JPH0224139A - Multilayer film for release - Google Patents
Multilayer film for releaseInfo
- Publication number
- JPH0224139A JPH0224139A JP17266688A JP17266688A JPH0224139A JP H0224139 A JPH0224139 A JP H0224139A JP 17266688 A JP17266688 A JP 17266688A JP 17266688 A JP17266688 A JP 17266688A JP H0224139 A JPH0224139 A JP H0224139A
- Authority
- JP
- Japan
- Prior art keywords
- intermediate layer
- layer
- laminating process
- layers
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004743 Polypropylene Substances 0.000 claims abstract description 16
- 229920001155 polypropylene Polymers 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 11
- -1 polypropylene Polymers 0.000 claims abstract description 7
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000005977 Ethylene Substances 0.000 claims abstract description 5
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229920006026 co-polymeric resin Polymers 0.000 claims abstract description 3
- 239000011116 polymethylpentene Substances 0.000 claims description 10
- 229920000306 polymethylpentene Polymers 0.000 claims description 9
- 238000003475 lamination Methods 0.000 claims description 5
- 239000004840 adhesive resin Substances 0.000 abstract description 3
- 229920006223 adhesive resin Polymers 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000001125 extrusion Methods 0.000 abstract description 2
- 229920005604 random copolymer Polymers 0.000 abstract description 2
- 238000010030 laminating Methods 0.000 abstract 4
- 239000010410 layer Substances 0.000 description 29
- 239000002344 surface layer Substances 0.000 description 15
- 239000004698 Polyethylene Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 3
- 210000004709 eyebrow Anatomy 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000005026 oriented polypropylene Substances 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920006378 biaxially oriented polypropylene Polymers 0.000 description 1
- 239000011127 biaxially oriented polypropylene Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、フレキシブルプリントサーキット（以下ｒＦ
ＰｃＪと略記）等の製造時に用いる、いわゆるプレスワ
ーク用離型多層フィルムに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to flexible printed circuits (rF
The present invention relates to a so-called release multilayer film for press work, which is used in the production of products such as PcJ (abbreviated as PcJ).
（従来の技術）
ＦＰＣの製造工程に際して、耐熱フィルム、例えばカプ
トン上にＣｕをパターンニングしたベースフィルムを作
り、その上にオーバーレイと称する接着剤付き耐熱フィ
ルムを絶縁および断熱の目的でプレスラミネートするの
が通常である。(Prior art) In the manufacturing process of FPC, a base film is made by patterning Cu on a heat-resistant film such as Kapton, and a heat-resistant film with an adhesive called an overlay is press-laminated on top of it for the purpose of insulation and heat insulation. is normal.
かかるプレスワーク工程においては、ＦＰＣの表面の汚
れを防ぎ、ＦＰＣおよびプレス板との離型性を持ち、か
つ、Ｃｕエツチング面へのオーバーレイの十分な喰い込
み性、ＦＰＣ全体を包み込むことによるＦＰＣ端面から
の接着剤染み出し防止、銅端子への密着による汚れ防止
、すなわち、離型性、対形状追従性即ち、オーバーレイ
の銅パターン凹凸への均一な密着性等の特性が良好なシ
ートが望まれていた。In such a press work process, it is necessary to prevent the surface of the FPC from becoming dirty, to have mold releasability between the FPC and the press plate, to have sufficient biting ability for the overlay on the Cu-etched surface, and to protect the FPC end face by wrapping the entire FPC. It is desirable to have a sheet that has good properties such as prevention of adhesive seepage from the copper terminal, prevention of staining due to adhesion to the copper terminal, releasability, conformability to shape, uniform adhesion to the unevenness of the overlay copper pattern, etc. was.
このため、従来外層には離型性、内層には熱時流動性を
持つよう、２種類のシートを３層に重ねて使用していた
。For this reason, two types of sheets were conventionally used in three layers, with the outer layer having mold releasability and the inner layer having fluidity when heated.
例えば、離型性を有する樹脂としては、ポリプロピレン
（ｐｐ）、ポリメチルペンテン（ＰＭＰ）、２軸延伸ポ
リプロピレン（ｏｐｐ）、ポリエステル（ＰＥＴ）等が
あり、流動性を有する樹脂としては、ポリエチレン（Ｐ
Ｒ）、ポリ塩化ビニル（ｐｖｃ）、シリコンゴム等があ
る。３屡の組み合わせとしては、ＰＰ／ＰＥ／ＰＰ、Ｐ
Ｐ／ＰＥ／ＰＰ、ＰＰ／ＰＥ／ＰＭＰ、ＰＰ／ＰＥ／Ｐ
ＥＴ、ＯＰＰ／ＰＥ１０ＰＰ等があった。For example, resins with mold release properties include polypropylene (PP), polymethylpentene (PMP), biaxially oriented polypropylene (OPP), polyester (PET), etc., and resins with fluidity include polyethylene (PET).
R), polyvinyl chloride (PVC), silicone rubber, etc. The three most common combinations are PP/PE/PP, P
P/PE/PP, PP/PE/PMP, PP/PE/P
There were ET, OPP/PE10PP, etc.
以上のように、３層に重ねて使用するため、生産性が著
しく…われていた。As described above, since three layers are used, productivity has been significantly reduced.
また、以上の中で、中間層としては、ＰＶＣを除いて流
動性が十分でなく、ＦＰＣ中に気泡が残る。しかも、Ｐ
ｖＣは処理上の問題があり、好ましくなかった。Moreover, among the above, the intermediate layer, except for PVC, does not have sufficient fluidity, and bubbles remain in the FPC. Moreover, P
vC had processing problems and was not desirable.
その目的とするところは、離型性および対形状追従性が
著しく優れたシートを多層積層シートとして提供するに
ある。The purpose is to provide a multilayer laminated sheet with extremely excellent mold releasability and shape followability.
本発明は、中間層がエチレンとメチルメタクリレートの
共重合樹脂であり、中間層をはさむ上下層がポリプロピ
レン又はポリメチルペンテンを用いることを特徴とする
プリントサーキットラミネート工程用離型多層フィルム
である。The present invention is a release multilayer film for a printed circuit lamination process, in which the intermediate layer is made of a copolymer resin of ethylene and methyl methacrylate, and the upper and lower layers sandwiching the intermediate layer are made of polypropylene or polymethylpentene.
本発明に用いられる中間層はエチレンとメチルメタクリ
レートのランダム共重合体である。また中間層をはさむ
上下層はポリプロピレン又はポリメチルペンテンである
。ポリメチルペンテンの構造式は次に示す。The intermediate layer used in the present invention is a random copolymer of ethylene and methyl methacrylate. The upper and lower layers sandwiching the intermediate layer are made of polypropylene or polymethylpentene. The structural formula of polymethylpentene is shown below.
＋ＣＨ−ＣＨ，）１１ ＣＨ。+CH-CH,)11 CH.
ＣＨ（ＣＨｓ）ｚ 上下層は必ずしも同＃Ｍ脂でなくてもよい。CH(CHs)z The upper and lower layers do not necessarily have to be made of the same #M fat.
本発明の主たる構成要素は、上部表層、中間層、下部表
層の３層であるが、上部表層と中間層の眉間、および中
間層と下部表層の眉間に接着樹脂層を介してもさしつか
えなく、接着樹脂層の内容について、本発明の規定する
ものではない。The main components of the present invention are three layers: an upper surface layer, an intermediate layer, and a lower surface layer, but an adhesive resin layer may be used between the eyebrows of the upper surface layer and the intermediate layer, and between the eyebrows of the intermediate layer and the lower surface layer. The content of the adhesive resin layer is not defined by the present invention.
中間層と上下表層の構成比率は本発明で規定するもので
はないが、５０ ： ５０ないしは９０ ： １０の範
囲が好ましい、厚みについては、０．０５ｍないし０．
３ｍの範囲が好ましい。Although the composition ratio of the intermediate layer to the upper and lower surface layers is not specified by the present invention, it is preferably in the range of 50:50 to 90:10, and the thickness is between 0.05 m and 0.05 m.
A range of 3 m is preferred.
本発明のプリントサーキットラミ１−ト工程用離型多層
フィルムの製法は、共押出ラミネート工法、押出ラミネ
ート工法、ドライラミネート工法等のいずれの工法でも
良い。The release multilayer film for the printed circuit lamination process of the present invention may be produced by any method such as coextrusion lamination, extrusion lamination, dry lamination, or the like.
（実施例−１）３台の押出機にそれぞれ上表層としてＰ
Ｐ、下表層として同じ＜ＰＰ、中間層としてＥＭＭＡを
供給し、三層ダイスにより押出し、積層一体化し、厚み
２００μのフィルムとした。(Example-1) P was used as the upper surface layer in each of the three extruders.
P, the same <PP as the lower surface layer, and EMMA as the intermediate layer were supplied, and extruded using a three-layer die, and laminated and integrated to form a film with a thickness of 200 μm.
各層の厚みは上、中、下層はそれぞれ５０μ、１００μ
、５０μであった。The thickness of each layer is 50μ and 100μ for the top, middle, and bottom layers, respectively.
, 50μ.
（実施例−２）上表層、および下表層にＰＭＰを用いた
ほかは実施例１に準じて積層フィルムを得た。(Example 2) A laminated film was obtained according to Example 1 except that PMP was used for the upper surface layer and the lower surface layer.
（実施例−３）上表層、および下表層の一方にＰＰ１他
方にＰＭＰを用いたほかは、実施例１に準して積層フィ
ルムを得た。(Example 3) A laminated film was obtained according to Example 1, except that PP was used for one of the upper surface layer and the lower surface layer, and PMP was used for the other.
（比較例−１）ＰＰ、およびＰＥを単層で押出し上表層
、および下表層がＰＰ、中間層がＰＥとなるよう３層に
積層し、厚み２００μのフィルムとした。各層の厚みは
上、中、下層はそれぞれ５０μ、ｌＯＯμ、５０μであ
った。(Comparative Example-1) A single layer of PP and PE was extruded and laminated into three layers such that the upper surface layer and lower surface layer were PP, and the middle layer was PE, to form a film with a thickness of 200 μm. The thickness of each layer was 50μ, 1OOμ, and 50μ for the upper, middle, and lower layers, respectively.
（比較例−２）中間層にエチレン−ビニルアセテート共
重合体を用いたほかは、比較例−１に準じて積層フィル
ムを得た。(Comparative Example-2) A laminated film was obtained according to Comparative Example-1 except that an ethylene-vinyl acetate copolymer was used for the intermediate layer.
（比較例−３）上表層および下表層にＰＭＰ、中間層と
してＰｖＣを用いたほかは、比較例−１に準じて積層フ
ィルムを得た。(Comparative Example-3) A laminated film was obtained according to Comparative Example-1, except that PMP was used for the upper surface layer and the lower surface layer, and PvC was used for the intermediate layer.
（適用試験）
実施例、比較例で得た積層フィルムについて実際にＦＰ
Ｃのプレスに用い下記の評価を行った。(Application test) FP was actually applied to the laminated films obtained in the examples and comparative examples.
The following evaluation was performed using the press C.
多段型プレス機を用い前記積層フィルム、ＦＰＣ１前記
積層フィルムの順に重ね、１５０°Ｃ，３０ｋｇ／ｃｄ
で６０分加圧後、５０°Ｃになるまで加圧冷却した。The laminated film and the FPC1 laminated film were stacked in this order using a multi-stage press machine at 150°C and 30 kg/cd.
After pressurizing for 60 minutes, the mixture was cooled under pressure to 50°C.
この後、ＦＰＣを取り出し銅端子の汚染、ＦＰＣからの
接着剤の浸み出し、ＦＰＣのＰ１フィルム間の密着性（
気泡の有無より判断）、ＦＰＣとの離型性について評価
した。After this, the FPC was taken out and the copper terminals were contaminated, the adhesive oozed from the FPC, and the adhesion between the P1 films of the FPC (
(Judging from the presence or absence of air bubbles), and mold releasability from FPC was evaluated.
結果を表−１に掲げる。The results are listed in Table-1.
表−１
表より、本発明の積層フィルムにおいては、銅端子の汚
染が見られず接着剤の浸み出しが少なく、ＰＩフィルム
同士の密着性が良好であったことより、中間層のＥＭＭ
Ａが十分な流動特性を持つことを示しており、また、Ｆ
ＰＣ，プレス板に対する離型性はＰＰ、ＰＭＰともに良
好であった。Table 1 From the table, it can be seen that in the laminated film of the present invention, there was no contamination of the copper terminals, there was little seepage of the adhesive, and the adhesion between the PI films was good.
This shows that A has sufficient flow characteristics, and F
The mold releasability from PC and press plate was good for both PP and PMP.
Claims (1)
合樹脂であり、中間層をはさむ上下層がポリプロピレン
又はポリメチルペンテンを用いることを特徴とするプリ
ントサーキットラミネート工程用離型多層フィルム。(1) A release multilayer film for printed circuit lamination processes, characterized in that the intermediate layer is made of a copolymer resin of ethylene and methyl methacrylate, and the upper and lower layers sandwiching the intermediate layer are made of polypropylene or polymethylpentene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17266688A JP2659404B2 (en) | 1988-07-13 | 1988-07-13 | Release multilayer film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17266688A JP2659404B2 (en) | 1988-07-13 | 1988-07-13 | Release multilayer film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0224139A true JPH0224139A (en) | 1990-01-26 |
| JP2659404B2 JP2659404B2 (en) | 1997-09-30 |
Family
ID=15946120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17266688A Expired - Lifetime JP2659404B2 (en) | 1988-07-13 | 1988-07-13 | Release multilayer film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2659404B2 (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02175247A (en) * | 1988-12-28 | 1990-07-06 | Mitsui Petrochem Ind Ltd | Release film composed of laminate |
| JPH02310990A (en) * | 1989-05-25 | 1990-12-26 | Nippon Pillar Packing Co Ltd | Pressure sheet for adhering cover lay film |
| JP2002079630A (en) * | 2000-06-28 | 2002-03-19 | Sumitomo Bakelite Co Ltd | Mold release multilayered film and cover lay molding method |
| JP2002225190A (en) * | 2001-02-05 | 2002-08-14 | Nitto Denko Corp | Release sheet material for pressure-sensitive adhesive sheet and pressure-sensitive adhesive sheet having the release sheet material |
| WO2005030466A1 (en) * | 2003-09-30 | 2005-04-07 | Sekisui Chemical Co., Ltd. | Multi-layer sheet |
| JPWO2005002850A1 (en) * | 2003-07-01 | 2006-08-10 | 住友ベークライト株式会社 | Release film and flexible printed wiring board manufacturing method using the same |
| JP2006278688A (en) * | 2005-03-29 | 2006-10-12 | Sumitomo Bakelite Co Ltd | Cushioning material, and method for manufacturing wiring plate |
| US7815560B2 (en) | 2005-09-26 | 2010-10-19 | Hitachi Koki Co., Ltd. | Centrifuge having pivotally supported door |
| US20100282412A1 (en) * | 2009-05-09 | 2010-11-11 | Dohe Dieter | Method of making a protective film |
| JP2012135935A (en) * | 2010-12-27 | 2012-07-19 | Sumitomo Bakelite Co Ltd | Mold release film |
| CN112063327A (en) * | 2019-06-11 | 2020-12-11 | 上海膜太新材料科技有限公司 | Co-extrusion PET (polyethylene terephthalate) protective film with high transparency and no crystal point |
-
1988
- 1988-07-13 JP JP17266688A patent/JP2659404B2/en not_active Expired - Lifetime
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02175247A (en) * | 1988-12-28 | 1990-07-06 | Mitsui Petrochem Ind Ltd | Release film composed of laminate |
| JPH02310990A (en) * | 1989-05-25 | 1990-12-26 | Nippon Pillar Packing Co Ltd | Pressure sheet for adhering cover lay film |
| JP2002079630A (en) * | 2000-06-28 | 2002-03-19 | Sumitomo Bakelite Co Ltd | Mold release multilayered film and cover lay molding method |
| JP2002225190A (en) * | 2001-02-05 | 2002-08-14 | Nitto Denko Corp | Release sheet material for pressure-sensitive adhesive sheet and pressure-sensitive adhesive sheet having the release sheet material |
| JP2009073195A (en) * | 2003-07-01 | 2009-04-09 | Sumitomo Bakelite Co Ltd | Mold release film and process for producing flexible printed wiring board therewith |
| JPWO2005002850A1 (en) * | 2003-07-01 | 2006-08-10 | 住友ベークライト株式会社 | Release film and flexible printed wiring board manufacturing method using the same |
| JPWO2005030466A1 (en) * | 2003-09-30 | 2006-12-07 | 積水化学工業株式会社 | Multilayer sheet |
| KR100808763B1 (en) * | 2003-09-30 | 2008-02-29 | 세키스이가가쿠 고교가부시키가이샤 | Multi-Layer Sheet |
| WO2005030466A1 (en) * | 2003-09-30 | 2005-04-07 | Sekisui Chemical Co., Ltd. | Multi-layer sheet |
| JP2006278688A (en) * | 2005-03-29 | 2006-10-12 | Sumitomo Bakelite Co Ltd | Cushioning material, and method for manufacturing wiring plate |
| US7815560B2 (en) | 2005-09-26 | 2010-10-19 | Hitachi Koki Co., Ltd. | Centrifuge having pivotally supported door |
| US20100282412A1 (en) * | 2009-05-09 | 2010-11-11 | Dohe Dieter | Method of making a protective film |
| JP2012135935A (en) * | 2010-12-27 | 2012-07-19 | Sumitomo Bakelite Co Ltd | Mold release film |
| CN112063327A (en) * | 2019-06-11 | 2020-12-11 | 上海膜太新材料科技有限公司 | Co-extrusion PET (polyethylene terephthalate) protective film with high transparency and no crystal point |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2659404B2 (en) | 1997-09-30 |
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