JPH0224491U - - Google Patents
Info
- Publication number
- JPH0224491U JPH0224491U JP10298788U JP10298788U JPH0224491U JP H0224491 U JPH0224491 U JP H0224491U JP 10298788 U JP10298788 U JP 10298788U JP 10298788 U JP10298788 U JP 10298788U JP H0224491 U JPH0224491 U JP H0224491U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- heating chip
- lead terminals
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims 2
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
図面は本考案の一実施例を示すもので、第１図
は要部の縦断側面図、第２図は全体の破断正面図
、第３図は全体の破断側面図、第４図は加熱チツ
プの正面図、第５図は同側面図、第６図は従来構
成を示す第１図相当図である。
図面中、１９は加熱チツプ、１９ｂは加熱辺部
（先端部）、１９ｃは面取り部、２０はプリント
配線基板、２１はコネクタ、２２はリード端子を
示す。
The drawings show one embodiment of the present invention, in which Fig. 1 is a longitudinal sectional side view of the main part, Fig. 2 is an overall cutaway front view, Fig. 3 is an overall cutaway side view, and Fig. 4 is a heating chip. 5 is a side view of the same, and FIG. 6 is a view corresponding to FIG. 1 showing the conventional configuration. In the drawings, 19 is a heating chip, 19b is a heating side (tip), 19c is a chamfered portion, 20 is a printed wiring board, 21 is a connector, and 22 is a lead terminal.
Claims (1)
田付けするものにおいて、上下方向に移動可能に
設けられ前記プリント配線基板に前記リード端子
をその上から押え付けて加熱する加熱チツプを備
え、この加熱チツプの先端部に面取り部を形成し
たことを特徴とする半田付け装置。 The device for soldering the lead terminals of a connector to a printed wiring board includes a heating chip that is movable in the vertical direction and presses and heats the lead terminals on the printed wiring board from above, and a tip of the heating chip is provided. A soldering device characterized in that a chamfered portion is formed on the portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10298788U JPH0224491U (en) | 1988-08-03 | 1988-08-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10298788U JPH0224491U (en) | 1988-08-03 | 1988-08-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0224491U true JPH0224491U (en) | 1990-02-19 |
Family
ID=31333397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10298788U Pending JPH0224491U (en) | 1988-08-03 | 1988-08-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0224491U (en) |
-
1988
- 1988-08-03 JP JP10298788U patent/JPH0224491U/ja active Pending