lead 1 enters from the GH surface, is reflected by the H2 surface, and reaches the FB surface, of which only the light that reaches the JK surface passes through and is emitted from the CD surface.

The light that has passed through the CD surface of the Dup prism 5 passes through the light receiving system lens group 6 and reaches the image pickup device 7.

The image obtained by the image sensor 7 is composed of images of the pad 2 at the periphery and the lead 1 at the center.

[Effect]

With the above configuration, the pad (foot pattern) magnified by the light receiving system lens 6 and the electronic component (for example, IC)
An image of the ride 1 can be captured by the image sensor 7.

As a result, you can use one camera without switching.
At the same time, the lead positions of ICs, etc. and the positions of pads (foot patterns) on the printed circuit board can be easily confirmed, and alignment can be performed in a short time.

C Embodiment] Hereinafter, embodiments of the present invention will be described based on the drawings. FIG. 2 is an explanatory diagram of a prism in an embodiment of the present invention.

In the figure, 81A is incident light from the lead part of an electronic component, such as an IC, 82B is incident light from a pad (foot pattern) of a printed circuit board, 03 is a right-angle prism, and 4 is a right-angle prism whose main surface is Spherical surface (
FE), only the small part in the center is flat (JK)
It becomes.

This plane JK is in optical contact with the AC surface of the Dup prism 5. IM is an image obtained by an image sensor.

The light 82B entering from the AB surface of the Dapp prism 5 is AI,
It is reflected from the BD surface and reaches the CI surface. Of the light that reaches this CI surface, the light that reaches the joint surface JK with the right-angle prism 4 is not reflected because the joint surfaces are in optical contact (passes through the JK surface and is connected to the prism 40FG). Shoot face-to-face.

On the other hand, of the light that has reached the bonding surface CI, the light that has reached the CJ and KI surfaces is separated from the prism 4 by air, so it is reflected and emitted from the CD surface.

In addition, the light incident from the GH surface of the right angle prism 3 is
It is reflected by the HI surface of the right angle prism 3, passes through the GE surface, and reaches the FB surface of the prism 4. Of the light that has reached the FB surface, the light that has reached the joint surface JK with the Dapp prism 5 in the center passes through the JK surface and is emitted from the CD surface of the Dap prism 5.

Further, among the light that reaches the FE surface, the light that reaches other surfaces than the bonding surface JK is reflected and is not emitted from the CD surface of the Dup prism 5.

As a result, the image IM obtained by the image sensor has an image S1 of the incident light SIA in the center and an image S2 of the incident light 82B in the peripheral part.

Therefore, the IC is placed above the prism 3 (above the GH surface).
Place the leads below the prism 5 (below the AB plane).
By arranging pads (foot patterns) of the printed circuit board in the area, an image 1M in which pads (foot patterns) are combined in the periphery and leads in the center can be obtained from the image sensor.

FIG. 3 is a block diagram of the above embodiment, and the same reference numerals as in FIG. 2 indicate the same parts.

Reference numeral 8 indicates a lighting device, and 9 indicates a light diffusion plate.
The lead 1 of (referred to as C) is illuminated from above.

When this light is received by the image sensor 7, the lead 10 portion appears dark and the other portions appear bright.

10 and 11 are lighting devices that illuminate from around the pads (foot patterns) of the printed circuit board.Generally, the pads are plated, so they have a high reflectance, and the board parts have a lower reflectance than the pads, so it is difficult to capture images. When light is received by the element 7, the pad portion becomes bright and the substrate portion becomes dark.

12 is an imaging cylinder; 13 is a robot that moves the imaging cylinder 12 in the X and Y directions of the coordinate axes; 14 is a camera control unit that controls the imaging device 7; 15 is a frame memory that obtains and stores video signals from the imaging device 7; and 16 17 is an image processing section that determines the positional deviation between the lead 1 and the pact 2 from the contents of the frame memory 15; and 17 is a robot control section that controls the robot 13.

A central control section 18 receives a robot movement completion signal from the robot control section 17, sends an imaging signal to the camera control section, issues a processing start signal to the image processing section 16, and receives the amount of positional deviation.

4 and 5 are explanatory diagrams of the above embodiment, and FIG. 6 is an operation flowchart of the above embodiment.Hereinafter, the operation of the above embodiment will be explained using these figures.

When the IC comes to the mounting position, the central control unit 18 outputs an instruction signal to the robot control unit 17 to move the imaging tube 12.

The robot control section 17 receives an instruction signal from the central control section 18 and moves the robot 13 to a predetermined position on the lead side of the IC. When the movement is completed, a movement completion signal is sent to the central control unit 18.

Upon receiving this signal, the central control section 18 sends an imaging instruction signal to the camera control section 14. Upon receiving this signal, the camera roll unit 14 issues an imaging start signal to the camera, and the imaging element 7 performs imaging.

The camera control section 14 sends an imaging completion signal to the central control section 18 after a predetermined imaging time has elapsed. This sends an instruction signal to the image processing section 16 to use the image stored in the frame memory 15 and sent from the camera to find the amount of positional deviation of the IC in the X and Y directions.

Next, the image processing section 16 calculates the amount of positional deviation of the IC from the image in the frame memory 15, and sends the amount of positional deviation to the central control section 18.

For example, if the IC has leads 1 on two sides as shown in FIG.
Also, as shown in Figure 5 (B), an IC with leads 1 on four sides
In the case of , repeat the above operation until the amount of positional deviation of the four sides is determined.

The central control unit 18 calculates the amount of deviation from the amount of positional deviation of each side in the X, Y direction, and the amount of positional deviation of the entire IC in the X, Y, and θ directions, and corrects the position of the component.

The image processing section 16 has a frame memory 1 as shown in FIG.
The center position of the pad (7-bit pattern) 2 on the board at the periphery of the image stored in 5 and the IC in the center.
The difference between the center position of lead 1 and the tip position of pad 2,
Calculate the amount of deviation in the X and Y directions from the position of the tip of lead 1.

In the above embodiments, the mounting of an IC was explained, but the present invention can also be applied to electronic components other than ICs. [Effects of the Invention] As explained above, according to the present invention, the following can be achieved. There is a similar effect.

(1) Electronic components such as ICs to be aligned and mounting pads (foot patterns) can be imaged simultaneously with one camera, eliminating the time required for switching as in the past.

> (2) Since only one camera is required, it is cheaper than the conventional method that uses two cameras.

(3) There is no need for conventional reflective mirrors, etc.
Configuration becomes easier0

[Brief explanation of drawings]

Fig. 1 is a principle diagram of an electronic component alignment device according to the present invention, Fig. 2 is an explanatory diagram of a prism in an embodiment of the present invention, Fig. 3 is a configuration diagram of the above embodiment, and Fig. 4 5 is an explanatory diagram of the above-mentioned embodiment, and FIG. 6 is an operation flowchart of the above-mentioned embodiment. foot pattern), 3
...Right angle prism, 4...Right angle prism with a partially flat and spherical surface, 5.
... Dove prism, 6... Light receiving system lens group, 7... Image sensor. Actual & Example Structure Closing Figure 3

Claims (1)

[Scope of Claims] Electronic component positioning in which a lead (1) of an electronic component to be mounted and a pad (2) on a printed circuit board, which is a mounting target, are imaged by an image sensor (7) and aligned. In the device, a lead (
A plurality of prisms (3) combine the images of 1) and pat (2).
, 4, 5) and an image sensor (7) for capturing an image synthesized by the prism (3, 4, 5).