JPH0223697A - Device for manufacture of printed board - Google Patents
Device for manufacture of printed boardInfo
- Publication number
- JPH0223697A JPH0223697A JP17298088A JP17298088A JPH0223697A JP H0223697 A JPH0223697 A JP H0223697A JP 17298088 A JP17298088 A JP 17298088A JP 17298088 A JP17298088 A JP 17298088A JP H0223697 A JPH0223697 A JP H0223697A
- Authority
- JP
- Japan
- Prior art keywords
- vibration
- printed circuit
- circuit board
- frequency
- printed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000007788 liquid Substances 0.000 claims description 21
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 238000007747 plating Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、プリント基板を液処理するプリント基板製造
装置に関し、特にプリント基板のスルーホールメツキ前
処理装置のほか、無電解メツキ装置や電気メツキ装置並
びに洗浄処理装置などに適用可能なものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a printed circuit board manufacturing apparatus that liquid-processes printed circuit boards, and in particular to a through-hole plating pretreatment apparatus for printed circuit boards, as well as electroless plating apparatus and electroplating apparatus. It is applicable to equipment, cleaning processing equipment, etc.
(従来の技術)
この種の装置としては、すでに本発明の発明者らが提案
したように、メツキ槽などの処理液槽内に浸漬して液体
処理中のプリント基板を振動発生器で振動させ、この振
動によってスルーホール中の気泡を除去するものが知ら
れている(特開昭62−154797号公報)。(Prior Art) As already proposed by the inventors of the present invention, this type of device uses a vibration generator to vibrate a printed circuit board that is immersed in a processing liquid tank such as a plating tank and is undergoing liquid treatment. A device is known in which air bubbles in the through hole are removed by this vibration (Japanese Patent Application Laid-open No. 154797/1983).
(発明が解決しようとする問題点)
ところが、従来装置は、プリント基板のスルーホール内
に生ずる気泡を除去する効率が悪く、この解決が望まれ
ていた。(Problems to be Solved by the Invention) However, conventional devices have poor efficiency in removing air bubbles generated in through holes of printed circuit boards, and a solution to this problem has been desired.
そこで、発明者らは、その原因を究明する過程で、プリ
ント基板の固有振動数が振動モータのような実用的な振
動発生器の振動数は、−船釣にプリント基板の固有振動
数とは異なり、そのため振動発生器からの振動エネルギ
ーがプリント基板に対して効率的に伝達されず、プリン
ト基板が充分に振動されない、という知見を得た。In the process of investigating the cause, the inventors discovered that the natural frequency of a printed circuit board is the same as the frequency of a practical vibration generator such as a vibration motor. It was found that the vibration energy from the vibration generator is not efficiently transmitted to the printed circuit board, and the printed circuit board is not sufficiently vibrated.
固有振動数に一致させるとしても、振動対象であるプリ
ンi・基板は、その大きさや重量が異なるので、それに
伴って固有振動数も異なり、処理されるプリント基板は
数種類におよぶのが普通であるから、そのたびに振動発
生器の振動数をプリント基板の固有振動数に合せること
は増々困難である。Even if it is made to match the natural frequency, the printed circuit boards that are subject to vibration differ in size and weight, so the natural frequency will also vary accordingly, and there are usually several types of printed circuit boards to be processed. Therefore, it becomes increasingly difficult to match the frequency of the vibration generator to the natural frequency of the printed circuit board each time.
そこで、本発明は、上記の知見等に基づき、同じ振動発
生器を用いて、プリント基板の大きさや重量の大小にか
かわらず充分に共振振動するようにし、もってプリント
基板の大きさや重量の大小にかかわらずスルーホール内
に生ずる気泡を効率的に完全除去することを目的とする
。Therefore, based on the above findings, the present invention uses the same vibration generator to generate sufficient resonance vibration regardless of the size and weight of the printed circuit board. The purpose is to efficiently and completely remove air bubbles that occur inside the through-hole.
(問題点を解決するための手段)
かかる目的を達成するために、本発明は以下のように構
成した。(Means for Solving the Problems) In order to achieve the above object, the present invention was constructed as follows.
すなわち、請求項1の発明は、小孔を有するプリント基
板を弾性体を介在して支持する支持体と、
その支持体に支持したプリント基板を浸漬する処理液槽
と、
その処理液槽内に浸漬した支持体を振動する振動発生器
と、
その振動発生器の発生振動数を調節変更する振動数調節
器と、
を備えて成るものである。That is, the invention of claim 1 provides a support for supporting a printed circuit board having small holes with an elastic body interposed therebetween, a processing liquid tank in which the printed circuit board supported on the support is immersed, and a processing liquid tank in which the printed circuit board is immersed. This device comprises a vibration generator that vibrates a submerged support, and a frequency adjuster that adjusts and changes the frequency of vibration generated by the vibration generator.
また、請求項2の発明は、小孔を有するプリント基板を
弾性体を介在して支持する支持体と、その支持体に支持
したプリント基板を浸漬する処理液槽と、
前記プリント基板の重量を検出する重量センサと、
その検出重量に基づき、前記プリント基板の固有振動数
を算出する振動数算出手段と、その算出された固有振動
数の近傍値の振動数となるように前記プリント基板を振
動する振動発生手段と、
を備えて成るものである。Further, the invention of claim 2 provides a support body that supports a printed circuit board having small holes with an elastic body interposed therebetween, a processing liquid tank in which the printed circuit board supported by the support body is immersed, and a weight of the printed circuit board. a weight sensor for detecting; a frequency calculating means for calculating the natural frequency of the printed circuit board based on the detected weight; and a vibration frequency calculating means for calculating the natural frequency of the printed circuit board based on the detected weight; and vibration generating means.
(作 用)
請求項1の発明では、振動数調節器21の操作によって
、作業者が振動発生器6の発生振動数を自在に調節でき
る。(Function) In the invention of claim 1, the operator can freely adjust the frequency of vibration generated by the vibration generator 6 by operating the frequency adjuster 21.
そのため、振動数調節器21を操作することによって、
振動発生器6の発生振動数をプリント基板3の固有振動
数に等しくさせることができ、プリント基板3には、そ
の大きさや重量の大小にかかわらず、振動発生器6の振
動エネルギーが効率的に伝達される。Therefore, by operating the frequency adjuster 21,
The frequency of vibration generated by the vibration generator 6 can be made equal to the natural frequency of the printed circuit board 3, and the vibration energy of the vibration generator 6 can be efficiently transferred to the printed circuit board 3 regardless of its size or weight. communicated.
請求項2の発明では、重量センサ17の検出重量に基づ
き、プリント基板3の固有振動数が算出され、この算出
値近傍の振動がプリント基板3に付与される。In the invention of claim 2, the natural frequency of the printed circuit board 3 is calculated based on the weight detected by the weight sensor 17, and vibrations near this calculated value are applied to the printed circuit board 3.
従って、プリント基板3は、自動的に、その大きさや重
量の大小にかかわらず効率的に振動できる。Therefore, the printed circuit board 3 can automatically and efficiently vibrate regardless of its size and weight.
(実施例) 以下、図面を参照して本発明の詳細な説明する。(Example) Hereinafter, the present invention will be described in detail with reference to the drawings.
第1図は本発明の実施例を、プリント基板の製造工程ラ
インに適用した概略斜視図である。FIG. 1 is a schematic perspective view of an embodiment of the present invention applied to a manufacturing process line for printed circuit boards.
図において、1および2はそれぞれプリント基板3を製
造する際に、メツキ処理や洗浄処理などの液体処理を行
う各種の処理液槽である。プリント基板3は、スルーホ
ール4のような小孔を有するとともに多層化されたもの
である。In the figure, reference numerals 1 and 2 are various treatment liquid tanks that perform liquid treatments such as plating and cleaning when manufacturing the printed circuit board 3, respectively. The printed circuit board 3 has small holes such as through holes 4 and is multilayered.
処理液槽lおよび2の配列方向には、その配列方向の左
右に沿って一対のキャリヤバー受は台5.5をそれぞれ
設ける。そして、そのキャリヤバー受は台5.5上に、
左右一対の振動発生器6.6をそれぞれ配置する。In the arrangement direction of the processing liquid tanks 1 and 2, a pair of carrier bar supports 5.5 are respectively provided along the left and right sides of the arrangement direction. Then, the carrier bar holder is placed on the stand 5.5.
A pair of left and right vibration generators 6.6 are respectively arranged.
7はキャリヤバーであり、プリント基板3を吊るす一対
の共振用ばね8.8を取付け、この各共振用ばね8.8
の先端にプリント基板3を連結するクリップ9を設ける
。従って、プリント基板3は、共振用ばね8.8を介し
てキャリヤバー7に支持される。7 is a carrier bar, and a pair of resonance springs 8.8 for suspending the printed circuit board 3 are attached to each of the resonance springs 8.8.
A clip 9 for connecting the printed circuit board 3 is provided at the tip. Therefore, the printed circuit board 3 is supported by the carrier bar 7 via the resonance spring 8.8.
キャリヤバー7の左右両端には、振動発生器6に設けた
7字受け10.10と嵌合すべき7字部11.11を形
成する。この7字受け10と7字部11との嵌合箇所に
は、嵌合時の結合力を強化するために、電磁力や空気圧
などを利用した構造を設けるのが好ましい。At both left and right ends of the carrier bar 7, there are formed figure 7 parts 11.11 which are to be fitted into figure 7 receivers 10.10 provided on the vibration generator 6. In order to strengthen the coupling force at the time of fitting, it is preferable to provide a structure that utilizes electromagnetic force, air pressure, etc. at the fitting location between the figure 7 receiver 10 and the figure 7 portion 11.
キャリヤバー7は、搬送装置の搬送杆12に設けた7字
受け13.13と嵌合する左右一対の7字部14.14
を有する。キャリヤバー7は、この搬送杆12に支持さ
れて各処理液槽1および2の配列方向に移動可能にする
とともに、各処理液槽1および2の頭上の位置で上昇お
よび下降される。キャリヤバー7が下降して、その7字
部11が対応する7字受け10.10に嵌合すると、そ
の位置にキャリヤバー7が位置決め固定される。The carrier bar 7 has a pair of left and right 7-shaped portions 14.14 that fit into 7-shaped receptacles 13.13 provided on the conveying rod 12 of the conveying device.
has. The carrier bar 7 is supported by the transport rod 12 and is movable in the direction in which the processing liquid tanks 1 and 2 are arranged, and is raised and lowered at a position above the processing liquid tanks 1 and 2. When the carrier bar 7 is lowered and its 7-shaped portion 11 is fitted into the corresponding 7-shaped receiver 10.10, the carrier bar 7 is positioned and fixed at that position.
次に、振動発生器6について第2図を参照して説明する
。Next, the vibration generator 6 will be explained with reference to FIG. 2.
図において、15.15は一対の防振用ばねであり、そ
の下端をキャリヤバー受は台5上にそれぞれ固定すると
ともに、上端を振動板16の下面にそれぞれ固定し、振
動板16をキャリヤバー受は台5上に弾発的に支持する
。さらに、その振動板16上には、7字受け10を固定
する。In the figure, reference numerals 15 and 15 indicate a pair of vibration isolating springs, the lower ends of which are fixed on the carrier bar holder 5, and the upper ends of which are respectively fixed to the lower surface of the diaphragm 16. The receiver is elastically supported on the stand 5. Furthermore, a seven-figure receiver 10 is fixed on the diaphragm 16.
18は、振動板16を振動させる振動モータであり、振
動板16の下面に固定する。振動モータ18が回転する
と、そのモータ軸の一端に固定されたアンバランスウェ
イ)18Aによって、振動板16が一対の防振用ばね1
5.15の弾力を受けて振動する。18 is a vibration motor that vibrates the diaphragm 16, and is fixed to the lower surface of the diaphragm 16. When the vibration motor 18 rotates, the diaphragm 16 is connected to the pair of vibration isolating springs 1 by an unbalance way 18A fixed to one end of the motor shaft.
It vibrates due to the elasticity of 5.15.
振動板工6の振動源としては、上述の振動モータ18に
代えて、いわゆる電磁式バイブレータまたはエア式バイ
ブレータを用いてもよい。As a vibration source for the diaphragm 6, a so-called electromagnetic vibrator or an air vibrator may be used instead of the vibration motor 18 described above.
次に、以上のように構成する実施例の電気系統のブロッ
ク図について、第3図を参照して説明する。Next, a block diagram of the electrical system of the embodiment configured as described above will be explained with reference to FIG. 3.
20は、誘導型の振動モータ18に交流電力を供給する
可変周波数電源装置である。この電源装置20は、例え
ば商用電源を直流に変換する半導体整流器を有するとと
もに、その変換された直流を任意の周波数の交流に変換
するインバータを有する。20 is a variable frequency power supply device that supplies AC power to the induction type vibration motor 18. This power supply device 20 includes, for example, a semiconductor rectifier that converts commercial power to direct current, and an inverter that converts the converted direct current to alternating current of an arbitrary frequency.
21は、振動モータ18の回転速度、換言すれば振動発
生器6の振動数を連続的に手動で調節できる振動数調節
器である。この振動数調節器21は、調節つまみ21A
の操作によってその振動数を調節する。Reference numeral 21 denotes a frequency adjuster that can continuously and manually adjust the rotational speed of the vibration motor 18, in other words, the frequency of the vibration generator 6. This frequency adjuster 21 has an adjustment knob 21A.
Its frequency is adjusted by operating the .
22は、可変周波数電源装置20の出力周波数を、振動
数調節器21の調節に応じて、制御する制御回路である
。22 is a control circuit that controls the output frequency of the variable frequency power supply device 20 in accordance with the adjustment of the frequency adjuster 21.
次に、このように構成する実施例の動作例について説明
する。ここで、処理液槽lを例えば無電解メツキを行う
メツキ槽とする。Next, an example of the operation of the embodiment configured as described above will be explained. Here, the processing liquid tank 1 is assumed to be a plating tank for performing electroless plating, for example.
いま、搬送装置の搬送杆12に支持されたキャリヤバー
7が、搬送杆12の下降に伴って下降し、その左右両端
に形成した7字部11.11が、対応する7字受け10
.10に嵌合して位置が固定されると、搬送杆12はキ
ャリヤバー7より離脱し上方の所定位置に戻る。Now, the carrier bar 7 supported by the transport rod 12 of the transport device is lowered as the transport rod 12 is lowered, and the 7-shaped portions 11.11 formed on both left and right ends of the carrier bar 7 are aligned with the corresponding 7-shaped receivers 10.
.. 10 and the position is fixed, the conveying rod 12 is detached from the carrier bar 7 and returns to a predetermined position above.
キャリヤバー7が7字受け10.10に固定されると、
キャリヤバー7に共振用ばね8.8を介して支持された
プリント基板3は、処理液槽lの液中に完全に浸漬した
状態となる。When the carrier bar 7 is fixed to the figure 7 receiver 10.10,
The printed circuit board 3 supported by the carrier bar 7 via the resonance spring 8.8 is completely immersed in the liquid in the processing liquid tank l.
次に、振動発生器6.6の振動モータ18.18をそれ
ぞれ起動し、振動板16.16が振動を開始する。そし
て、この振動板16の振動は、7字受け10、キャリヤ
バー7、共振用ばね8を経由して伝導し、プリント基板
3が振動する。Next, the vibration motors 18.18 of the vibration generators 6.6 are respectively activated, and the diaphragm 16.16 begins to vibrate. The vibration of the diaphragm 16 is transmitted via the figure-7 receiver 10, the carrier bar 7, and the resonance spring 8, causing the printed circuit board 3 to vibrate.
ところで、プリント基板3は、自己の重量や共振用ばね
8のばね定数によって定まる固有振動数を有する。By the way, the printed circuit board 3 has a natural frequency determined by its own weight and the spring constant of the resonance spring 8.
そこで、次に振動数調節器21の調節つまみ21Aを連
続的に操作すると、この操作に応じて可変周波数電源装
置20から出力される交流の周波数が変化し、これに伴
って振動モータ18の回O
転数が変化するので、プリント基板3の振動数が変化し
ていく。そして、この可変振動数がプリント基板3の固
有振動数に等しくなって共振状態になると、プリント基
板3の振動は最大になる。Therefore, when the adjustment knob 21A of the frequency adjuster 21 is continuously operated, the frequency of the alternating current output from the variable frequency power supply device 20 changes in accordance with this operation, and the rotation of the vibration motor 18 is accordingly changed. O As the rotation number changes, the vibration frequency of the printed circuit board 3 changes. When this variable frequency becomes equal to the natural frequency of the printed circuit board 3 and a resonance state occurs, the vibration of the printed circuit board 3 becomes maximum.
そこで、プリント基板3の固有振動数に等しくなるよう
に、またはその付近の値になるように、振動数調節器2
1の調節つまみ21Aを調節し、その調節を終了する。Therefore, the frequency adjuster 2 is adjusted so that it is equal to the natural frequency of the printed circuit board 3 or has a value close to the natural frequency.
Adjust the adjustment knob 21A of No. 1 and complete the adjustment.
これにより、振動モータ18からの振動が効率的にプリ
ント基板3に伝達される状態となる。Thereby, vibrations from the vibration motor 18 are efficiently transmitted to the printed circuit board 3.
ここであらかじめ、プリント基板3またはキャリヤバー
7に加速度計(図示しない)を付設しておき、調節つま
み21Aを回わして振動発生器6の振動数を変えながら
、加速度計の指針が最大に振れたところで調節つまみ2
1を止めれば、振動発生器6の振動数を容易に固有振動
数に合わせることができる。Here, an accelerometer (not shown) is attached to the printed circuit board 3 or the carrier bar 7 in advance, and while changing the frequency of the vibration generator 6 by turning the adjustment knob 21A, the pointer of the accelerometer swings to the maximum. Adjustment knob 2
1, the frequency of the vibration generator 6 can be easily matched to the natural frequency.
このようにして振動数調節器21の操作により、振動モ
ータ18の速所調節を終了すると、以後、その条件の下
でプリント基板3の量産が可能となる。When the speed adjustment of the vibration motor 18 is completed by operating the frequency adjuster 21 in this way, mass production of printed circuit boards 3 becomes possible under these conditions.
このようにすれば、スルーホール4のメツキ層の形成過
程において、プリント基板3は液体処理液槽1内で常時
効率的に振動するので、この振動によってスルーホール
中の気泡やスルーホール4中に発生する気泡を完全に除
去できる。そのため、プリント基板3の有する全てのス
ルーホールの内面に所定のメツキ被膜が確実に形成され
る。In this way, during the process of forming the plating layer of the through hole 4, the printed circuit board 3 is constantly and efficiently vibrated in the liquid processing liquid tank 1, so that the vibration causes air bubbles in the through hole and the inside of the through hole 4. Generated air bubbles can be completely removed. Therefore, a predetermined plating film is reliably formed on the inner surfaces of all the through holes of the printed circuit board 3.
そして、スルーホール4のメツキ被膜形成が終了すると
、搬送杆12によってキャリヤバー7を吊り上げプリン
ト基板3を処理液槽1から引き上げ、次の処理工程に移
動する。When the formation of the plating film on the through holes 4 is completed, the carrier bar 7 is lifted up by the transport rod 12, the printed circuit board 3 is lifted out of the processing liquid tank 1, and the printed circuit board 3 is moved to the next processing step.
次に、本発明の他の実施例について第4図および第5図
を参照して説明する。Next, another embodiment of the present invention will be described with reference to FIGS. 4 and 5.
この実施例は、第1図および第2図で示した実施例に加
えて、第4図で示すようなプリント基板3の重量を測定
する重量センサ17を設けたものである。In this embodiment, in addition to the embodiments shown in FIGS. 1 and 2, a weight sensor 17 for measuring the weight of the printed circuit board 3 as shown in FIG. 4 is provided.
すなわち、この実施例は、第4図に示すように振動板1
6と7字受け10との間に、ロードセルなどのような重
量センサ17を介在する。この重量センサ17は、振動
発生器6の一方または両方に設ける。That is, in this embodiment, as shown in FIG.
A weight sensor 17 such as a load cell is interposed between the 6 and 7 figure receivers 10. This weight sensor 17 is provided on one or both of the vibration generators 6.
次に、この実施例の電気系ブロック図について第5図を
参照して説明する。Next, the electrical system block diagram of this embodiment will be explained with reference to FIG.
図において、23は、重量センサ17が測定するプリン
ト基板3の検出重量に基づいて振動モータ18の回転速
度、換言すれば振動発生器6の発生振動数を算出する振
動数算出回路である。24は、その振動数算出回路23
で算出された算出値に応じて、可変周波数電源装置20
から出力される周波数を制御する制御回路である。In the figure, 23 is a frequency calculation circuit that calculates the rotational speed of the vibration motor 18, in other words, the frequency of vibration generated by the vibration generator 6, based on the detected weight of the printed circuit board 3 measured by the weight sensor 17. 24 is the frequency calculation circuit 23
The variable frequency power supply device 20
This is a control circuit that controls the frequency output from the
このように構成する実施例では、第4図に示すように、
キャリヤバー7の7字部11が7字受け10に嵌合する
と、重量センサ17がプリント基板3の重量を検出し、
その検出重量が振動数設定回路23に出力される。In the embodiment configured in this way, as shown in FIG.
When the figure 7 part 11 of the carrier bar 7 fits into the figure 7 receiver 10, the weight sensor 17 detects the weight of the printed circuit board 3,
The detected weight is output to the frequency setting circuit 23.
振動数設定回路23は、検出重量に・基づき、プリント
基板3の固有振動数に対応する振動モータ18の回転速
度を算出する。この算出値は、プリント基板3の固有振
動数と同一か、またはその固有振動数の近傍値とする。The vibration frequency setting circuit 23 calculates the rotation speed of the vibration motor 18 corresponding to the natural frequency of the printed circuit board 3 based on the detected weight. This calculated value is the same as the natural frequency of the printed circuit board 3 or a value close to the natural frequency.
これにより、可変周波数電源装置20からの出力周波数
は所定値となり、振動モータ18は振動数設定回路23
が算出した回転速度で回転する。As a result, the output frequency from the variable frequency power supply device 20 becomes a predetermined value, and the vibration motor 18 is controlled by the frequency setting circuit 23.
It rotates at the rotation speed calculated by .
その結果、振動モータ18からの振動が効率的にプリン
ト基板3に伝達されるので、第1図および第2図による
実施例で説明したと同様に、プリント基板3の有する全
てのスルーホールの内面に所定のメツキ被膜が確実に形
成される。As a result, the vibrations from the vibration motor 18 are efficiently transmitted to the printed circuit board 3, so that the inner surfaces of all the through holes of the printed circuit board 3 are A predetermined plating film is reliably formed on the surface.
以上説明したふたつの実施例のいづれにおいても、振動
発生器6の振動数は、具体的にはプリント基板3の固有
振動数の10%減程度が好ましい。加速度計による場合
は、振動発生器により加える力の2〜4倍程度の振動と
なる程度が好ましい。固有振動数に一致するとプリント
基板の加速度が急激に増大して振動発生器の力の数10
倍にも達し、基板を損傷する危険があるからである。In either of the two embodiments described above, the frequency of the vibration generator 6 is preferably about 10% lower than the natural frequency of the printed circuit board 3. When using an accelerometer, it is preferable that the vibration be about 2 to 4 times the force applied by the vibration generator. When it matches the natural frequency, the acceleration of the printed circuit board increases rapidly, and the force of the vibration generator increases to 10
This is because there is a risk of damaging the board.
なお振動発生器の振動数が固有振動数の10%増であっ
ても、加速度はほぼ2〜4倍に低下するが、振動を停止
する際、途中で必ず固有振動数に一致することになり、
過剰な振動を回避できないから、振動数は固有振動数よ
りも低いことがこのましい。Note that even if the frequency of the vibration generator is 10% higher than the natural frequency, the acceleration will drop by approximately 2 to 4 times, but when the vibration is stopped, it will always match the natural frequency halfway. ,
Since excessive vibration cannot be avoided, the frequency is preferably lower than the natural frequency.
(発明の効果)
これを要するに、請求項1の発明では、振動発生器の発
生振動数を調節自在な振動数調節器を設け、その発生振
動数をプリント基板3の固有振動数に一致できるように
したので、プリント基板は、その大きさや重量の大小に
かかわらず、振動発生器の振動エネルギーが効率的に伝
達される。(Effects of the Invention) In short, in the invention of claim 1, a frequency adjuster is provided which can freely adjust the frequency of vibration generated by the vibration generator, and the frequency of vibration can be made to match the natural frequency of the printed circuit board 3. Therefore, the vibration energy of the vibration generator is efficiently transmitted to the printed circuit board, regardless of its size or weight.
従って、請求項1の発明では、プリント基板をメツキ槽
や洗浄槽などの各種処理液槽内に浸漬した状態で十分に
振動させることができ、プリント基板のスルーホール内
に存在する気泡を完全に除去できるので、よってメツキ
処理や洗浄処理が確実なものとなる。Therefore, in the invention of claim 1, the printed circuit board can be sufficiently vibrated while immersed in various treatment liquid tanks such as plating tanks and cleaning tanks, and air bubbles existing in the through holes of the printed circuit board can be completely removed. Since it can be removed, plating and cleaning processes can be performed reliably.
また、請求項2の発明では、プリント基板の重量を検出
する重量検出センサを設け、その検出重量に基づいてプ
リント基板の固有振動数を算出し、その算出値の振動が
プリント基板に付与されるようにしたので、プリント基
板の大きさや重量の大小にかかわらず振動エネルギーを
プリント基板に効率的に伝達できる。従って、請求項2
の発明では、プリント基板の効率的な振動を何ら調節を
行うことなく自動的に実現できるとともに、プリント基
板は請求項1の発明と同様に処理できる。Further, in the invention of claim 2, a weight detection sensor is provided to detect the weight of the printed circuit board, the natural frequency of the printed circuit board is calculated based on the detected weight, and the vibration of the calculated value is imparted to the printed circuit board. As a result, vibration energy can be efficiently transmitted to the printed circuit board regardless of the size and weight of the printed circuit board. Therefore, claim 2
According to the invention of claim 1, efficient vibration of the printed circuit board can be automatically realized without any adjustment, and the printed circuit board can be processed in the same manner as the invention of claim 1.
第1図は本発明実施例の全体斜視図、第2図はその振動
発生器の構成を示す図、第3図は本発明実施例の電気系
のブロック図、第4図は本発明の他の実施例の振動発生
器の構成を示す図、第5図はその他の実施例の電気系の
ブロック図である。
1.2は処理液槽、3はプリント基板、4はスルーホー
ル、6は振動発生器、7はキャリヤバー、8は共振用ば
ね、17は重量センサ、18は振動モータ、20は可変
周波数電源装置、21は振動数調節器、23は振動数算
出回路。
第
図
第
図
第
図
第
図FIG. 1 is an overall perspective view of an embodiment of the present invention, FIG. 2 is a diagram showing the configuration of the vibration generator, FIG. 3 is a block diagram of the electrical system of the embodiment of the present invention, and FIG. 4 is a diagram showing the other embodiment of the present invention. FIG. 5 is a block diagram of the electrical system of another embodiment. 1.2 is a processing liquid tank, 3 is a printed circuit board, 4 is a through hole, 6 is a vibration generator, 7 is a carrier bar, 8 is a resonance spring, 17 is a weight sensor, 18 is a vibration motor, 20 is a variable frequency power supply 21 is a frequency adjuster, and 23 is a frequency calculation circuit. Figure Figure Figure Figure Figure
Claims (2)
する支持体と、 その支持体に支持したプリント基板を浸漬する処理液槽
と、 その処理液槽内に浸漬した支持体を振動する振動発生器
と、 その振動発生器の発生振動数を調節変更する振動数調節
器と、 を備えて成るプリント基板製造装置。1. A support body that supports a printed circuit board having small holes through an elastic body, a processing liquid tank in which the printed circuit board supported on the support body is immersed, and a vibration generator that vibrates the support body immersed in the processing liquid tank. A printed circuit board manufacturing device comprising: a vibration generator; a frequency adjuster for adjusting and changing the frequency of vibration generated by the vibration generator;
する支持体と、 その支持体に支持したプリント基板を浸漬する処理液槽
と、 前記プリント基板の重量を検出する重量センサと、 その検出重量に基づき、前記プリント基板の固有振動数
を算出する振動数算出手段と、 その算出された固有振動数の近傍値の振動数となるよう
に前記プリント基板を振動する振動発生手段と、 を備えて成るプリント基板製造装置。2. A support body that supports a printed circuit board having small holes with an elastic body interposed therebetween; a processing liquid tank in which the printed circuit board supported by the support body is immersed; a weight sensor that detects the weight of the printed circuit board; and a weight sensor that detects the weight of the printed circuit board. a frequency calculating means for calculating the natural frequency of the printed circuit board based on the above, and a vibration generating means for vibrating the printed circuit board so as to have a frequency close to the calculated natural frequency. Printed circuit board manufacturing equipment consisting of:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17298088A JPH0666550B2 (en) | 1988-07-12 | 1988-07-12 | Printed circuit board manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17298088A JPH0666550B2 (en) | 1988-07-12 | 1988-07-12 | Printed circuit board manufacturing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0223697A true JPH0223697A (en) | 1990-01-25 |
| JPH0666550B2 JPH0666550B2 (en) | 1994-08-24 |
Family
ID=15951937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17298088A Expired - Lifetime JPH0666550B2 (en) | 1988-07-12 | 1988-07-12 | Printed circuit board manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0666550B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5077099A (en) * | 1990-03-14 | 1991-12-31 | Macdermid, Incorporated | Electroless copper plating process and apparatus |
| WO2002006561A3 (en) * | 2000-07-13 | 2002-12-27 | Alan G Thompson | Process for deposition of metal on a surface |
| WO2004009875A3 (en) * | 2002-07-24 | 2004-06-10 | Applied Materials Inc | Tilted electrochemical plating cell with constant wafer immersion angle |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101940528B1 (en) * | 2018-09-28 | 2019-01-21 | 이희범 | Plating Tank for gold plating |
-
1988
- 1988-07-12 JP JP17298088A patent/JPH0666550B2/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5077099A (en) * | 1990-03-14 | 1991-12-31 | Macdermid, Incorporated | Electroless copper plating process and apparatus |
| JPH04228578A (en) * | 1990-03-14 | 1992-08-18 | Macdermid Inc | Electroless copper plating method and apparatus |
| WO2002006561A3 (en) * | 2000-07-13 | 2002-12-27 | Alan G Thompson | Process for deposition of metal on a surface |
| US7172785B2 (en) | 2000-07-13 | 2007-02-06 | Thompson G Alan | Process for deposition of metal on a surface |
| WO2004009875A3 (en) * | 2002-07-24 | 2004-06-10 | Applied Materials Inc | Tilted electrochemical plating cell with constant wafer immersion angle |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0666550B2 (en) | 1994-08-24 |
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