JPH02235537A - Automatic scraping device - Google Patents

Abstract

PURPOSE:To perform the cutting for scraping by setting it to the necessary minimum by outputting a signal corresponding to a position, depth and length of a flaw, and driving a tool in accordance therewith. CONSTITUTION:A surface flaw of a running wire rod 1 is detected, information related to a flaw detected by a flaw detecting mechanism 4 is outputted as a signal, the signal from the flaw detecting mechanism 4 is received and a scraping mechanism 6 is controlled by a control mechanism 5, and the scraping mechanism 6 rotates a tool 63 in the periphery of the wire rod 1 and positions it on the flaw, moves it forward and backward in the radial direction and allows it to cut only the flaw part. In that case, by an automatic wire rod scraping device constituted so that a signal corresponding to a position, depth and length of the flaw of the wire rod 1 is outputted, and the tool 63 is driven thereby, cutting and elimination of the surface flaw of the wire rod 1 brought to expansion and contraction can be performed by cutting the part of the necessary minimum. Accordingly, it does not occur that a degree of reduction is greatly different as to each part of the wire rod 1, and it is disconnected due to necking, and uniform wire drawing can be executed extending over the overall length.

Description

[Detailed description of the invention] [Industrial application field]

The present invention relates to an improvement in an apparatus that automatically removes flaws on the surface of a wire when the wire is drawn.

[Conventional technology]

For example, when cold drawing a tool steel wire to manufacture bearing balls, it is necessary to cut out and remove flaws on the surface of the wire. Various devices for automatically performing this work have been developed and put into practical use. Conventional automatic flaw removal equipment generally rotates the tool at the location of the flaw in the wire rod and cuts the entire circumference, so when the flaw is deep, a large constriction occurs in the wire rod, causing wire breakage. In addition, yields are lowered and costs increase when processing expensive materials. Therefore, it is desirable to perform cutting to remove flaws to the extent necessary. One of the inventors, along with other co-researchers, has developed an automatic flaw removal device that meets this need, and has already disclosed it (
Utility Model No. 63-41418). The device consists of a running wire (1) as shown in Figure 1.
The flaw detection system (4) detects surface flaws on the wire and outputs information about the detected flaws as an electrical signal. It essentially consists of a flaw removal mechanism (6) that cuts only the part, and a contouring mechanism (5) that controls the flaw removal mechanism in response to signals from the flaw detection mechanism. In Fig. 1, (2) is a payoff stand for paying out the wire from the coil, and (3) is the wire drawing die (D1, D2).
, D3) is a pick-up stand for winding the drawn wire into a coil again. As shown in Fig. 2, the structure of the flaw removing mechanism includes a set of a tool (63) that advances and retreats to cut the wire rod (1) using hydraulic pressure and a support roll, which are rotatable in the direction of the arrow. I'll go. The above device outputs a signal related to the position of the flaw in the form of pulses, which rotates the stepping motor of the flaw removing mechanism to determine the position of the tool, and also includes an encoder that reads the amount of rotation of the stepping motor. In addition, reliable operation is ensured by forming a closed loop to confirm whether or not the rotation has been performed faithfully in accordance with the pulse signal. [Problem to be Solved by the Invention 1] The object of the present invention is to further improve the above-mentioned device of the present invention, and to provide an automatic flaw removing device that can perform flaw removal by minimizing cutting to the necessary minimum. It's about doing. [Means for Solving the Problems] The automatic flaw removing apparatus of the present invention is an apparatus for automatically removing flaws on the surface of a wire rod during wire drawing processing, as shown in FIG. a flaw detection mechanism (4) that detects surface flaws on the running wire and outputs information regarding the detected flaws as a signal;
A flaw removal mechanism (6) as shown in FIG. 2, which cuts only the flaw portion by rotating the tool around the wire rod, positioning it above the flaw, and moving it forward and backward in the radial direction; and the above-mentioned flaw detection mechanism. In an automatic flaw removing device, which essentially consists of a control mechanism (5) that controls the flaw removing mechanism in response to signals from the It is characterized by being configured to drive. To detect flaws, a rotary detector such as an eddy current flaw detector using one or more rotating probes or an AC leakage magnetic flux flaw detector may be used. Die D1 is a normal wire drawing die or a wire drawing die with a slightly lower area reduction rate, D2 is a skin pass die, and D
3 is a finishing die that is used to restore the roundness of a portion that has been deformed by removing defects. In this way, when a wire drawing die is provided between the flaw detection mechanism and the flaw removal machine break, the flaw detection can be performed by calculating the increase in flaw length due to area reduction, change in flaw position, and increase in wire running speed. The control mechanism is given the function of processing the signal from the mechanism and sending it to the flaw removal mechanism. The main parts in Figure 1, namely the flaw detection mechanism (4) and the control mechanism (
5) and the flaw removing mechanism (6), the details of a typical example of the structure are shown in FIG. 3. In Fig. 3, the flaw detection mechanism (4) includes a rotation controller (41) that controls the rotation of the probe (43), a rotary flaw detector (42), and the output from there is processed and controlled as a flaw signal (SK). The flaw removing mechanism (6) includes a signal processor (44) for feeding the signal to the mechanism.The flaw removing mechanism (6) includes a cutting tool (63), a tool drive machine (62) that drives the tool, and a tool drive machine according to control signals from the control mechanism. The control mechanism (5) is only shown as consisting of a control section (51) and a setting display section (52) in FIG. The control unit (51) receives a flaw signal (SK) from the signal @ processing device (44), and receives the flaw signal (SK) from the signal @ processing device (44) every rotation of the rotary flaw detection Ill (42).
For example, a rotation period signal generated from a proximity switch (
SY), and online pulse generator for length measurement (
The length measurement pulse signal (PG) from 7) is input. The defect signal (SK) is generated by processing the weak signals emitted by, for example, four sensor probes, amplifying them, improving the filter S/N ratio, etc., and then inputting them into each channel (in this case, four channels). come. Each flaw signal passes through a peak hold circuit (51'l), an analog-to-digital converter (A/D), and is output to a bus line (513). 514), where the outer circumference of the wire is divided into a suitable number, for example 32, and a circumference division timing pulse is generated therefrom.Thereby, the flaw signal is input to the outer circumference of the probe. In other words, a reference is given to confirm the position on the outer circumference of the wire.On the other hand, the length measurement pulse signal (PG) from the length measurement online pulse generator (7) is, for example, 1M long. It is given as one pulse every time the height is measured, and the divider (515
), it is divided into 5 parts, for example. Therefore, in that case, evaluate the flaws by taking five strips as one unit in the cutting direction of the wire. The outputs of the multiplier (514)e and the divider (515) are shared to the bus line (513) through an interface (I/O). The calculation is performed using a microprocessor MPLI such as 6800
0 with the help of memory. The memory is ROM for startup and for writing arithmetic expressions.
and a RAM that calculates input data and tabulates it on a memory space. The calculation results for controlling the defect removing mechanism are outputted as signals @SA and SB through the interface ①/0. Inputting and displaying initial condition setting values for functioning the scratch removal mechanism is performed in a setting display section (52) connected to the bus line (513) through the I/O in FIG. 4. The setting display section (52) consists of a display (521) and a preset (522). A specific example of the display (521) is shown in FIG.
A plurality of display means arranged on the circumference, such as LEDs, a counter that displays the number of detections of four grades of flaws evaluated based on combinations of flaw depth and length, and a screen that displays parameter settings, such as CRT. It is equipped with the following. The number of the above LEDs corresponds to the number of sections on the outer periphery of the wire, in this case 32 LEDs are arranged. The one at the top of the LED circle represents the upper end of the cross section of the wire being drawn, and the one at the right side represents the right end of the cross section as seen from the exit side of the wire.The sensor probe of the rotary flaw detector rotates around the wire. Each time a flaw is detected on the surface, an LED flashes at a position corresponding to the flaw position. The wire outer diameter set as the parameter setting value in Fig. 5 is
The value at the position of the sub-length pulse generator (7), that is, the value before wire drawing, is necessary for flaw detection because the outer diameter decreases and the length of the wire increases by passing through the dies (D1 and D2). The position of the flaw detected by the mechanism (4) on the wire rod is different from the position where the flaw should be removed by the flaw removal mechanism (6). Strictly speaking, the distance L between the center of the rotary flaw detection type sensor probe in Figure 1 and the wire contact position of the flaw removal tool must be corrected to the value measured by the length measurement pulse generator (7). Must be. The outer diameter of the wire to be processed is D, and the outer diameter of the wire that enters the flaw removal mechanism is d.
When, L corresponding to the value of d/D=K for each wire diameter
By calculating the correction value in advance and storing the table in the ROM, it is possible to read the K value and automatically correct the L value by inputting the wire outer diameter D. "Flaw separation constant", one of the parameter setting values in FIG. 5, means the resolution between each section on the outer circumference of the wire when performing automatic flaw removal. For example, when four sensor probes of a rotary flaw detector are used, they rotate around the wire (1) as shown in FIG. 6, and their trajectory becomes as shown by the chain line in FIG. 7A. If there is a flaw (11) on the surface of the wire (1), the signal shown by the solid line in FIG. 7A is output from the sensor probe (43) passing over the flaw. As mentioned above, in order to improve the S/N ratio, this signal passes through a filter as shown in FIG. 7B, and is inverted as shown in FIG. 7C. ), which undergoes A/D conversion.
At this time, the pair of flaw signals are differentiated and split into multiple damped vibration waveforms, and in exchange for improving the S/S ratio, the flaw signal occupation length (tW), which is converted to the length on the sensor probe trajectory circumference, increases. As a result, the resolution between two or more flaw signals is reduced. In actual operation, the mechanical response followability of the flaw removal mechanism is also an issue, and when flaws exist in parallel on the outer circumference of the wire, priority is given to removing deep flaws, and shallow flaws must be excluded from the flaw removal target. It won't happen. If there is a shallow flaw in parallel with a deep flaw, when the flaw removal tool comes into contact with the wire to remove the former, the latter is included in the effective cutting width that the cutting edge occupies on the outer circumference of the wire. If so, it is possible to cut and remove them at the same time. The flaw separation constant is set taking these conditions into consideration.

[For use]

Hereinafter, the software aspects of the present invention will be explained with reference to flowcharts. The main routine in the control mechanism is as shown in Fig. 8.
and r5s++ interrupt", and these are:
It functions as shown in FIG. That is, by inputting the "wire rod outer diameter" in the "parameter setting", the correction calculation of the L value according to the area reduction rate is performed as described above. By inputting the "flaw separation constant", determination of flaws on the outer circumference of the wire and writing of a peak table to be described later can be controlled. By inputting the "deep (shallow) flaw threshold level", the discrimination limit of the deep (shallow) flaw signal amplitude is set. The wire drawing work starts in the following order: coil online (wire rod detection and wire drawing machine turned on), one-turn flaw detector steady rotation check, flaw removal mechanism turned on. In a steady state, a group of interrupt routines are executed and flaws are displayed by a flaw detection loop. The contents include, in addition to the real-time display of the flaw position using the LED flash described above, the cumulative display of the cumulative total of flaws, and the MPU detecting differences in setting conditions and displaying them as error messages. The "10TrLSeC interrupt" is an operation to periodically organize and integrate flaw information in the length direction of the wire. Assuming that the mechanical responsiveness of the flaw removal mechanism has no apparent effect, the wire drawing speed is 150 m/min. 25 minutes in the wire length direction
# is one unit. In other words, the resolution is 25 m. ”As shown in Figure 10, the instructions given to the flaw removal mechanism from the control machine groove 5 at the IOmsec interrupt are based on the direction and angle of rotation of the flaw removal tool around the wire, the presence or absence of flaws, and the depth of the flaw. Depth, curved machining and quick machining immediately before cutting and straight machining, the timing of which is transmitted at the 5th cut.At the same time, the L value correction is performed from the set wire rod outer diameter value. Based on this, the length of the shift register for signal delay is calculated and read in order to make the cutting timing appropriate, the timing is adjusted for the next interrupt, and the process returns.The 32-divided interrupt is performed according to the flow shown in Fig. 11, Data on flaws created in the circumferential direction of the wire rod is periodically organized and integrated.As mentioned above, the timing of the 32-division interrupt is determined by the rotation period signal (SY) as the rotation speed of the rotary flaw detector fluctuates.
Even if there is a change in the cycle of SY, pulses are generated to divide SY into 32. The main functions of this routine include, in addition to the circumferential flaw data reduction described above, monitoring changes in wire speed. That is, it is determined whether the movement of the wire rod length 5 and the completion of one round of 32 divisions match, and if they do not match, it is compared with the data of the previous round, and interpolation is performed by comparing it with the next time. If the wire drawing speed falls below the initial setting value, a message indicating circumference data over is displayed. Read the flaw data on the circumference and return. An example of data reading is shown in the "Circumferential Flaw Data Table" in Table 1, and a model embodying this is shown in FIG. 17. The cylinder in Fig. 17 rotates in the direction of the arrow, and one rotation corresponds to one rotation of the rotary probe.
The display direction is divided sequentially into columns 1, 2, 3, etc., and each time the cylinder rotates, the data stored in column 2 moves to column 3, and the data in column 3 moves to column 3. Moved to tabulation frame. The data stored in this way is accumulated to create the "circumferential flaw data accumulation table" shown in Table 2. Information about (depth) x (length) of the flaw is obtained from this cumulative value, and a control signal is issued to the flaw removal machine groove. The concrete model of Table 2 is shown in FIG. 18. r5m interrupt" executes the flow shown in Fig. 12, and it is necessary to detect the maximum circumferential flaw from the cumulative circumferential flaw data,
Determines the depth and circumference address of the flaw, determines the length of the flaw to be cut, and delays shift register signals to operate the flaw removal tool at the appropriate timing. The original flaw map is created by writing flaw data every 5 mIrI in the length direction of the wire and for each address obtained by dividing the circumference into 32. The cumulative total of circumference data is as described above. In FIG. 12, the subroutine for "maximum circumferential flaw detection" follows the flow shown in FIG. 13. The largest flaw is determined by creating a peak table. The address on the circumference where there is a large flaw is determined and memorized to create the first peak table shown in Table 5, and the second peak table shown in Table 6 is determined by determining the address on the circumference where there is a large flaw. Create a peak table. If the peak positions in Table 5 and the peak positions in Table 6 are within the flaw separation constant, they are represented by the peaks in the first peak table, and if there is a gap that exceeds the flaw separation constant, it is stored separately. The flaw peak position is determined by the combination of the circumferential address and the longitudinal address thus obtained, and a flaw peak position map table as shown in Table 3 is created. The subroutine “determination of flaw depth/circumference address” is the first
It has the flow shown in Figure 4. In this work, first, the setting parameters shown in FIG. 5 are read, compared with the flaw peak position map (Table 3), and written into the original flaw actual data table shown in Table 4. For example, the address in column 8 of Table 4 is 1024
, that is, information on the distribution of flaws in the wire is accumulated over a length of 5X 1 024 = 5 1 20 (m),
The address is designed to be updated to 1 when it reaches 5125s. The "determination of flaw length" subroutine determines the depth and length of the flaw in combination according to the flow shown in FIG. The determination is made by comparing the flaw peak position map table (Table 3) and the original flaw actual data table with a threshold level for deep (shallow) flaw selection set as a parameter. Based on the results of the depth and length of the flaw determined in this way, a subroutine of "shift register processing" is executed to delay the flaw removal signal that is issued in order to synchronize the flaw removal mechanism with the wire movement speed. , carried out according to the flow shown in Fig. 16. The timing of the command sent from the control unit (51) of the control Ia mechanism to the drive controller (61) of the flaw removal mechanism and the answer (acknowledgement) in the opposite direction are shown in the upper part of the chart in FIG. In the lower part of the same figure, the command in the upper part is the flaw removal tool (63).
This figure shows how to cut out flaws in a wire by moving the . Wire rod (1
) The flaw (11) is removed by cutting the part indicated by the broken line. At this time, the delay time is shortened so that the rise of the command signal for starting cutting (starting forward movement of the tool) for pre-machining is 5 to 10 TrLSeC, or 10 to 12 msec in the case of deep scratches. By adjusting this time, the time to start cutting can be determined appropriately depending on how deep or shallow the flaw is. Post-processing is performed using the time required for the cutting tool to retreat. Circumferential flaw data table *A/D conversion value peak table of flaw signal amplitude Peak table 1 Circumferential flaw data cumulative table Peak table 2 [Effect of the invention 1 The wire rod white movement flaw removal arrangement of the present invention eliminates wire drawing. Surface flaws on the wire can be removed by cutting the minimum necessary portion. Therefore, the degree of area reduction varies greatly depending on each part of the wire, and the wire does not break due to constrictions, and the wire can be drawn uniformly over the entire length. The material yield has been increased to the limit, and costs have been reduced, especially when machining expensive high-alloy tool steel.

[Brief explanation of the drawing]

FIG. 1 is a conceptual diagram showing the overall groove structure of the automatic flaw removing apparatus of the present invention. Fig. 2 is a side view showing the structure of the flaw removal chamber of the device shown in Fig. 1, seen from the wire exit direction. Fig. 3 is a block diagram showing the configuration of the main mechanisms in Fig. 1. It is. FIG. 4 is a block diagram showing details of the control mechanism of the main machine grooves shown in FIG. 2. FIG. 5 is a diagram showing a specific example of the setting display section of the control mechanism. FIG. 6 is a perspective view showing a situation in which the sensor probe of the rotary flaw detector rotates around the wire to be processed. Figures 7A to 7C illustrate the phenomenon in which the resolution of the flaw signal on the outer circumference of the wire is reduced, and A shows the output signal on a part of the cross section of the wire and the locus of the sensor probe rotating around it. It is a diagram showing waveforms superimposed, B is a diagram showing a waveform after filtering, and C is a diagram showing a waveform after inversion. 8 to 12 are flowcharts illustrating the software that operates the control mechanism in the present invention,
FIG. 8 shows three types of interrupts in the main routine, and FIG. 9 shows the functions of the main routine. Figure 10 is 10ms
FIG. 11 shows the flow of the ec interrupt, FIG. 11 shows the flow of the 32-divided interrupt, and FIG. 12 shows the flow of the 5m interrupt. 13 to 16 are all subroutines of the 5m interrupt in FIG. 12, in which FIG. 13 detects the maximum circumferential flaw, FIG. 14 determines the flaw depth and circumferential address, and 15
The figure shows the flow of determining the flaw length, and FIG. 16 shows the flow of quickly filling the shift register. Fig. 17 and Fig. 18 both show the addresses on the circumference of the wire, Fig. 17 shows the circumferential flaw data table in Table 1, and Fig. 18 shows the circumferential flaw data table in Table 2. Each is a concrete model of the data cumulative table. FIG. 19 is a timing chart of control signals given from the control mechanism to the defect removal mechanism, and shows the situation of defect removal cutting in comparison. 1... Wire rod to be processed 2... Bay-off stand 3... Take-up stand 4... Flaw detection mechanism 41... Rotation controller 42... Rotary flaw detector 43
...Sensor probe 44...Signal processor 5...
Control mechanism 51...control section 52...setting display section 6.
... Scratch removal mechanism 61 ... Drive device 62 ... Tool drive device 63
・-・Cutting tool 7... Length measurement pulse generator D, D. D3... Wire drawing die SK... Flaw signal SY... Rotation period signal PG... Length measurement pulse signal @ SA, SB... Control signal Patent applicant Hara Denshi Sokki Co., Ltd. Daido Special Steel Agent Co., Ltd. Patent Attorney Souo Suga @1! ! 1 Figure 4 Figure 3 Figure 6 Figure 7 Figure 10 Figure 8 Figure 9 Figure 11 Figure 14 Figure 16 Figure 15 Figure 17 Figure 18

Claims (4)

[Claims] (1) A device that automatically removes surface flaws during the wire drawing process, and a flaw detection mechanism and tool that detects surface flaws on the running wire and outputs information regarding the detected flaws as a signal. Rotate it around the wire and position it over the flaw,
In an automatic flaw removing device, which essentially consists of a flaw removing mechanism that cuts only the flawed portion by advancing and retreating in the radial direction, and a control mechanism that controls the flaw removing mechanism in response to signals from the flaw detection mechanism, An automatic flaw removing device characterized in that it is configured to output a signal corresponding to the position, depth and length of the tool and drive a tool accordingly. (2) A wire drawing die is provided between the flaw detection mechanism and the flaw removal mechanism, and it calculates the increase in flaw length due to area reduction, change in flaw position, and increase in wire running speed, and receives signals from the flaw detection mechanism. 2. The automatic flaw removing apparatus according to claim 1, wherein the control mechanism is provided with a function of processing and sending the processed material to the flaw removing mechanism. (3) When multiple flaws exist on the circumference of the wire for each unit length, the flaw removing tool is configured to compare the depths and drive the flaw removing tool to cut the deepest flaw preferentially. The automatic flaw removing device according to claim 1. (4) The automatic flaw removing device according to claim 1, wherein the outer circumference of the wire is divided into a plurality of sections, and an indicator light is provided to display the flaws in each section from time to time.